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CN-121552540-B - Distributed automatic wafer cutting system and method

CN121552540BCN 121552540 BCN121552540 BCN 121552540BCN-121552540-B

Abstract

The invention relates to a distributed automatic wafer cutting system and method, which belong to the technical field of semiconductor chip packaging and comprise a dicing machine, a splitting machine, an industrial switch and an industrial control computer, wherein the dicing machine is used for receiving control data sent by the industrial control computer, controlling the dicing machine to execute wafer dicing, collecting sensing data of the dicing machine through a first data collecting module, the splitting machine is used for receiving the control data sent by the industrial control computer, controlling the splitting machine to execute wafer splitting, collecting sensing data of the splitting machine through a second data collecting module, the industrial switch is used for distributed data exchange and transmission, and the industrial control computer is used for receiving and storing the sensing data, storing formula parameters and a mapping rule base, sending the control data to the dicing machine, the splitting machine and a transmitter, and realizing automatic closed-loop wafer cutting of perception-decision-execution. According to the invention, a linkage processing technology is realized through technology data sharing, so that the yield and the production efficiency are improved, the production cost is reduced, and the technology stability and the technology efficiency are improved.

Inventors

  • WANG WEIHUA

Assignees

  • 华夏芯智慧光子科技(北京)有限公司

Dates

Publication Date
20260508
Application Date
20260123

Claims (8)

