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CN-121610250-B - Heat conduction material suitable for local micro heat source of integrated chip and preparation method thereof

CN121610250BCN 121610250 BCN121610250 BCN 121610250BCN-121610250-B

Abstract

The invention provides a heat conduction material suitable for a local micro heat source of an integrated chip and a preparation method thereof, wherein the preparation method comprises the following steps of S1, designing and obtaining a topological structure of a heat conduction filler framework according to local micro heat source parameters; S2, designing an ice template mold, namely covering a heat-conducting metal block with a cavity bulge on the upper surface and an insulating plate, wherein the insulating plate covers the upper surface of the heat-conducting metal block and exposes the cavity bulge to serve as a cold source, S3, controlling the temperature to enable the cavity bulge to form uniform crystal nuclei, adding heat-conducting filler dispersion liquid, controlling the temperature of the cavity bulge to be close to a freezing point, directionally freezing to form an ice template-heat-conducting filler composite body, and freeze-drying to obtain a heat-conducting filler framework, and S4, treating the heat-conducting filler framework and a polymer matrix prepolymer by a vacuum impregnation method to obtain a heat-conducting material. The heat conducting material and the method solve the problems of poor heat conducting strengthening effect and mismatching of the structure and the heat source of the existing material, and realize the efficient reduction of the temperature of the micro heat source.

Inventors

  • XIE BIN
  • ZHANG XUN
  • ZHAO MEIHUI
  • WU HAO
  • YIN ZHOUPING

Assignees

  • 华中科技大学

Dates

Publication Date
20260508
Application Date
20260130

Claims (8)

  1. 1. The preparation method of the heat conduction material suitable for the integrated chip local micro heat source is characterized by comprising the following steps of: s1, designing and obtaining a topological structure of a heat conducting filler framework in a heat conducting material according to local micro heat source parameters; S2, designing an ice template mold according to the topological structure of the heat-conducting filler framework, wherein the ice template mold comprises a heat-conducting metal block and an insulating plate, the upper surface of the heat-conducting metal block is provided with a cavity bulge corresponding to the topological structure of the heat-conducting filler framework, the insulating plate is provided with a through hole corresponding to the cavity bulge, the through hole covers the upper surface of the heat-conducting metal block and exposes the cavity bulge, and the exposed cavity bulge is used as a cold source of the ice template; S3, controlling the temperature of the cavity bulge to be less than or equal to-3 ℃, enabling condensed steam on the surface of the cavity bulge to form uniform crystal nucleus, adding the heat-conducting filler boron nitride dispersion liquid into an ice template mold, controlling the temperature of the cavity bulge to be close to a freezing point, performing directional freezing to form an ice template-heat-conducting filler composite, and then performing freeze drying to obtain a heat-conducting filler framework with the topological structure, wherein the temperature close to the freezing point is 0-5 ℃, and the growth rate of ice crystals is controlled to be 0.75-1.25 mu m/s; s4, treating the prepolymer of the heat conducting filler framework and the polymer matrix through a vacuum impregnation method to obtain the heat conducting material suitable for the local micro heat source of the integrated chip.
  2. 2. The method for preparing a heat conducting material suitable for a local micro heat source of an integrated chip according to claim 1, wherein in step S1, topology optimization simulation of an optimal heat flow path of the heat conducting material is performed according to local micro heat source parameters, and an initial topology structure of a heat conducting filler skeleton is obtained according to heat flow path design.
  3. 3. The method for preparing the heat conducting material suitable for the local micro heat source of the integrated chip according to claim 2, wherein the heat conducting filler with the discrete distribution in the topological optimization is designed to be continuous, and the distance and the shape of the framework of the heat conducting filler are finely adjusted according to the range of the growth of ice crystals controlled by the subsequent cold source, so that the final topological structure of the framework of the heat conducting filler is obtained.
  4. 4. The method of manufacturing a thermally conductive material suitable for use in a localized micro heat source of an integrated chip according to claim 1, wherein in step S3, the volume fraction of the thermally conductive filler in the thermally conductive filler dispersion is 0.1vol% to 20vol%.
  5. 5. The method for preparing a heat conducting material suitable for integrated chip local micro heat sources according to claim 1, wherein in step S4, a prepolymer of a polymer matrix is injected into a heat conducting filler skeleton, and then solidified, cooled and demoulded to obtain the heat conducting material suitable for integrated chip local micro heat sources.
  6. 6. The method of any one of claims 1-5, wherein the polymer matrix is any one of polydimethylsiloxane, polyurethane, polyethylene, or polyimide.
  7. 7. A thermally conductive material suitable for use in an integrated chip local micro heat source, characterized in that it is prepared by the preparation method of any one of claims 1-6.
  8. 8. The use of a thermally conductive material as claimed in claim 7 for the local micro-heat source of an integrated chip for the thermal dissipation of the local micro-heat source of an integrated chip.

