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CN-121568487-B - MIP chip flip packaging structure and packaging technology thereof

CN121568487BCN 121568487 BCN121568487 BCN 121568487BCN-121568487-B

Abstract

The invention relates to an MIP chip flip-chip packaging structure and a packaging process thereof, wherein the MIP chip flip-chip packaging structure comprises a carrier plate and a cover plate which are matched with each other through a box cover, a semiconductor chip is arranged in the carrier plate, meshing grooves which are matched with each other are formed in the edges of the carrier plate and the cover plate, a current collecting inner annular plate, a matching annular plate, a first rotating plate and a second rotating plate are arranged on the matching annular plate, the circulating grooves are in a shape with wide bottoms and narrow tops, the first rotating plate and the second rotating plate are connected through rotating shafts in a rotating mode, an inclined clamping cavity is formed between the end part of the first rotating plate and the second rotating plate, an injection head is clamped in the clamping cavity, and the injection head for injecting colloid corresponds to the meshing grooves. According to the invention, through the mutually matched meshing groove structures arranged on the edges of the loading plate and the cover plate and the slow injection of the colloid in the meshing process, the colloid can be uniformly smeared on the mutually meshed tooth surfaces, and gaps or weak points possibly generated in the traditional plane gluing mode are effectively avoided, so that the full filling and consistent sealing performance of the colloid at each part of the joint surface are ensured.

Inventors

  • LI ZHISEN
  • GE XIUBIN

Assignees

  • 深圳市锦瑞新材料股份有限公司

Dates

Publication Date
20260505
Application Date
20260121

Claims (10)

  1. 1. The MIP chip flip-chip packaging structure is characterized by comprising a carrier plate (1) and a cover plate (2) which are matched with each other through a box cover, wherein a semiconductor chip is arranged in the carrier plate (1), a meshing groove (3) which is matched with each other is formed in the edge of the carrier plate (1) and the edge of the cover plate (2), a current collecting inner ring plate (4) is fixedly connected to the inner side of the carrier plate (1), a matching ring plate (5) which is in abutting press fit with the current collecting inner ring plate (4) is fixedly connected to the inner side of the cover plate (2), a circulation groove (6) is formed in the matching ring plate (5), and the circulation groove (6) is in a shape with a wide bottom and a narrow top; The plastic injection device comprises a carrier plate (1), a cover plate (2), a first rotating plate (7) and a second rotating plate (8), wherein the carrier plate (1) and the cover plate (2) are respectively connected in a mounting mode, the first rotating plate (7) and the second rotating plate (8) are connected in a rotating mode through a rotating shaft (9), an inclined clamping cavity is formed between the end portion of the first rotating plate (7) and the second rotating plate (8), an injection head is clamped in the clamping cavity, and the injection head for injecting the plastic body corresponds to the position of the meshing groove (3).
  2. 2. The flip-chip packaging structure of MIP chip of claim 1, wherein the outer surface of the carrier plate (1) is fixedly connected with a current collecting outer ring plate (10), and a brushing mechanism is arranged on the injection head.
  3. 3. The MIP chip flip-chip packaging structure according to claim 2, wherein a bottom plate (12) is inserted into the bottom of the first rotating plate (7) through a first inserting rod (11), a communicating pipe (13) which is rotationally connected with the carrier plate (1) is fixedly connected to the bottom plate (12), the bottom of the communicating pipe (13) is connected with two through pipes, and the end parts of the two through pipes are positioned in a gap between the semiconductor chip and the carrier plate (1).
  4. 4. The MIP chip flip package structure of claim 3, wherein the top of the second rotating plate (8) is inserted with a top plate (14) through a second inserting rod, a movable shaft (15) fixedly connected with the cover plate (2) is movably inserted on the top plate (14), and a limiting ring is fixedly connected on the movable shaft (15).
  5. 5. The MIP chip flip package structure of claim 4, wherein the top plate (14) and the cover plate (2) are respectively provided with an anti-slip ring (16) which is matched with each other, the first rotating plate (7) is fixedly connected with a baffle (17) which is in pressing fit with the second rotating plate (8), the top plate (14) and the bottom plate (12) are in L-shaped structures, and the bottom plate (12) is in plugging fit with the top plate (14).
  6. 6. The MIP chip flip package structure of claim 1, wherein the first rotating plate (7) is slidably matched with a sliding column (18), the second rotating plate (8) is rotatably connected with a fixed column (19), the fixed column (19) is fixedly connected with a connecting rope (20), and a tension spring (21) is hung between the sliding column (18) and the connecting rope (20).
  7. 7. The flip-chip packaging structure of claim 6, wherein the connecting ropes (20) are obliquely distributed and matched with the rotating shaft (9).
  8. 8. The flip-chip packaging structure of MIP chip of claim 1, wherein the first rotating plate (7) is provided with a movable groove (22), the bottom of the movable groove (22) is in an inclined shape, the bottom end of the second rotating plate (8) is provided with an inclined surface (23), and the inclined surface (23) and the movable groove (22) form a clamping cavity.
  9. 9. The flip-chip packaging structure of claim 6, wherein the first rotating plate (7) is provided with a U-shaped groove (24), the sliding column (18) slides in the U-shaped groove (24), and the end part of the sliding column (18) is also provided with an anti-falling plate sliding in the U-shaped groove (24).
  10. 10. A packaging process of a MIP chip flip-chip packaging structure according to any one of claims 1-9, comprising the steps of; S1, assembling and positioning ‌, namely mounting and welding a semiconductor chip to the middle part of a carrier plate (1), and enabling a top plate (14) and a bottom plate (12) to be in plug-in fit through an L-shaped structure so as to enable the positions of the carrier plate (1) and a cover plate (2) to be initially aligned; Simultaneously, the first rotating plate (7) is connected with the bottom plate (12) of the carrier plate (1) in a plug-in manner, and the second rotating plate (8) is connected with the top plate (14) of the cover plate (2) in a plug-in manner; S2, mounting an injection head and pre-coating a colloid ‌, namely rotating a second rotating plate (8) to be in a horizontal state, clamping the injection head and a brushing mechanism into a clamping cavity, rotating the second rotating plate (8) after the injection head is aligned with the meshing groove (3) on the carrier plate (1), adjusting the position of a sliding column (18) in a U-shaped groove (24), enabling the second rotating plate (8) to be stable and vertical, starting the injection head, and slowly and continuously injecting the colloid into the meshing groove (3) of the carrier plate (1); S3, meshing movement and uniform gluing ‌, wherein a movable shaft (15) connected with the cover plate (2) is controlled by a mechanical arm to enable the cover plate (2) to move up and down and rotate, so that colloid is uniformly smeared on tooth surfaces meshed with each other, an elastic rod on the brushing mechanism can be adaptively adjusted, the colloid is ensured to be fully filled, and redundant colloid can be collected into the collecting inner ring plate (4) and the collecting outer ring plate (10); S4, completely attaching and curing the lock ‌, namely changing the pivot position of the connecting rope (20) on the rotating shaft (9) to enable the first rotating plate (7) and the second rotating plate (8) to incline, and enabling the injection head to be separated from the clamping cavity along with the inclination; Simultaneously, the tip of first rotor plate (7) and second rotor plate (8) of slope is supported respectively and is pressed on carrier plate (1) and apron (2), prevents its rotation, and the sealed joint of cooperation annular plate (5) of apron (2) inboard and the interior annular plate (4) of collector plate (1), and circulation groove (6) of reservation help making unnecessary colloid evenly disperse and shutoff cooperation annular plate (5) and the junction of interior annular plate (4) of collector, accomplish final sealed and mechanical interlocking.

