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CN-121403225-B - Adjustable semiconductor material grinding equipment and grinding method

CN121403225BCN 121403225 BCN121403225 BCN 121403225BCN-121403225-B

Abstract

The invention discloses an adjustable semiconductor material grinding device and a use method thereof, and relates to the technical field of semiconductor grinding. The invention aims at solving the problems of the prior optical fiber grinder by improving the following steps that 1, a plurality of grinding disks are arranged, each working procedure corresponds to one grinding disk and is respectively a coarse-granularity grinding disk, a medium-granularity grinding disk, a fine-granularity grinding disk and a superfine-granularity grinding disk, 2, based on the improvement 1, the grinding disks are sequentially switched from coarse to fine by adopting an adjustable automatic mode, manual participation is not needed in the process, the grinding progress is accelerated due to frequent replacement of the grinding disks and the process of cleaning the grinding disks in the process of replacing the grinding disks, meanwhile, the working procedures correspond to the respective grinding disks, the condition of sharing the grinding disks does not exist, and the problem that the production of the next working procedure is influenced due to insufficient cleaning is avoided.

Inventors

  • YIN JIANFENG
  • TIAN JUNHONG

Assignees

  • 上海立伟佳机械有限公司

Dates

Publication Date
20260505
Application Date
20251217

Claims (7)

