CN-121649639-B - Solder verification system, method, electronic device and storage medium

CN121649639BCN 121649639 BCN121649639 BCN 121649639BCN-121649639-B

Abstract

The application provides a soldering tin verification system, a soldering tin verification method, electronic equipment and a storage medium, and relates to the technical field of electronic manufacturing. The system comprises a nitrogen input module, a waste heat recovery module, a laminar flow spray head, an oxygen concentration adjusting module and a heating module, wherein the nitrogen input module is connected with the waste heat recovery module and is used for inputting nitrogen into the waste heat recovery module to primarily heat the nitrogen to obtain preheated nitrogen, the waste heat recovery module is connected with the heating module and is used for secondarily heating the preheated nitrogen to obtain hot nitrogen with a target temperature, the laminar flow spray head is connected with the heating module and is used for uniformly spraying the hot nitrogen onto the surface of a carrier and heating welding spots on the carrier by the hot nitrogen to finish soldering tin verification, and the oxygen concentration adjusting module is connected with the heating module and is used for detecting the oxygen concentration of a heating area in the heating module in the secondary heating process and dynamically adjusting the oxygen flow of the heating area according to the oxygen concentration to maintain the oxygen concentration of the heating area within a preset range. By the aid of the method and the device, stability and consistency of welding spots are improved.

Inventors

ZHOU SHAOFENG
WU DI
WANG LIANG
WANG SHUPING

Assignees

深圳市星汉激光科技股份有限公司

Dates

Publication Date: 20260508
Application Date: 20260206

Claims (8)

1. A soldering tin verification system is characterized by comprising a cold disc, a waste heat recovery module, a heating module, a nitrogen input module, an oxygen concentration adjusting module and a laminar flow spray head, wherein, The nitrogen input module is connected with the waste heat recovery module and is used for inputting nitrogen into the waste heat recovery module so as to initially heat the nitrogen and obtain preheated nitrogen; The waste heat recovery module is connected with the heating module and is used for carrying out secondary heating on the preheated nitrogen to obtain hot nitrogen with target temperature; the laminar flow spray head is connected with the heating module and is used for uniformly spraying the hot nitrogen onto the surface of the carrier, and the welding spots on the carrier are heated by the hot nitrogen so as to finish solder verification; The oxygen concentration adjusting module is connected with the heating module and is used for detecting the oxygen concentration of a heating area in the heating module in the secondary heating process and dynamically adjusting the oxygen flow of the heating area according to the oxygen concentration so as to maintain the oxygen concentration of the heating area within a preset range; The soldering tin verification system is configured to adjust the temperature of a preheating disc and the fan power of a cold disc in the waste heat recovery module according to the transfer state of the carrier so as to compensate heat loss in the transfer process of the carrier, wherein the adjustment of the temperature of the preheating disc and the fan power of the cold disc in the waste heat recovery module according to the transfer state of the carrier comprises the steps of determining whether the heating module is started, heating the preheating disc to a first set temperature and reducing the fan power if the heating module is started, judging whether the carrier is transferred to the heating module if the heating module is not started, heating the target temperature of the heating module to a second set temperature if the carrier is transferred to the heating module, keeping the target temperature of the heating module at the second set temperature within a set time period, and recovering the target temperature of the heating module to the original target temperature after the set time period.
2. The system of claim 1, wherein the waste heat recovery module comprises a waste heat recoverer, a pre-heat tray, wherein, The waste heat recoverer is connected with the preheating disc and used for exchanging heat with the preheating disc; The preheating plate is used for transferring heat obtained through heat exchange to the nitrogen through the finned tube heat exchanger so as to perform preliminary heating on the nitrogen to obtain the preheated nitrogen, and the finned tube heat exchanger is arranged on the side wall of the preheating plate.
3. The system of claim 1, wherein the heating module is a micro-tube heater, wherein the power of the micro-tube heater is dynamically adjusted by a proportional-integral-derivative control algorithm.
4. A solder verification method applied to the system of any one of claims 1 to 3, the method comprising: determining whether the heating module is activated; If the heating module is started, heating the preheating plate to a first set temperature, and reducing the power of the fan; If the heating module is not started, judging whether the carrier is transferred to the heating module or not; If the carrier is transferred to the heating module, the target temperature of the heating module is raised to a second set temperature, and the target temperature of the heating module is kept at the second set temperature within a set period of time; after the set time period, the target temperature of the heating module is restored to the original target temperature; preliminary heating is carried out on the nitrogen through a waste heat recovery module, so that preheated nitrogen is obtained; The preheated nitrogen is heated for the second time through a heating module, so that hot nitrogen with target temperature is obtained; Based on a laminar flow spray head, uniformly spraying the hot nitrogen onto the surface of a carrier, and heating welding spots on the carrier by using the hot nitrogen to finish solder verification; And in the secondary heating process, detecting the oxygen concentration of a heating area in the heating module through an oxygen concentration adjusting module, and dynamically adjusting the flow of the hot nitrogen according to the oxygen concentration so as to maintain the oxygen concentration of the heating area within a preset range.
5. The method of claim 4, wherein the carrier is a wireless temperature measurement carrier, and correspondingly, after detecting the oxygen concentration of the heating region in the heating module by the oxygen concentration adjustment module and dynamically adjusting the flow of the hot nitrogen gas according to the oxygen concentration, further comprising: the temperature of the welding spots is monitored by adopting a wireless temperature measuring carrier, so that temperature data are obtained; and determining the state information of the welding spot according to the temperature data.
6. The method of claim 4, further comprising, after the detecting the oxygen concentration of the heating zone in the heating module by the oxygen concentration adjustment module and dynamically adjusting the flow rate of the hot nitrogen gas according to the oxygen concentration: collecting image data of the welding spots through a high-speed camera; performing image enhancement on the image data to obtain enhanced image data; extracting features of the enhanced image data to obtain target features; and inputting the target characteristics into a classifier, and determining the state information of the welding spots.
7. An electronic device is characterized by comprising a memory and a processor; The memory stores computer-executable instructions; The processor executing computer-executable instructions stored in the memory, causing the processor to perform the method of any one of claims 4-6.
8. A computer readable storage medium having stored therein computer executable instructions which when executed are adapted to implement the method of any of claims 4-6.

