Search

CN-121575268-B - Heat-resistant oxygen-free copper strip and application thereof in preparation of IGBT module ceramic copper-clad plate

CN121575268BCN 121575268 BCN121575268 BCN 121575268BCN-121575268-B

Abstract

The invention provides a heat-resistant oxygen-free copper strip and application thereof in preparation of an IGBT module ceramic copper-clad plate, and relates to the technical field of copper alloy. The heat-resistant oxygen-free copper strip comprises 0.001% -0.1% of Ag, 0.001% -0.1% of La and the balance of Cu in percentage by mass, and the preparation method comprises the steps of proportioning according to the percentage by mass, and then sequentially smelting, casting, hot rolling, first cold rolling, first annealing, second cold rolling, second annealing and third cold rolling to obtain the heat-resistant oxygen-free copper strip. Hardness is greater than or equal to 100HV,900℃ preserving heat for 30min, and keeping grain size less than or equal to the hardness is more than or equal to 100HV, and the grain size is less than or equal to 30 minutes when the temperature is maintained at 900℃ the grain size is less than or equal to 0.08mm when the temperature is kept at 0.07mm and 1065 ℃ for 3min, the problem that oxygen-free copper and ceramic in the IGBT module ceramic copper-clad plate are easy to fail in welding can be solved.

Inventors

  • LIU FENG
  • HU MINGLIE
  • JIN JING
  • MA JIMIAO
  • YANG LIJIAO
  • Zhu Yangxiao
  • WU XIAOLONG
  • WU JIANQIANG

Assignees

  • 宁波兴业盛泰集团有限公司
  • 宁波兴业鑫泰新型电子材料有限公司
  • 宁波兴博浩广科技发展有限公司

Dates

Publication Date
20260505
Application Date
20260127

Claims (7)

  1. 1. The heat-resistant oxygen-free copper strip is characterized by comprising, by mass, 0.001% -0.1% of Ag, 0.001% -0.1% of La and the balance of Cu; The preparation method of the heat-resistant oxygen-free copper strip comprises the following steps: Proportioning according to the mass percentage, and then sequentially carrying out smelting, casting, hot rolling, first cold rolling, first annealing, second cold rolling, second annealing and third cold rolling to prepare a heat-resistant oxygen-free copper strip; the hot rolling comprises the steps of heating cast ingots obtained by casting to 800-900 ℃, and then carrying out hot rolling, wherein the initial rolling temperature of the hot rolling is 700-800 ℃ and the final rolling temperature is 400-600 ℃; The temperature of the first annealing is 400-600 ℃, and the heat preservation time is 0.5-12 h; The temperature of the second annealing is 450-550 ℃, and the heat preservation time is 0.5-6 h; the first cold rolling process is carried out in 5-9 times, the single-pass process rate is 15% -40%, and the total process rate is 60% -90%; the processing pass of the second cold rolling is 5-9, the single-pass processing rate is 20-35%, and the total processing rate is 70-85%; The third cold rolling is carried out in 2-3 processing passes, the single-pass processing rate is 10% -25%, and the total processing rate is 30%, 35% or 45%.
  2. 2. The heat resistant oxygen free copper strip of claim 1, wherein the smelting temperature is 1150-1200 ℃.
  3. 3. The heat resistant oxygen free copper strip of claim 1 wherein the casting temperature is 1150-1190 ℃ and the casting speed is 50-100 mm/min.
  4. 4. The heat-resistant oxygen-free copper strip according to claim 1, wherein the total working rate of the hot rolling is 70% -95%.
  5. 5. The heat resistant oxygen free copper strip as recited in claim 1, further comprising a mill after the hot rolling.
  6. 6. The heat resistant oxygen free copper strip as defined in claim 1, further comprising stretch bending straightening after the third cold rolling; The technological parameters of stretch bending and straightening comprise that the uncoiling tension is 10-45N/mm 2 , the coiling tension is 18-60N/mm 2 , and the inlet extension is 0.05% -0.3%.
  7. 7. The application of the heat-resistant oxygen-free copper strip according to any one of claims 1-6 in preparing an IGBT module ceramic copper-clad plate.

