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CN-121510989-B - Hot plate lifting mechanism and de-bonding device

CN121510989BCN 121510989 BCN121510989 BCN 121510989BCN-121510989-B

Abstract

The invention belongs to the technical field of semiconductor material processing equipment, and discloses a hot plate lifting mechanism and a bonding-releasing device. The bonding unlocking device comprises two heating plates and a heating plate lifting mechanism which are oppositely arranged, a body to be bonded is positioned between the two heating plates, and one side, away from the body to be bonded, of one heating plate is fixed on the heating plate lifting mechanism. This hot plate elevating system includes the main support frame, set up the lifter plate on the main support frame, set up at least a set of connecting piece between lifter plate and mount pad, every group includes at least three connecting piece, the same just department of lifter plate center with the connecting piece of group is the circumference and evenly arranges, the heating plate is fixed on the mount pad, when the relative main support frame of driver assembly drive lifter plate goes up and down, can drive mount pad and heating plate and go up and down in the lump, in order to apply pretension pressure to waiting to separate the bonding body, owing to the design of connecting piece, help improving the pressure transmission homogeneity between lifter plate and the mount pad, prevent to wait to separate the damage that the bonding body leads to because of pretension pressure inequality.

Inventors

  • CAO NINGFEI
  • GAO ZHIWEI
  • MU FENGWEN
  • TAN XIANGHU

Assignees

  • 天津中科晶禾电子科技有限责任公司

Dates

Publication Date
20260508
Application Date
20260114

Claims (8)

  1. 1. The hot plate lifting mechanism is characterized by comprising a main support frame (1), a driving assembly (2), a lifting plate (3), a mounting seat (4) and a connecting piece (5), wherein the main support frame (1) is in sliding connection with the lifting plate (3), the mounting seat (4) is connected with the lifting plate (3) through the connecting piece (5), and the mounting seat (4) is used for fixing a heating plate of a bonding releasing device; The driving assembly (2) is fixed at the center of the main support frame (1) and is connected with the lifting plate (3) and is used for driving the lifting plate (3) and the mounting seat (4) to lift, wherein each group of connecting pieces (5) is provided with at least one group, each group of connecting pieces (5) comprises at least three connecting pieces (5), and the connecting pieces (5) in the same group are uniformly distributed in a circle with the center of the lifting plate (3) as the center of the circle; at least one group of connecting pieces (5) is a first connecting piece, and the first connecting piece is a force sensor (51) for detecting pressure or a contour connecting column for transmitting pressure; The hot plate lifting mechanism is characterized in that at least two groups of connecting pieces (5) are arranged, at least one group of connecting pieces (5) is a second connecting piece (52), the hot plate lifting mechanism further comprises an elastic piece (6) corresponding to the second connecting piece (52), one end of the second connecting piece (52) is fixed to the mounting seat (4), the second connecting piece (52) slidably penetrates through the lifting plate (3), and the elastic piece (6) is arranged between the other end of the second connecting piece (52) and the lifting plate (3).
  2. 2. The hot plate lifting mechanism according to claim 1, wherein the lifting plate (3) is embedded and fixed with a first guide sleeve (31), the first guide sleeve (31) corresponds to the second connecting piece (52) one by one and is in sliding fit, and the elastic piece (6) is arranged between the other end of the second connecting piece (52) and the first guide sleeve (31).
  3. 3. The hot plate lifting mechanism according to claim 2, characterized in that a first detachable intermediate sleeve (33) is arranged inside the first guide sleeve (31), and the first guide sleeve (31) is in sliding fit with the corresponding second connecting piece (52) through the first intermediate sleeve (33); And/or the distance between the first connection piece and the centre of the lifting plate (3) is equal to the distance between the second connection piece (52) and the centre of the lifting plate (3).
  4. 4. The hot plate lifting mechanism according to claim 2, wherein the second connecting piece (52) comprises a connecting rod (521), a mounting screw (522) and a fastening screw (523), one end of the connecting rod (521) is fixed on the mounting seat (4) through the fastening screw (523), one end of the mounting screw (522) abuts against the elastic piece (6) on the first guide sleeve (31), and the other end of the mounting screw (522) is in threaded connection with the other end of the connecting rod (521).
  5. 5. A hot plate lifting mechanism according to claim 2, characterized in that the elastic member (6) is a coil spring with a rectangular or square cross section.
  6. 6. A hotplate lifting mechanism according to any one of claims 1-5, characterized in that the drive assembly (2) comprises a motor (21) and a ball screw (22), the motor (21) being fixed to the main support (1), the motor (21) being connected to the lifting plate (3) centrally by means of the ball screw (22).
  7. 7. The hot plate lifting mechanism according to any one of claims 1 to 5, wherein the main support frame (1) comprises a support rod (12) and two support plates (11), the two support plates (11) are arranged at intervals and are connected through the support rod (12), a second guide sleeve (32) is embedded and fixed on the lifting plate (3), the second guide sleeve (32) is slidably sleeved on the support rod (12), and the lifting plate (3) is slidably limited between the two support plates (11).
  8. 8. The bonding-releasing device is characterized by comprising two heating plates which are oppositely arranged and a heating plate lifting mechanism as claimed in any one of claims 1-7, wherein a body to be bonded is placed between the two heating plates, and one side, away from the body to be bonded, of one heating plate is fixed on the heating plate lifting mechanism.