  1. 1. A distributed wafer automatic cutting system, comprising: The dicing machine is electrically connected with the industrial exchanger and is used for receiving control data sent by the industrial computer through the servo driving system, controlling the dicing mechanism to perform wafer dicing and collecting sensing data of the dicing mechanism through the first data collecting module; The splitting machine is electrically connected with the industrial exchanger and is used for receiving control data issued by the industrial computer through the servo driving system, controlling the riving knife mechanism to execute wafer splitting, and collecting sensing data of the riving knife mechanism through the second data collecting module; the industrial exchanger is used for distributed data exchange and transmission; The industrial personal computer is electrically connected with the industrial exchange and is used for receiving and storing the sensing data, the stored formula parameters and the mapping rule base Y, issuing control data to the dicing saw, the splitting machine and the transmitter and realizing sensing-decision-execution automatic closed-loop wafer cutting; The industrial personal computer determines an optimal splitting parameter Zy according to the mapping rule base Y, the physical depth Wd of the wafer cutter mark and the blade health index HI, and sends the optimal splitting parameter Zy to the splitting machine to execute wafer splitting; the transmitter is electrically connected with the industrial exchanger and is used for transmitting the wafer from the scribing mechanism of the scribing machine to the riving knife mechanism of the splitting machine and transmitting the split wafer to the wafer collecting mechanism; the wafer collecting mechanism comprises a qualified wafer collector and a disqualified wafer collector; The first data acquisition module is used for acquiring sensing data of the scribing mechanism in real time and comprises a high-precision circuit sensor and a first machine vision unit; the high-precision circuit sensor is arranged on a main shaft motor power supply loop of the scribing mechanism and used for collecting current data of the scribing mechanism, monitoring cutting load and blade abrasion state, The first machine vision unit comprises a CCD camera and a coaxial LED cold light source, and is provided with a wafer dicing operation table corresponding to the dicing machine and used for shooting sensing data of wafer tool mark images; the blade health index HI is obtained by real-time calculation based on the current data of the scribing mechanism, and the HI specific algorithm is as follows: HI = |I_avg - I_new| / I_new ; wherein, I_avg is the average current value of each cutting period, and I_new is the initial reference current value after replacing a new blade; When M0< HI is less than or equal to M1, judging that the blade is worn out obviously, acquiring a new execution parameter Pi_new through an adaptive compensation algorithm, setting Pi_new as an optimal lobe parameter Zy, wherein zy=Pi_new= { P1_new, P2_new, P3_new }; The device comprises a support platform, a wear threshold M0, a damage early warning value M1, a new execution fracture pressure P1_new, a new execution fracture speed P2_new and a new execution support platform spacing P3_new, wherein M0 is the wear threshold, M1 is the damage early warning value, and the wear threshold M0 and the damage early warning value M1 are determined by an actual production process; the new execution parameter pi_new is determined by the following formula: Pi_new = Pi × (1 + K × HI) ; Wherein, K is a compensation coefficient, the value range is 0.1 to 0.5, K is 0.3 when the wafer is a GaAs chip, and 0.2 when the wafer is an InP chip, which is determined by a material test; the value of Pi is determined by querying the mapping rule base Y based on the physical depth Wd of the wafer tool mark and the value of the blade health index HI.
  2. 2. The distributed wafer automatic cutting system of claim 1, further comprising: the second data acquisition module is used for acquiring sensing data of the riving knife mechanism in real time and comprises a second machine vision unit; the second machine vision unit comprises a CCD camera and a coaxial LED cold light source, and is arranged on an operating platform of the riving knife mechanism and used for shooting sensing data of wafer images.
  3. 3. The distributed wafer automatic cutting system according to claim 2, wherein: The industrial personal computer end is provided with a qualification detection module which is used for identifying whether the edge of the cracked wafer is regular, neat and unbroken based on the sensing data of the second data acquisition module, if so, the wafer is judged to be a qualified wafer, and the wafer is sent into a qualified wafer collector through a transmitter, and if not, the wafer is judged to be a disqualified wafer, and the wafer is sent into a disqualified wafer collector through the transmitter; The industrial personal computer end is provided with a database comprising a time sequence database and a relational database, wherein the time sequence database is used for storing sensing data, and the relational database is used for storing the formula parameters and the mapping rule base Y.
  4. 4. A distributed wafer automatic cutting system according to claim 3, wherein: the mapping rule base Y is configured to query preset mapping parameters, where the preset mapping parameters include: preset dicing depth of cut Wd0, preset blade health index HI0, and preset lobe parameter Pi; wherein, the preset lobe parameter pi= { P1, P2, P3}, P1 is a preset lobe pressure, P2 is a preset lobe speed, P3 is a preset support table spacing, and i is a parameter number.
  5. 5. A distributed wafer automatic cutting system according to claim 3, wherein: the physical depth Wd of the wafer tool mark is obtained by calculating wafer tool mark image sensing data based on a first data acquisition module in real time through an image edge detection algorithm, and the specific algorithm Wd is as follows: Wd= Sd × Q ; The method comprises the steps of obtaining image sensing data based on a machine vision module through an image edge detection algorithm, obtaining a wafer tool mark image calibration coefficient through camera calibration, obtaining an actual physical size by using Q=E/E, obtaining the pixel depth of the tool mark by using Sd, and obtaining the pixel size by using E.
  6. 6. The distributed automatic wafer dicing system of claim 5, wherein: when HI > M1, judging that the blade is suddenly damaged, immediately stopping wafer dicing and warning; And when HI is less than or equal to M0, inquiring and determining Pi in a mapping rule base Y, setting the Pi as an optimal lobe parameter Zy, wherein zy=Pi= { P1, P2 and P3}, and sending the optimal lobe parameter Zy to a lobe machine and executing wafer lobe.
  7. 7. A distributed automatic wafer cutting method applied to the distributed automatic wafer cutting system as claimed in claim 6, comprising the following steps: s1, presetting a mapping rule base Y and a wear threshold M0 based on wafer material properties and process requirements; s2, sending the wafer into a dicing saw, performing wafer dicing by the dicing saw, and collecting sensing data of a wafer tool mark image and current data of a dicing mechanism; s3, determining an optimal lobe parameter Zy according to the mapping rule base Y, the physical depth Wd of the wafer tool mark and the blade health index HI; S4, sending the wafer into a wafer splitting machine, and sending the optimal wafer splitting parameter Zy to the wafer splitting machine to execute wafer splitting; S5, iterating the mapping rule base Y when the continuous H batches of the lobe qualification rate data are lower than the iteration threshold F.
  8. 8. A processor-readable storage medium, wherein the processor-readable storage medium stores a computer program, and wherein the processor implements the distributed wafer automatic dicing method according to claim 7 when executing the computer program.

