CN-121596083-B - Wafer detection device and detection equipment

CN121596083BCN 121596083 BCN121596083 BCN 121596083BCN-121596083-B

Abstract

The present disclosure provides a wafer inspection apparatus and inspection equipment. The wafer detection device comprises a bearing body, at least one heating unit and a detection part. The bearing body comprises a bearing part for bearing the wafer to be tested, wherein the bearing part comprises a central area contacted with the wafer to be tested and a peripheral area surrounding the central area. The at least one heating unit is arranged on the bearing body and used for heating the bearing part. The detection part and the bearing body are arranged above the bearing part in a relatively movable fit manner so as to reach a detection position corresponding to any region to be detected on the wafer to be detected. The peripheral area is arranged such that the horizontal orthographic projection pattern of the detecting portion at any detecting position is located in the carrying portion. The inspection apparatus includes a wafer inspection device. In the method, part of the test probes on the detection part are abutted against the wafer to be detected and heated by the heated wafer to be detected, and the other part of the test probes are close to the bearing part to obtain heat, so that deformation caused by temperature reduction is avoided.

Inventors

FEI CHUNCHAO
GUAN JIANGWEI
SUN CE
LIU QINGHUA

Assignees

上海伟测半导体科技股份有限公司

Dates

Publication Date: 20260508
Application Date: 20260130

Claims (6)

1. A wafer inspection apparatus, comprising: The wafer to be measured comprises a bearing body, wherein the bearing body comprises a bearing part for bearing the wafer to be measured, the bearing part comprises a central area in contact with the wafer to be measured and a peripheral area surrounding the central area, the bearing body comprises a bearing part and a plurality of auxiliary supporting parts which are arranged outside the bearing part in a target-shaped mode and can be arranged in a lifting mode, at least one of the auxiliary supporting parts is selectively moved upwards to form the peripheral area, the rest auxiliary supporting parts and the bearing part form the central area together, the inner diameter of the auxiliary supporting parts is matched with the outer diameter of the bearing part, and the number of the selected upwards-moved auxiliary supporting parts depends on the size of the wafer to be measured; At least one heating unit arranged on the bearing body and used for heating the bearing part; The detection part is arranged above the bearing part in a relatively movable fit with the bearing body so as to reach a detection position corresponding to any region to be detected on the wafer to be detected; wherein the peripheral area is arranged such that the horizontal orthographic projection pattern of the detecting portion at any one of the detecting positions is located in the bearing portion.
2. The wafer inspection apparatus according to claim 1, wherein the carrier is configured such that the central region and the peripheral region are both abutted against the inspection portion.
3. The wafer inspection apparatus according to claim 1, wherein the central area is configured as a combining groove concavely formed from a top wall of the carrier portion for embedding a wafer to be inspected, so that the top wall of the carrier portion can be flush with the top wall of the wafer to be inspected embedded in the combining groove.
4. The wafer inspection apparatus according to claim 1, wherein the plurality of heating units is provided, a third heating unit among the plurality of heating units is provided in the central area, and a fourth heating unit is provided in the peripheral area.
5. The wafer inspection apparatus of claim 1, wherein the inspection section includes a plurality of test probes distributed in an array, the plurality of test probes being vertically telescopically arranged.
6. A detection apparatus, characterized by comprising: The wafer inspection apparatus according to any one of claims 1-5.

Description

Wafer detection device and detection equipment Technical Field The disclosure relates to the technical field of semiconductors, and in particular relates to a wafer detection device and detection equipment. Background In the field of semiconductor reliability verification, high temperature testing of memory devices is facing an unprecedented technical challenge. Along with the popularization of intelligent driving systems and industrial Internet of things equipment, the memory chip is required to complete full-function test under a high-temperature environment, so that higher requirements are put on the thermal management capability of the test system, the temperature uniformity of a plurality of test probes in a probe card above a wafer is required to be maintained, and deformation or poor contact of part of the test probes is avoided. However, in the related art, the chuck is adapted to the size of the wafer to be tested, so that when the test probe moves from the central area of the wafer to the edge to detect the microchip at the edge, a part of the test probe is in a suspended state and cannot acquire heat from the chuck or the wafer, so that the part of the test probe is contracted due to heat loss, and the accuracy of the subsequent detection result is affected. Disclosure of Invention In view of the above-mentioned drawbacks of the prior art, an object of the present disclosure is to provide a wafer inspection apparatus and inspection equipment, which solve the problems in the related art. A first aspect of the present disclosure provides a wafer inspection apparatus, comprising: The device comprises a bearing body, a bearing part and a bearing part, wherein the bearing part is used for bearing a wafer to be measured, the bearing part comprises a central area which is in contact with the wafer to be measured and a peripheral area which surrounds the central area, the bearing body comprises a bearing part and a plurality of auxiliary supporting pieces which are arranged outside the bearing part in a target-shaped mode, and the auxiliary supporting pieces are arranged in a lifting mode, at least one of the auxiliary supporting pieces is selectively moved upwards to form the peripheral area, and the rest auxiliary supporting pieces and the bearing part form the central area together; At least one heating unit arranged on the bearing body and used for heating the bearing part; The detection part is arranged above the bearing part in a relatively movable fit with the bearing body so as to reach a detection position corresponding to any region to be detected on the wafer to be detected; wherein the peripheral area is arranged such that the horizontal orthographic projection pattern of the detecting portion at any one of the detecting positions is located in the bearing portion. In an embodiment of the first aspect, the temperature of the peripheral region is higher than the temperature of the central region. In an embodiment of the first aspect, the at least one heating unit is arranged such that the heating temperature of the peripheral region is higher than the heating temperature of the central region. In an embodiment of the first aspect, the carrier portion is arranged such that both the central region and the peripheral region abut the detection portion. In an embodiment of the first aspect, the central area is configured as a bonding groove concavely formed from a top wall of the bearing portion, for embedding the wafer to be tested, so that the top wall of the bearing portion can be flush with the top wall of the wafer to be tested embedded in the bonding groove. In an embodiment of the first aspect, the heating units are implemented in a plurality, a third heating unit of the plurality of heating units is correspondingly arranged in the central area, and a fourth heating unit is correspondingly arranged in the peripheral area. In an embodiment of the first aspect, the detection portion includes a plurality of test probes distributed in an array, a plurality of the test probes being vertically telescopically arranged. A second aspect of the present disclosure provides a inspection apparatus, including the wafer inspection device. As described above, the present disclosure provides a wafer inspection apparatus and inspection equipment. The wafer detection device comprises a bearing body, at least one heating unit and a detection part. The bearing body comprises a bearing part for bearing a wafer to be measured, the bearing part comprises a central area in contact with the wafer to be measured and a peripheral area surrounding the central area, the bearing body comprises a bearing part and a plurality of auxiliary supporting parts which are arranged outside the bearing part in a target-shaped mode and can be arranged in a lifting mode, at least one of the auxiliary supporting parts is selectively moved upwards to form the peripheral area, the other auxiliary supporting parts and the bearing part for