  1. 1. An adjustable semiconductor material grinding device comprises a base (1) and an optical fiber chuck (2) arranged above the base, and is characterized in that a grinding disc main frame (3) is arranged in the base (1), at least two grinding disc assemblies (4) are arranged on the grinding disc main frame (3), and a plurality of the grinding disc assemblies (4) are sequentially stacked up and down when in operation; the grinding disc assembly (4) is provided with a sliding seat bulge (40), the grinding disc main frame (3) is provided with a guide chute corresponding to the sliding seat bulge (40), and the guide chute is of a 'return' structure and sequentially comprises a working vertical groove (41), a lower grinding disc assembly leading-out horizontal groove (42), a lifting vertical groove (43) and an upper grinding disc assembly leading-in horizontal groove (44); a guiding-out driving piece (30), a lifting driving piece (31) and a guiding-in driving piece (32) are arranged in the grinding disc main frame (3); the guiding-out driving piece (30) is in an arc-shaped structure and is driven by a rotary disc (5) below the guiding-out driving piece, and the rotary disc (5) is positioned in the grinding disc main frame (3); The top of the guiding-out driving piece (30) is provided with a guiding-out driving protrusion (300), a lower ring sliding rail (33) is arranged in the grinding disc main frame (3), the lower ring sliding rail (33) is of an inner-outer double sliding rail structure, the top of the guiding-out driving piece (30) is positioned at the bottom of the lower ring sliding rail (33), the guiding-out driving protrusion (300) is positioned between the inner-outer double sliding rail structure, and the top of the guiding-out driving protrusion protrudes upwards; The guiding driving piece (32) is of an arc-shaped block structure with a pushing protrusion (80), and slides on an upper ring sliding rail (34) in the grinding disc main frame (3) and is driven by a guiding stay rope (81); Along with deriving driving piece (30) rotation, through braking portion two (8) pulling import stay cord (81), import driving piece (32) through reset spring (82) with abrasive disc body frame (3) inner wall connection, braking portion two (8) include: The fluted disc (83) is coaxially arranged with the turntable (5) through a connecting shaft (84), and an outer wall of the fluted disc (83) is provided with a convex arc-shaped tooth wall structure (830); the gear wire coil assembly (85) is composed of a gear (850) and a wire coil (851) which are coaxial, the gear (850) is meshed with the tooth wall structure (830), and the lead-in pull rope (81) is wound on the wire coil (851).
  2. 2. An adjustable semiconductor material grinding apparatus according to claim 1, wherein the grinding disc main frame (3) has a cylindrical structure, and the slider protrusion (40) has a T-shaped structure, which includes a horizontal connection portion (400) and an arcuate outer edge (401), and the width and length of the horizontal connection portion (400) are smaller than the width and length of the arcuate outer edge (401).
  3. 3. An adjustable semiconductor material grinding apparatus according to claim 1, wherein the lead-out drive (30) and the lead-in drive (32) are driven by a rotary motor, and the lift drive (31) is driven by a vertical linear drive.
  4. 4. An adjustable semiconductor material grinding apparatus according to claim 1, characterized in that the bottom of the lower ring slide rail (33) is provided with a disengaging slide table (334), the disengaging slide table (334) is located below the lifting drive (31), the deriving drive protrusion (300) is disengaged from the lowest grinding disc assembly (4) when the deriving drive (30) slides along the disengaging slide table (334), and the grinding disc assembly (4) is located on the lifting drive (31); The lifting driving piece (31) is of a block structure and slides along the lifting vertical groove (43), and the lifting driving piece (31) is driven by a screw rod (6).
  5. 5. An adjustable semiconductor material grinding apparatus according to claim 4, wherein the screw (6) is driven to rotate by a first brake (7) as the lead-out driving member (30) rotates, the first brake (7) comprising: a brake boss (70) provided on the inner side wall of the guide-out driving member (30); The stay wire sliding block (71) slides in the grinding disc main frame (3) through an L-shaped sliding rail (710) and is braked and slid by the brake boss (70), and when the stay wire sliding block slides to the end part of the L-shaped sliding rail (710), the stay wire sliding block is positioned through a positioning protrusion (711) which can be protruded to the inner wall of the L-shaped sliding rail (710) in a protruding way; the stay wire collecting roller (72) is fixedly sleeved on the outer wall of the screw (6) and is connected with the stay wire sliding block (71) through a stay wire (73), and a torsion spring (74) is arranged on the outer wall of the stay wire collecting roller (72); When the stay wire sliding block (71) slides by the braking boss (70), the stay wire (73) is used for braking the rotation of the screw rod (6), the lifting driving piece (31) is driven to move to the top along the lifting vertical groove (43), the positioning protrusion (711) is used for positioning the stay wire sliding block (71), and the torsion spring (74) stores force.
  6. 6. An adjustable semiconductor material grinding apparatus according to claim 1, wherein the lower ring slide rail (33) is provided with a locking position, the locking position is located right below the working vertical groove (41) and is provided with a locating pin (330), and the bottom of the grinding disc assembly (4) is provided with a locating hole corresponding to the locating pin (330); The bottom of the locating pin (330) is connected with a driving protrusion (331) which is horizontally arranged through a connecting rib, a driving guide groove corresponding to the driving protrusion is formed in the outer wall of the guiding-out driving piece (30), the driving guide groove comprises a lower extending sliding groove (332) and a flat sliding groove (333), and the projection length of the driving guide groove is identical to the arc length of the outer wall of the guiding-out driving piece (30).
  7. 7. A method of using a conditioning semiconductor material grinding apparatus of claim 1, comprising the steps of: The guiding-out driving piece (30) rotates along the grinding disc main frame (3) and is used for sliding the grinding disc assembly (4) positioned below along the guiding-out horizontal groove (42) of the lower grinding disc assembly until the grinding disc assembly falls above the lifting driving piece (31); The lifting driving piece (31) slides along the lifting vertical groove (43) and is used for conveying the grinding disc assembly (4) above the lifting driving piece upwards into the upper grinding disc assembly leading-in horizontal groove (44); The leading-in driving piece (32) rotates along the upper grinding disc assembly leading-in horizontal groove (44) and is used for conveying the grinding disc assembly (4) of the upper grinding disc assembly leading-in horizontal groove (44) to the top of the working vertical groove (41).

