CN-121547975-B - Circuit printing method and circuit using wire bonding

Abstract

The application provides a circuit printing method and a circuit using wire bonding, wherein the method comprises the steps of printing nano conductive paste on the surface of a glass substrate to form a pin pad and a circuit bonding point, performing tempering treatment on the glass substrate printed with the pin pad and the circuit bonding point to form a sintered conductive layer on the glass substrate, coating solder paste on the pin pad and the circuit bonding point of the sintered conductive layer, attaching an electronic component to the solder paste of the pin pad, and performing reflow soldering to obtain the attached conductive layer, and using a wire bonding process to complete electrical connection of the electronic component and the circuit bonding point by using a metal wire as a wire to form the circuit printed on the glass substrate. The circuit printed on the glass substrate has the advantages of high welding strength, high light transmittance, high environmental protection degree and low manufacturing cost.

Inventors

• ZHANG XIANGZHONG
• ZHOU CHAOWEI
• ZHANG SHULI

Assignees

• 福建杰格若科技有限公司

Dates

Publication Date

20260508

Application Date

20260116

Claims (9)

1. 1. A method of circuit printing using wire bonding, comprising: Printing nano conductive paste on the surface of a glass substrate to form a pin bonding pad and a line bonding point; Tempering the glass substrate printed with the pin bonding pads and the circuit bonding points to form a sintered conductive layer on the glass substrate; Coating solder paste on the pin bonding pads and the circuit bonding points of the sintered conductive layer; Attaching the electronic component to the solder paste of the pin bonding pad, and performing reflow soldering to obtain an attached conducting layer; Using a wire bonding process and using a metal wire as a lead to complete the electrical connection between the electronic component and the circuit bonding point so as to form a circuit printed on the glass substrate; The implementation process of the wire bonding process comprises the following steps: Acquiring a horizontal span L of the first bonding point and the second bonding point and a maximum working tension T allow of the wire; Determining an initial rising height according to the horizontal span L, and predicting the maximum dynamic tension T max of the wire in the moving process from the first bonding point to the second bonding point under the initial rising height according to the preset riving knife moving track of the wire bonding machine; Adjusting the ascending height or the material diameter according to the magnitude relation between the maximum dynamic tension T max and the maximum working tension T allow until the working ascending height is obtained; And finishing wire bonding of the first bonding point and the second bonding point according to the working elevation and the preset riving knife moving track.
2. 2. The method of claim 1, wherein the applying solder paste to the pin pads and wire bond sites of the fired conductive layer comprises: And manufacturing optical alignment datum points in a non-circuit area of the glass substrate, wherein the optical alignment datum points serve as unified datum points for electronic component patches and wire bonding.
3. 3. The method according to claim 1, wherein the tempering treatment comprises heating up at a heating rate of 5-10 ℃ per minute until reaching a tempering temperature of 650-700 ℃, then preserving the heat for 10-30 minutes, and finally rapidly cooling.
4. 4. The method of claim 1, wherein the wire diameter of the power supply line in the circuit is 0.1-0.2mm and the wire diameter of the signal line is 0.05-0.1mm.
5. 5. The method of claim 1, wherein the reflow soldering comprises: preheating zone, preheating temperature is 150-180 deg.C, preheating time is 60-90 seconds; the reflux area is at the peak temperature of 240-260 ℃ and the reflux time is 30-60 seconds; And a cooling area for rapid cooling.
6. 6. The method of any one of claims 1 to 5, wherein printing the nano-conductive paste prior to the surface of the glass substrate comprises: And carrying out plasma treatment on the surface of the side, which is required to be covered with the circuit, of the glass substrate, wherein the plasma treatment adopts reaction gas containing a silane coupling agent so as to introduce active groups on the surface of the glass.
7. 7. The method according to any one of claims 1 to 5, further comprising: And coating a transparent packaging protection layer on an electric connecting line of the bonding point of the electronic component and the line, wherein the difference between the refractive index of the transparent packaging protection layer and the refractive index of the glass substrate is smaller than 0.1.
8. 8. The method of claim 1 wherein the initial rise is determined based on operating parameters of a historical wire bonding process.
9. 9. An electrical circuit printed on a glass substrate, characterized in that it is produced by the method according to any one of claims 1 to 8.