Description

MIP chip flip packaging structure and packaging technology thereof Technical Field The invention relates to the technical field of semiconductor packaging structures, in particular to an MIP chip flip-chip packaging structure and a packaging process thereof. Background The flip chip packaging technology is widely applied in the field of semiconductor packaging due to the advantages of high density and high performance, and particularly advanced packaging forms such as Micro LED IN PACKAGE (MIP) and the like. In the process of precision packaging such as MIP, a carrier plate and a cover plate are generally matched with each other to form a sealed cavity, so as to protect an internal semiconductor chip and an interconnection structure. In the packaging process, glue is required to be injected to achieve adhesion and sealing between the carrier plate and the cover plate, which is critical to the mechanical strength and long-term reliability of the package. However, the prior art has a remarkable technical problem that in the bonding and sealing process of the carrier plate and the cover plate, the uniform coating of the colloid and the shearing resistance after curing are difficult to combine. On one hand, the traditional plane gluing mode is easy to cause uneven glue distribution, gaps or weak points are generated on the joint surface, so that the whole sealing effect is influenced, on the other hand, the joint surface mainly relying on the self adhesive force of the glue is easy to generate relative sliding or dislocation when facing thermal stress, mechanical vibration or shearing force in the working process, so that the sealing failure and the connection reliability are reduced, and the service life and the stability of the whole packaging structure are further influenced. Therefore, a flip-chip packaging structure of a MIP chip and a packaging process thereof are proposed for the above problems. Disclosure of Invention The invention aims to provide an MIP chip flip-chip packaging structure and a packaging process thereof. The invention aims at realizing the technical scheme that the MIP chip flip-chip packaging structure comprises a carrier plate and a cover plate which are matched with each other in a box cover, wherein a semiconductor chip is arranged in the carrier plate, the edges of the carrier plate and the cover plate are provided with mutually matched meshing grooves, the inner side of the carrier plate is fixedly connected with a current collecting inner ring plate, the inner side of the cover plate is fixedly connected with a matched ring plate which is in abutting press fit with the current collecting inner ring plate, the matched ring plate is provided with a circulation groove, and the circulation groove is in a shape with a wide bottom and a narrow top; The plastic injection device comprises a carrier plate, a cover plate, a first rotating plate, a second rotating plate, a first rotating plate and a second rotating plate, wherein the first rotating plate and the second rotating plate are respectively connected with the carrier plate and the cover plate in an installation mode, the first rotating plate and the second rotating plate are connected through a rotating shaft in a rotating mode, an inclined clamping cavity is formed between the end portion of the first rotating plate and the second rotating plate, an injection head is clamped in the clamping cavity, and the injection head for injecting the plastic body corresponds to the position of the meshing groove. As a further description of the above technical solution: The outer surface of the carrier plate is fixedly connected with a current collecting outer ring plate, and the injection head is provided with a brushing mechanism; through increasing the brush mechanism of taking the elastic rod on collecting outside annular plate and the injection head of collecting outside the support plate, can collect unnecessary colloid and avoid the pollution, can make the brush head self-adaptation adjust in the meshing process again, ensured that the colloid is fully, evenly smeared to each corner of meshing groove, further optimized sealed packing effect. As a further description of the above technical solution: the bottom of the first rotating plate is inserted with a bottom plate through a first inserted rod, a communicating pipe which is rotationally connected with the carrier plate is fixedly connected to the bottom plate, the bottom of the communicating pipe is connected with two through pipes, the end parts of the two through pipes are positioned in a gap between the semiconductor chip and the carrier plate, and a heat dissipation airflow channel which leads to the gap between the semiconductor chip and the carrier plate is formed through the bottom plate, the communicating pipe and the through pipes which are connected to the bottom of the first rotating plate, so that the active cooling effect on the core heating element is enhanced, and th