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CN-121423299-B - Automatic cleaning equipment and cleaning process for wafer

CN121423299BCN 121423299 BCN121423299 BCN 121423299BCN-121423299-B

Abstract

The invention relates to the technical field of semiconductors, and particularly provides automatic wafer cleaning equipment and a wafer cleaning process. The automatic cleaning equipment for the wafer comprises a cleaning tank, a cassette and a spraying mechanism. The cleaning device comprises a cleaning tank, a clamping box, a plurality of wafers, at least one rotary table, a spraying rod, a rotatable first rotary rod and a rotatable second rotary rod, wherein the clamping box is arranged in the cleaning tank, the wafers and the rotary table are arranged in the clamping box, the end face of the rotary table is provided with a plurality of water hoppers, when the spraying rod of the spraying mechanism rotates to the upper part of the clamping box, the cleaning liquid is sprayed to the clamping box, the two sides of the bottom of the clamping box are respectively provided with the rotatable first rotary rod and the rotatable second rotary rod, the side edges of each rotary table and each wafer are in friction connection with the first rotary rod and the second rotary rod, and the rotary table rotates under the impact of the cleaning liquid sprayed by the spraying mechanism, so that the first rotary rod and the second rotary rod are driven to rotate, and the wafers are driven to rotate. According to the scheme provided by the invention, the cleaning liquid is used for impacting the water bucket to enable the turntable to rotate, and the first rotating rod and the second rotating rod drive the wafer to rotate, so that the cleaning blind area is eliminated, and the cleaning effect is improved.

Inventors

  • TANG GUANGPU

Assignees

  • 湖南米特半导体技术有限公司

Dates

Publication Date
20260508
Application Date
20251230

Claims (9)

  1. 1. An automated cleaning apparatus for wafers, comprising: A cleaning tank, the top end of which is open, the bottom is provided with a liquid outlet; the wafer cleaning device comprises a cleaning tank, a clamping box, a plurality of water hoppers, a plurality of water tanks, a plurality of water storage tanks and a plurality of water storage tanks, wherein the cleaning tank is internally provided with a plurality of separation fins at intervals, the separation fins form a plurality of vertical slots, and the slots are used for placing wafers or turntables; The spraying mechanism comprises a pump body and a rotatable spraying rod connected with the pump body, wherein when the spraying rod rotates to the upper part of the cartridge, the cleaning liquid is sprayed to the cartridge; The two sides of the bottom of the clamping box are respectively provided with a first rotary rod and a second rotary rod which can rotate, and the side edges of each rotary table and each wafer are in friction connection with the first rotary rod and the second rotary rod; The size of the turntable is consistent with that of the wafer, and the turntable rotates under the impact of cleaning liquid sprayed by the spraying mechanism, so that the first rotating rod and the second rotating rod are driven to rotate, and the wafer is driven to rotate; the first rotating rod and the second rotating rod are respectively provided with a plurality of fixed friction wheels and a plurality of rotatable driven wheels in a staggered manner, the friction wheels on the first rotating rod are opposite to the driven wheels on the second rotating rod one by one, and the driven wheels on the first rotating rod are opposite to the friction wheels on the second rotating rod one by one; each friction wheel and each driven wheel are opposite to one slot and are abutted with the wafer or the turntable placed in the opposite slot; At least two turntables are placed in the cassette, and the number of wafers between any two adjacent turntables is even.
  2. 2. The automated cleaning apparatus of claim 1, wherein the tread of the friction wheel is provided with friction lines and the tread of the driven wheel is smooth.
  3. 3. The automated wafer cleaning apparatus of claim 1, wherein the rotational directions of any two adjacent turntables are opposite.
  4. 4. The automated wafer cleaning apparatus according to claim 1, wherein a support bar is further provided at a bottom of the cassette, the support bar being located between the first and second rotating bars, and a plurality of rotatable support wheels are provided on the support bar for supporting the wafer or the turntable.
  5. 5. The automated wafer cleaning apparatus of claim 1, wherein a baffle is disposed above the turntable, the bottom of the baffle being formed with an arcuate opening that fits the shape of the turntable; the partition plate is inserted into the slot where the turntable is located, and the width of the partition plate is larger than the diameter of the turntable.
  6. 6. The automatic wafer cleaning device according to claim 5, wherein clamping grooves are formed in the side edges of the rotary plate, clamping strips corresponding to the clamping grooves are arranged at the openings, annular sliding grooves are formed in the end faces of the rotary plate, connecting rods are fixedly arranged on the partition plates, sliding columns are arranged at the end portions of the connecting rods, and the sliding columns extend into the sliding grooves.
  7. 7. The automated cleaning apparatus of claim 1, further comprising: The clamping mechanism comprises a bracket and a clamping jaw which can move in a telescopic way relative to the bracket, and is used for placing the cassette into the cleaning tank or taking the cassette out of the cleaning tank.
  8. 8. The automated cleaning apparatus of claim 1, wherein the dividing fin is tapered toward an edge of the cassette interior.
  9. 9. An automated cleaning process for wafers, characterized in that an automated cleaning apparatus for wafers according to any one of claims 1 to 8 is used, comprising the steps of: Controlling a spray rod of a spray mechanism to rotate to a position avoiding the cleaning tank; placing a cassette with a wafer and a turntable in the cleaning tank; and controlling the spray rod to rotate to the upper part of the cartridge and spraying cleaning liquid to the cartridge.