Description

Adjustable semiconductor material grinding equipment and grinding method Technical Field The invention relates to the technical field of semiconductor grinding, in particular to an adjustable semiconductor material grinding device and a grinding method. Background Semiconductor materials are a class of electronic materials having semiconductor properties (conductivity between conductors and insulators) that can be used to fabricate semiconductor devices and integrated circuits, such as silicon wafers, are the core raw materials and physical carriers in the fabrication of semiconductor integrated circuits, which are composed of thin disk-like substrate materials made of high purity single crystal silicon. The grinding process of the silicon wafer is a key link for realizing high-precision processing of the material surface in the silicon wafer manufacturing, and aims to remove a damaged layer on the material surface, realize thickness control or obtain ultra-high flatness, and lay a foundation for the subsequent photoetching, etching and other processes. The optical fiber grinder is a representative one in the semiconductor material grinding equipment, especially for the silicon wafer processing, and can be generally divided into four stages of coarse grinding, medium grinding, fine grinding and polishing according to the end face precision requirement, so as to gradually replace grinding sheets with finer granularity. Rough grinding is to remove burrs and smooth end surfaces, i.e. coarse-grain grinding sheets (such as 120# or 320 #) are arranged on a grinding disc. The middle grinding is to refine the end surface roughness and replace the middle grinding sheet (such as 600# or 800 #). The fine grinding is to improve the finish of the end face and replace the fine grinding sheet (such as 1200# or 1500# for example). Polishing is to realize a mirror effect, and replace a superfine grinding sheet (such as 2000# or more) or a polishing sheet (such as a diamond polishing film). Therefore, when the conventional optical fiber grinder is used, the conventional optical fiber grinder shares one grinding disc, and the grinding disc needs to be frequently replaced according to the use requirement, so that the grinding progress is slow, and the grinding disc after the replacement of the grinding disc needs to be cleaned, so that the influence on the next process is avoided. Disclosure of Invention The invention aims to solve the problems that one grinding disc is shared and grinding sheets on the grinding disc need to be replaced in each working procedure in the prior art, and provides an adjustable semiconductor material grinding device and a grinding method. The adjustable semiconductor material grinding equipment comprises a base and an optical fiber chuck arranged above the base, wherein a grinding disc main frame is arranged in the base, at least two grinding disc assemblies are arranged on the grinding disc main frame, a plurality of grinding disc assemblies are sequentially stacked up and down during operation, a sliding seat bulge is arranged on the grinding disc assembly, a guide sliding groove corresponding to the sliding seat bulge is arranged on the grinding disc assembly, the guide sliding groove is of a 'back' type structure and sequentially comprises a working vertical groove, a lower grinding disc assembly guide horizontal groove, a lifting vertical groove and an upper grinding disc assembly guide horizontal groove, and a guide driving piece, a lifting driving piece and a guide driving piece are arranged in the grinding disc main frame. When the adjustable semiconductor material grinding equipment is used, the guiding-out driving piece rotates along the grinding disc main frame and is used for sliding the grinding disc assembly positioned below along the guiding-out horizontal groove of the lower grinding disc assembly until the lower grinding disc assembly falls above the lifting driving piece, the lifting driving piece slides along the lifting vertical groove and is used for conveying the grinding disc assembly above the lifting driving piece upwards into the guiding-in horizontal groove of the upper grinding disc assembly, and the guiding-in driving piece rotates along the grinding disc main frame and is used for conveying the grinding disc assembly of the upper grinding disc assembly, which is guided into the horizontal groove, to the top of the working vertical groove. Preferably, the grinding disc main frame is of a cylindrical structure, the sliding seat protrusion is of a T-shaped structure and comprises a horizontal connecting portion and an arc-shaped outer edge, and the width and the length of the horizontal connecting portion are smaller than those of the arc-shaped outer edge. Preferably, the lead-out drive and the lead-in drive are driven by a rotary motor, and the lift drive is driven by a vertical linear drive. Preferably, the guiding-out driving piece is in an arc-shaped structure and is