Description

Circuit printing method and circuit using wire bonding Technical Field The present application relates to the field of printed circuits, and more particularly, to a circuit printing method and circuit using wire bonding. Background The conventional methods for printing circuits on glass substrates include a copper-clad method for cladding copper on the surface of glass and then etching the circuit by laser, and a full-line sintering method for attaching beads after printing a complete bead circuit on the surface of glass, but the following defects exist: 1. the copper-clad method has lower welding strength, and is easy to lead to falling of lamp beads or line failure. 2. The circuit precision of the two is poor, the line width is larger, the circuit density and the miniaturization are limited, and the light transmittance of glass can be obviously affected by the large-area copper-clad or printed circuit. 3. The process is complex, involves etching or multiple high temperature treatments, and has high manufacturing cost and is not environment-friendly. Disclosure of Invention In order to solve the above problems in the prior art, the present application provides a circuit printing method and circuit using wire bonding, wherein the printed circuit on the glass substrate has the advantages of high soldering strength, high light transmittance, high environmental protection degree and low manufacturing cost. In order to achieve the above purpose, the application adopts the following technical scheme: In a first aspect, the present application provides a circuit printing method using wire bonding, comprising: Printing nano conductive paste on the surface of a glass substrate to form a pin bonding pad and a line bonding point; Tempering the glass substrate printed with the pin bonding pads and the circuit bonding points to form a sintered conductive layer on the glass substrate; Coating solder paste on the pin bonding pads and the circuit bonding points of the sintered conductive layer; Attaching the electronic component to the solder paste of the pin bonding pad, and performing reflow soldering to obtain an attached conducting layer; and using a wire bonding process and using a metal wire as a lead to complete the electric connection between the electronic component and the circuit bonding point so as to form a circuit printed on the glass substrate. The application has the beneficial effects that the circuit preparation method of bonding the bonding pad printing and the lead wire is adopted, so that the welding strength is kept, the diameter of the circuit is smaller than that of the prior art, the shielding of the circuit to glass is reduced, and the extremely high light transmittance is realized. In addition, all the working procedures of the application are to realize circuit preparation by adding new materials, and the working procedures of etching, cleaning, waste liquid treatment and the like are not needed, thus not only reducing the manufacturing cost, but also avoiding the environmental pollution of waste liquid, so that the circuit printed on the glass substrate has the advantages of high welding strength, high light transmittance, high environmental protection degree and low manufacturing cost. Optionally, the applying solder paste on the pin pad and the wire bonding point of the sintered conductive layer includes: And manufacturing optical alignment datum points in a non-circuit area of the glass substrate, wherein the optical alignment datum points serve as unified datum points for electronic component patches and wire bonding. According to the description, the problem of alignment accumulated errors in the processing process of multiple devices is solved by unifying the datum points, so that the production precision and the product yield are greatly improved. Optionally, the tempering treatment comprises heating according to a heating rate of 5-10 ℃ per min until reaching a tempering temperature of 650-700 ℃, then preserving heat for 10-30 minutes, and finally rapidly cooling. As can be seen from the above description, the sintering process of the nano conductive paste and the tempering heat treatment process of the glass substrate are simultaneously completed at 650-700 ℃ to form a high strength bond between the conductive layer and the glass. Optionally, the wire diameter of the power supply line in the circuit is 0.1-0.2mm, and the wire diameter of the signal line is 0.05-0.1mm. Optionally, the reflow soldering includes: preheating zone, preheating temperature is 150-180 deg.C, preheating time is 60-90 seconds; the reflux area is at the peak temperature of 240-260 ℃ and the reflux time is 30-60 seconds; And a cooling area for rapid cooling. Optionally, the printing the nano conductive paste on the surface of the glass substrate comprises: And carrying out plasma treatment on the surface of the side, which is required to be covered with the circuit, of the glass substrate, wherein the plasma trea