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CN-121548254-B - TO die bonder with small angle adjustment

CN121548254BCN 121548254 BCN121548254 BCN 121548254BCN-121548254-B

Abstract

The application relates TO the field of semiconductor packaging, in particular TO a small-angle adjustment TO (TO) die bonder, which comprises a die bonder, wherein an X-axis and a Y-axis moving mechanism are arranged on the die bonder, a working box with a material tray fixing component is arranged at the output end of the Y-axis moving mechanism, the die bonder is driven TO rotate by an angle rotating mechanism of the die bonder TO enable the top surface of a TO packaging tube seat TO be horizontal, a dispensing mechanism dispenses the TO packaging tube seat with glue, and a wafer transferring mechanism transfers a wafer TO the TO packaging tube seat after dispensing. The angle of the whole die bonding table can be actively adjusted, so that the top surfaces of TO package tube seats with different preset inclination angles are accurately corrected TO be in a horizontal state. The design solves the problem that the prior art can only fix the crystal by relying on the customized material tray with a specific angle.

Inventors

  • LI JINLONG
  • WU HOUQIANG

Assignees

  • 佑光智能半导体科技(深圳)有限公司

Dates

Publication Date
20260505
Application Date
20260119

Claims (7)

  1. 1. A small angle adjustment TO die bonder, the small angle referring TO a rotation angle of a tray (100) of less than 20 ° relative TO a horizontal plane, comprising: The device comprises a die bonding table (200), wherein an X-axis moving mechanism (210) and a Y-axis moving mechanism (220) are arranged on the die bonding table (200), the output end of the X-axis moving mechanism (210) is connected with the Y-axis moving mechanism (220), a working box (230) is arranged at the output end of the Y-axis moving mechanism (220), and a material disc fixing assembly (240) for fixing a material disc (100) is arranged in the working box (230); The output end of the die bonding table angle rotating mechanism (300) is connected with the die bonding table (200) and is used for driving the die bonding table (200) TO rotate so as TO enable the top surface of the TO packaging tube seat in the material tray (100) TO be in a horizontal state; the dispensing mechanism (400) is used for dispensing TO packaging tube seats on the material tray (100); The wafer transfer mechanism (500) is used for transferring the wafer TO the TO packaging tube seat after dispensing is completed, the wafer fixing table angle rotating mechanism (300) is a servo rotating motor, a rotating shaft of the servo rotating motor is fixedly connected with the wafer fixing table (200), and the rotating shaft is parallel TO the Y axis; Positioning grooves (231) are formed in the two inner side walls of the working box (230), the material tray (100) is connected in the positioning grooves (231) in a sliding mode, the groove walls of the positioning grooves (231) limit the upper side and the lower side of the material tray (100), and the material tray fixing assembly (240) is used for pushing the material tray (100) to enable the material tray (100) to be in butt joint with the groove walls of the positioning grooves (231); The tray fixing assembly (240) comprises a lifting mechanism (241), a connecting plate (242), a buffer piece (243) and a lifting plate (244), wherein the lifting mechanism (241) is arranged in the working box (230), the connecting plate (242) is installed at the output end of the lifting mechanism (241), one end of the buffer piece (243) is connected with the connecting plate (242), the other end of the buffer piece (243) is connected with the lifting plate (244), and the plate surface of the lifting plate (244) is opposite to the bottom surface of the tray (100).
  2. 2. The small-angle adjustment TO die bonder of claim 1, wherein the die bonder further comprises a tray transfer device (600), the tray transfer device (600) comprises a base plate (610), a tray collecting box (620), a tray pushing mechanism (630) and a tray lifting mechanism (640), the tray collecting box (620) is mounted on the base plate (610), the tray collecting boxes (620) are stacked in the height direction TO store trays (100), the tray pushing mechanism (630) is used for pushing trays (100) in the tray collecting box (620) into the working box (230), and the tray lifting mechanism (640) is used for driving the base plate (610) TO lift so as TO drive the tray collecting box (620) TO lift.
  3. 3. The small-angle adjustment TO die bonder of claim 2, wherein the tray pushing mechanism (630) comprises a pushing plate (631) and a sucker (632) arranged at the front end of the pushing plate (631), the pushing plate (631) can move in the horizontal direction TO push the tray (100) in the tray collecting box (620) into the work box (230), and the pushing plate (631) can penetrate through the tray collecting box (620) and pull the tray (100) in the work box (230) back into the tray collecting box (620) by utilizing the sucker (632).
  4. 4. The small-angle adjustment TO die bonder of claim 1, further comprising an equipment base (700) and buffer assemblies (800) arranged on the equipment base (700), wherein the buffer assemblies (800) are connected with four corners of the bottom of the die bonder (200), and a plurality of the buffer assemblies (800) are symmetrically arranged along the rotation axis.
  5. 5. The small-angle adjustment TO die bonder of claim 4, wherein the buffer assembly (800) comprises a gas-liquid hybrid shock absorber, one end of the gas-liquid hybrid shock absorber is hinged with the die bonder table (200), and the other end of the gas-liquid hybrid shock absorber is hinged with the equipment base station (700).
  6. 6. The small-angle adjustment TO die bonder of claim 5, further comprising a controller, wherein an acceleration sensor is arranged at the edge of the working box (230) far away from the center of the working box, a damping adjustment proportional valve is further arranged in the gas-liquid hybrid shock absorber, and the controller is respectively and electrically connected with the acceleration sensor and the damping adjustment proportional valve; the acceleration sensor is used for detecting vibration or motion state of the working box (230), and the controller sends an instruction to the damping adjustment proportional valve according to the obtained rotation angle and the obtained speed, so that the damping of the gas-liquid hybrid shock absorber is adjusted to be a set value.
  7. 7. The small-angle adjustment TO die bonder of claim 1, further comprising an AOI detection mechanism (900), wherein the AOI detection mechanism (900) is electrically connected with the X-axis movement mechanism (210), the Y-axis movement mechanism (220), the die bonding table angle rotation mechanism (300), the dispensing mechanism (400) and the wafer transfer mechanism (500) respectively, a correction lens (910) is arranged on the working box (230), and the AOI detection mechanism (900) can correct the horizontal position of the working box (230) through the correction lens (910).