Description

Hot plate lifting mechanism and de-bonding device Technical Field The invention relates to the technical field of semiconductor material processing equipment, in particular to the technical field of bonding, and specifically relates to a hot plate lifting mechanism and a bonding-releasing device. Background In the process of bonding release, the to-be-bonded body is firstly placed on the lower heating disc, a vertical lifting mechanism is arranged above the lower heating disc, the vertical lifting mechanism drives the upper heating disc to descend and heat the to-be-bonded body, a pre-tightening pressure is provided, and the pre-tightening pressure can prevent the to-be-bonded body from displacing relative to the upper heating disc and the lower heating disc due to external vibration. In the prior art, the vertical lifting mechanism drives the upper heating plate in a central shaft driving mode, and when the upper heating plate props against the body to be unbound on the lower heating plate, the pre-pressing force applied to the body to be unbound is naturally concentrated at one place, so that the body to be unbound is easy to damage. Therefore, it is needed to provide a thermal disc lifting mechanism and a bonding releasing device, so as to improve the uniformity of the pre-tightening pressure and prevent the body to be bonded from being damaged due to uneven pre-tightening pressure. Disclosure of Invention The invention aims to provide a hot plate lifting mechanism and a bonding releasing device, which are used for improving the uniformity of pre-tightening pressure and preventing a body to be bonded from being damaged due to uneven pre-tightening pressure. To achieve the purpose, the invention adopts the following technical scheme: The invention provides a hot plate lifting mechanism which comprises a main support, a driving assembly, a lifting plate, a mounting seat and a connecting piece, wherein the main support is in sliding connection with the lifting plate; The driving assembly is fixed at the main support frame and is connected with the center of the lifting plate and used for driving the lifting plate and the mounting seat to lift, at least one group of connecting pieces are arranged, each group of connecting pieces comprises at least three connecting pieces, and the connecting pieces in the same group are uniformly distributed in a circumference mode by taking the center of the lifting plate as the center of a circle. As an alternative technical scheme of the hot plate lifting mechanism, at least one group of connecting pieces are first connecting pieces, and the first connecting pieces are force sensors for detecting pressure or equal-height connecting columns for transmitting pressure. As an alternative technical scheme of hot plate elevating system, the connecting piece is equipped with two at least groups, and at least one set of connecting piece is the second connecting piece, hot plate elevating system still include with at least three elastic component that the second connecting piece corresponds, second connecting piece one end is fixed in the mount pad, the second connecting piece passes with sliding the lifter plate, the elastic component set up in the second connecting piece other end with between the lifter plate. As an alternative technical scheme of a hot plate lifting mechanism, the lifting plate is embedded and fixed with a first guide sleeve, the first guide sleeve is in one-to-one correspondence with the second connecting piece and is in sliding fit with the second connecting piece, and the elastic piece is arranged between the other end of the second connecting piece and the first guide sleeve. As an alternative technical scheme of the hot plate lifting mechanism, a detachable first middle sleeve is arranged on the inner side of the first guide sleeve, and the first guide sleeve is in sliding fit with the corresponding second connecting piece through the first middle sleeve; And/or the distance between the first connecting piece and the center of the lifting plate is equal to the distance between the second connecting piece and the center of the lifting plate. As an optional technical scheme of hot plate elevating system, the second connecting piece includes connecting rod, mounting screw and fastening screw, connecting rod one end is passed through fastening screw is fixed in the mount pad, mounting screw one end supports presses the elastic component in on the first uide bushing, the mounting screw other end with connecting rod other end threaded connection. As an alternative technical scheme of the hot plate lifting mechanism, the elastic piece is a spiral spring with a rectangular or square cross section. As an alternative technical scheme of the hot plate lifting mechanism, the driving assembly comprises a motor and a ball screw, the motor is fixed on the main support frame, and the motor is connected with the center of the lifting plate through the ball screw. As an alt