Description

Distributed automatic wafer cutting system and method Technical Field The invention belongs to the technical field of semiconductor chip packaging, and particularly relates to a distributed wafer automatic cutting system, a distributed wafer automatic cutting method and a processor readable storage medium. Background Dicing (WAFER DICING) and breaking (Singulation) are two key steps in wafer dicing in the semiconductor chip manufacturing process. ‌ dicing is the formation of scribe lines on the wafer by a laser or blade in preparation for separating the chips. ‌ split is a process of applying stress along a cutting path and thoroughly separating the split into independent chips by means of mechanical stress or laser and the like, and is an essential link ‌ and ‌ split quality before packaging to directly determine packaging yield and chip reliability. The dicing and the splinter together form the complete flow of wafer dicing, which is a key process before packaging. In the prior art, two different independent devices of a dicing saw and a splitting machine are mainly adopted to respectively and independently process a wafer, and the following structural technical defects exist: the ‌ process island and the information fault ‌ are that effective data interaction is not available between the dicing machine and the splitting machine, and key quality information (such as cutting depth and blade state) of the dicing process cannot be transmitted to the splitting process in real time; ‌ is highly dependent on manual experience ‌, wherein the lobe parameters are seriously dependent on subjective experience and manual adjustment of operators, so that the process is unstable, the parameter difference set by different operators can reach more than 20%, and the personnel training cost is high; ‌ the process debugging period is ‌, when a product or a wafer batch is replaced, the parameters need to be debugged again in a period of hours or 1 day, and the production progress is seriously influenced; the ‌ quality risk is difficult to control ‌, and tiny anomalies of the dicing process cannot be immediately perceived and compensated by the splitting process, so that batch quality accidents are easy to cause, and the cost is high. In the prior art, the wafer cutting system mainly refers to a wafer splitting machine, a distributed wafer automatic cutting system and a distributed wafer automatic cutting method are urgently needed in the field, and a coordinated processing technology of the wafer splitting machine and the wafer splitting machine is realized through process data sharing, so that the yield and the production efficiency are improved, and the production cost is reduced. Disclosure of Invention The invention provides a distributed wafer automatic cutting system and a distributed wafer automatic cutting method, which realize a linkage processing technology through process data sharing so as to improve yield and production efficiency, reduce production cost and have higher practical value. In a first aspect of the present invention, there is provided a distributed wafer automatic cutting system, comprising: The dicing machine is electrically connected with the industrial exchanger and is used for receiving control data sent by the industrial computer through the servo driving system, controlling the dicing mechanism to perform wafer dicing and collecting sensing data of the dicing mechanism through the first data collecting module; The splitting machine is electrically connected with the industrial exchanger and is used for receiving control data issued by the industrial computer through the servo driving system, controlling the riving knife mechanism to execute wafer splitting, and collecting sensing data of the riving knife mechanism through the second data collecting module; the industrial exchanger is used for distributed data exchange and transmission; The industrial personal computer is electrically connected with the industrial exchange, is used for receiving and storing the sensing data, storing the formula parameters and the mapping rule base Y, and is used for issuing control data to the dicing saw, the splitting machine and the transmitter to realize automatic closed-loop wafer cutting of sensing-decision-execution. Further, a transmitter electrically connected with the industrial exchanger and used for transmitting the wafer from the dicing mechanism of the dicing machine to the riving knife mechanism of the splitting machine and transmitting the split wafer to the wafer collecting mechanism; the wafer collecting mechanism comprises a qualified wafer collector and a disqualified wafer collector; The first data acquisition module is used for acquiring sensing data of the scribing mechanism in real time and comprises a high-precision circuit sensor and a first machine vision unit; The high-precision circuit sensor is arranged on a main shaft motor power supply loop of the scribing mechanism and is used fo