Description

Heat-resistant oxygen-free copper strip and application thereof in preparation of IGBT module ceramic copper-clad plate Technical Field The invention relates to the technical field of copper alloy, in particular to a heat-resistant oxygen-free copper strip and application thereof in preparation of an IGBT module ceramic copper-clad plate. Background The IGBT module (insulated gate bipolar transistor) is a composite power semiconductor device formed by encapsulating an IGBT chip and a freewheeling diode through a circuit, and has the characteristics of high input impedance of a MOSFET and low conduction voltage drop of the bipolar transistor. The module is packaged by adopting a heat dissipation substrate, a ceramic copper-clad plate and a heat dissipation structure, comprises components such as a driving circuit, a protection circuit and the like, and is mainly applied to the fields of high-power industrial frequency converters, electric welding machines, new energy automobiles (motor controllers, vehicle-mounted air conditioners and charging piles), rail traffic equipment, white household appliances, photovoltaics, wind power and the like, wherein the voltage is 600V-6500V, and the current is 3600A. The copper-clad process of the ceramic copper-clad plate needs to realize bonding of the copper material and the ceramic plate at high temperature. However, after high temperature heat treatment, the grains of the copper material grow rapidly, and the grain size can even reach millimeter level, which forms an orange peel structure at the joint surface of the copper material and the ceramic plate and the free surface thereof, thereby increasing the surface roughness of the copper material. On one hand, the increase of the roughness of the bonding surface can increase the gap between the copper material and the ceramic plate, thereby reducing the bonding strength of the copper/ceramic and even failing the bonding, and on the other hand, the increase of the roughness of the free surface can bring a series of negative effects to the subsequent processes of etching, cleaning, welding and the like, thereby reducing the strength of the welding seam of the copper/element and even failing the welding. In view of this, the present invention has been made. Disclosure of Invention The first object of the present invention is to provide a heat-resistant oxygen-free copper strip, which solves the above technical problems. The second aim of the invention is to provide the application of the heat-resistant oxygen-free copper strip in preparing the IGBT module ceramic copper-clad plate. In order to achieve the above object, the following technical scheme is adopted: the invention provides a heat-resistant oxygen-free copper strip, which comprises, by mass, 0.001% -0.1% of Ag, 0.001% -0.1% of La and the balance of Cu; The preparation method of the heat-resistant oxygen-free copper strip comprises the following steps: Proportioning according to the mass percentage, and then sequentially carrying out smelting, casting, hot rolling, first cold rolling, first annealing, second cold rolling, second annealing and third cold rolling to prepare a heat-resistant oxygen-free copper strip; the hot rolling comprises the steps of heating cast ingots obtained by casting to 800-900 ℃, and then carrying out hot rolling, wherein the initial rolling temperature of the hot rolling is 700-800 ℃ and the final rolling temperature is 400-600 ℃; The temperature of the first annealing is 400-600 ℃, and the heat preservation time is 0.5-12 h; the temperature of the second annealing is 450-550 ℃, and the heat preservation time is 0.5-6 h. As a further technical scheme, the smelting temperature is 1150-1200 ℃. As a further technical scheme, the casting temperature is 1150-1190 ℃, and the casting speed is 50-100 mm/min. As a further technical scheme, the total processing rate of the hot rolling is 70% -95%. As a further technical scheme, the hot rolling is followed by milling. As a further technical scheme, the first cold rolling is performed in 5-9 processing passes, the single-pass processing rate is 15% -40%, and the total processing rate is 60% -90%. As a further technical scheme, the processing pass of the second cold rolling is 5-9, the single-pass processing rate is 20-35%, and the total processing rate is 70-85%. As a further technical scheme, the processing pass of the third cold rolling is 2-3, and the single-pass processing rate is 10% -25%. As a further technical scheme, the third cold rolling is followed by stretch bending straightening; The technological parameters of stretch bending and straightening comprise that the uncoiling tension is 10-45N/mm 2, the coiling tension is 18-60N/mm 2, and the inlet extension is 0.05% -0.3%. In a second aspect, the invention provides an application of the heat-resistant oxygen-free copper strip in preparation of an IGBT module ceramic copper-clad plate. Compared with the prior art, the invention has the foll