Description

Automatic cleaning equipment and cleaning process for wafer Technical Field The invention relates to the technical field of semiconductors, in particular to automatic wafer cleaning equipment and cleaning technology. Background Wafers are the base material for the manufacture of semiconductor devices and are typically round thin sheets of high purity monocrystalline silicon. In the wafer preparation process, wafer cleaning is a key link for ensuring the manufacturing quality and performance of chips. In the existing wafer cleaning technology, trough cleaning or spray cleaning is often adopted. The tank cleaning is used for simultaneously cleaning a plurality of wafers by using one tank liquid medicine, although the cleaning efficiency can be improved, if the pollutant of one wafer exceeds the standard in the cleaning process, the pollutant can be laterally diffused, so that the whole batch of wafers are completely polluted and even scrapped, and serious loss is caused. In addition, in the tank type soaking and cleaning, the wafer is taken out and passes through the liquid level of suspended particles, so that secondary adhesion of the particles is easy to occur, and secondary pollution is caused. The spraying cleaning is under the action of gravity and surface tension, the cleaning liquid is easy to be converged into fixed streams on the wafer, so that wetting blind areas among the streams are generated, the longitudinal gradient of the distribution of the cleaning liquid is obvious, and the wafer is difficult to be uniformly covered. In addition, during static flushing, the cleaning liquid also easily forms a water-blocking layer on the microstructure or contact point of the wafer surface, so that the cleaning liquid is retained, and the cleaning effect is affected. Disclosure of Invention The invention aims to eliminate the cleaning blind area of the wafer and improve the cleaning effect. Another object of the invention is to reduce the risk of secondary contamination of the wafer during cleaning. The invention provides automatic cleaning equipment for wafers, which comprises a cleaning tank, a clamping box and a spraying mechanism, wherein the top end of the cleaning tank is opened, a liquid outlet is formed in the bottom of the cleaning tank, the clamping box is placed in the cleaning tank, a plurality of separation fins are arranged in the clamping box at intervals to form a plurality of vertical slots, the slots are used for placing the wafers or the rotating plates, the plurality of wafers and at least one rotating plate are placed in the clamping box, a plurality of water hoppers are arranged on the end face of the rotating plate, the water hoppers are arranged along the radial direction of the rotating plate and are uniformly distributed along the circumferential direction of the rotating plate, the spraying mechanism comprises a pump body and rotatable spraying rods connected with the pump body, when the spraying rods rotate to the position above the clamping box, rotatable first rotating rods and second rotating rods are respectively arranged on two sides of the bottom of the clamping box, the side edges of each rotating plate and each wafer are in friction connection with the first rotating rods and the second rotating rods, the size of the rotating plate is consistent with the size of the wafers, and the rotating plate rotates under the impact of the cleaning solution sprayed by the rotating rods, so that the first rotating rods and the second rotating rods are driven to rotate. Further, a plurality of fixed friction wheels and a plurality of rotatable driven wheels are arranged on the first rotating rod and the second rotating rod in a staggered mode, the friction wheels on the first rotating rod are opposite to the driven wheels on the second rotating rod one by one, the driven wheels on the first rotating rod are opposite to the friction wheels on the second rotating rod one by one, each friction wheel is opposite to one slot and is abutted to a wafer or a turntable placed in the opposite slot, at least two turntables are placed in the cassette, and the number of the wafers between any two adjacent turntables is even. Further, the wheel surface of the friction wheel is provided with friction lines, and the wheel surface of the driven wheel is smooth. Further, the rotation directions of any two adjacent turntables are opposite. Furthermore, a supporting rod is arranged at the bottom of the clamping box and is positioned between the first rotating rod and the second rotating rod, and a plurality of rotatable supporting wheels are arranged on the supporting rod and are used for supporting wafers or turntables. Further, a baffle plate is arranged above the turntable, an arc-shaped opening matched with the shape of the turntable is formed at the bottom of the baffle plate, the baffle plate is inserted into a slot where the turntable is positioned, and the width of the baffle plate is larger than