Description

Heat conduction material suitable for local micro heat source of integrated chip and preparation method thereof Technical Field The invention relates to the technical field of thermal interface materials, in particular to a heat conduction material suitable for local micro heat sources of integrated chips and a preparation method thereof. Background With the development of miniaturization and high power density of electronic devices, the heat dissipation problem of local micro heat sources (such as integrated chips) becomes a key bottleneck for limiting the performance and service life of the devices, and the heat sources need to rapidly conduct heat to a substrate for heat dissipation, and if the heat sources are not timely diffused, the local temperature is easily caused to be too high, so that the performance of the devices is attenuated, the failure rate is increased and even burnt. The current heat dissipation scheme for the millimeter-level local micro heat source of the integrated chip mainly depends on traditional interface materials, such as disordered boron nitride/polymer composite materials, metal heat dissipation fins and the like, and has the following core problems: 1) The heat conductivity is insufficient, unordered boron nitride nano-sheets (BNNS) are easy to form a heat conduction barrier, the heat conductivity between the surfaces of the material after the unordered boron nitride nano-sheets with the mass fraction of 1% are compounded with Polydimethylsiloxane (PDMS) is generally lower than 0.18W/(m.K), the heat resistance is higher, and the requirement of high-efficiency heat dissipation of a power electronic device cannot be met; 2) The structure is not matched with a heat source, the existing materials are of a uniform block structure, the internal materials are dispersed, a good heat conduction path cannot be formed, meanwhile, the customized design is not carried out on a heat flow path of the heat source, the local high-temperature heat source cannot timely diffuse heat to a low-heat area, the heat is easy to accumulate, the temperature uniformity is poor, meanwhile, the substrate is only subjected to heat dissipation by the local high-heat source area, the heat cannot be timely conducted out, and the heat dissipation efficiency is low. 3) The preparation process is limited in that the orientation and compact arrangement of the boron nitride nano-sheets are difficult to realize by traditional hot press forming, solution casting and other methods, the topological structure of the composite heat flow characteristic cannot be reproduced accurately, the material structure and the heat dissipation performance are disjointed, a loose framework can be made by a traditional ice template mode only by utilizing the ice crystal growth mode, and the heat conduction strengthening effect is general. Therefore, it is needed to provide a precisely regulated heat conducting material, which solves the problems of poor heat conducting strengthening effect, mismatching structure and heat source and the like of the existing material, and realizes the efficient reduction of the micro heat source temperature. Disclosure of Invention In order to solve the problems in the background art, the invention provides a heat conduction material suitable for a local micro heat source of an integrated chip and a preparation method thereof, solves the problems of poor heat conduction strengthening effect and mismatching of a structure and a heat source of the existing material, and realizes efficient reduction of the temperature of the micro heat source. The technical scheme for solving the technical problems is as follows: A preparation method of a heat conduction material suitable for a local micro heat source of an integrated chip comprises the following steps: S1, designing and obtaining a topological structure of a heat conducting filler framework in a heat conducting material according to local micro heat source parameters, and establishing a geometric model of the heat conducting material; S2, designing an ice template mold according to the topological structure of the heat-conducting filler framework, wherein the ice template mold comprises a heat-conducting metal block and an insulating plate, the upper surface of the heat-conducting metal block is provided with a cavity bulge corresponding to the topological structure of the heat-conducting filler framework, the insulating plate is provided with a through hole corresponding to the cavity bulge, the through hole covers the upper surface of the heat-conducting metal block and exposes the cavity bulge, and the exposed cavity bulge is used as a cold source of the ice template; S3, controlling the temperature of the cavity bulge to enable condensed steam on the surface of the cavity bulge to form uniform crystal nucleus, adding the heat-conducting filler dispersion liquid into an ice template mold, controlling the temperature of the cavity bulge to be close to th