Description

TO die bonder with small angle adjustment Technical Field The application relates TO the technical field of semiconductor packaging, in particular TO a small-angle adjustment TO die bonder. Background The TO die bonder is mechanical equipment for fixing crystals and packaging semiconductors, can transfer and attach wafers on blue films TO TO packaging tube seats TO complete chip attachment, and is widely applied TO production of products such as LED direct display screens, semiconductor discrete devices, DIP, SOP and the like. In some TO, package sockets are arranged obliquely, and conventional die bonders cannot complete die bonding. In the prior art, in order to adapt to the inclined tube seat, a wedge-shaped base or a customized tray with a groove with a specific slope is usually required to be manufactured. The mode not only increases the die sinking cost, but also needs manual transportation and heavy jig replacement when the production line is replaced, and the glue beating position deviation is easy to occur. Disclosure of Invention In order TO improve production efficiency and reduce cost, the application provides a small-angle adjustment TO die bonder. The application provides a small-angle adjustment TO die bonder, which adopts the following technical scheme: a small angle adjustment TO die bonder comprising: The crystal fixing device comprises a crystal fixing table, wherein an X-axis moving mechanism and a Y-axis moving mechanism are arranged on the crystal fixing table, the output end of the X-axis moving mechanism is connected with the Y-axis moving mechanism, a working box is arranged at the output end of the Y-axis moving mechanism, and a material tray fixing assembly for fixing a material tray is arranged in the working box; the output end of the die bonding table angle rotating mechanism is connected with the die bonding table and is used for driving the die bonding table TO rotate around a horizontal axis so as TO compensate a preset inclination angle of the TO packaging tube seat and enable the top surface of the TO packaging tube seat TO be operated TO be in a horizontal state; the dispensing mechanism is used for dispensing TO packaging tube seats on the material tray; and the wafer transfer mechanism is used for transferring the wafer TO the TO packaging tube seat after dispensing. Through adopting above-mentioned technical scheme, through innovatively setting up solid brilliant platform angle rotary mechanism for the angle of whole solid brilliant platform of equipment initiative adjustment, thereby correct the top surface of the TO encapsulation tube socket of different preset inclination TO the horizontality accurately. The design solves the problem that the prior art can only carry out die bonding by relying on the customized material tray with a specific angle, so that the device can use the universal standard material tray, the compatibility and the universality of the device to different products are greatly enhanced, the high cost caused by the need of developing, purchasing and managing various material trays is obviously reduced, the time consumed by replacing the material tray is avoided, and the production efficiency is greatly improved. Optionally, the die bonding table angle rotating mechanism is a servo rotating motor, a rotating shaft of the servo rotating motor is fixedly connected with the die bonding table, and the rotating shaft is parallel to the Y axis. By adopting the technical scheme, the high-precision control characteristic of the servo rotating motor is utilized, and the angle adjustment can be performed rapidly, accurately and programmably according TO the inclination angle parameters of the TO packaging tube seats of different types. The device can flexibly adapt to products with any inclination angle, true flexible production is realized, and the products can be changed by only switching parameters in the system, so that the universality and the production efficiency of the device are further enhanced. Optionally, the constant head tank has been seted up to two inside walls of work box, charging tray sliding connection in the constant head tank, the cell wall of constant head tank limits the charging tray downside about, the fixed subassembly of charging tray is used for promoting the charging tray so that the charging tray with the last cell wall butt of constant head tank. Through adopting above-mentioned technical scheme, even in the dynamic process that the solid brilliant platform carries out the angle rotation, this reliable and stable charging tray fixed mode also can ensure that standard charging tray remains accurate location throughout, effectively resists the displacement risk that leads to because of gravity component change and rotation inertia, provides reliable and stable benchmark for follow-up high accuracy point gum and solid brilliant operation. In addition, compared with a vacuum adsorption fixing mode, the fixing mode is lower in cost