Description

Solder verification system, method, electronic device and storage medium Technical Field The present application relates to the field of electronic manufacturing technologies, and in particular, to a solder verification system, a solder verification method, an electronic device, and a storage medium. Background In the field of electronic manufacturing, solder verification is a key link for ensuring the welding quality of electronic components, especially in the scenes with high precision and high reliability requirements. At present, the mainstream solder verification scheme is to directly heat cold nitrogen through an electric heating element to enable the cold nitrogen to reach a preset target temperature, then the nitrogen after temperature rising is guided to be purged to a heating disc, and the heat convection and heat conduction mode is utilized to heat and verify welding spots on a carrier installed on the heating disc. However, this approach has significant limitations that can result in the actual temperature of the solder joint area being below a preset value, thereby reducing the stability and consistency of the solder joint weld. Disclosure of Invention The application provides a soldering tin verification system, a soldering tin verification method, electronic equipment and a storage medium, which are used for improving the stability and consistency of welding of a soldering point. In a first aspect, the present application provides a solder verification system comprising: comprises a waste heat recovery module, a heating module, a nitrogen input module, an oxygen concentration adjusting module and a laminar flow spray head, wherein, The nitrogen input module is connected with the waste heat recovery module and is used for inputting nitrogen into the waste heat recovery module so as to initially heat the nitrogen and obtain preheated nitrogen; The waste heat recovery module is connected with the heating module and is used for carrying out secondary heating on the preheated nitrogen to obtain hot nitrogen with target temperature; the laminar flow spray head is connected with the heating module and is used for uniformly spraying hot nitrogen onto the surface of the carrier, and the hot nitrogen is utilized to heat welding spots on the carrier so as to finish solder verification; The oxygen concentration adjusting module is connected with the heating module and is used for detecting the oxygen concentration of the heating area in the heating module in the secondary heating process and dynamically adjusting the oxygen flow of the heating area according to the oxygen concentration so as to maintain the oxygen concentration of the heating area within a preset range. In one possible embodiment, the waste heat recovery module comprises a waste heat recoverer, a pre-heat tray, wherein, The waste heat recoverer is connected with the preheating disc and used for carrying out heat exchange with the preheating disc; and the preheating plate is used for transferring heat obtained through heat exchange to nitrogen through the finned tube heat exchanger so as to perform preliminary heating on the nitrogen to obtain preheated nitrogen, wherein the finned tube heat exchanger is arranged on the side wall of the preheating plate. In one possible embodiment, the heating module is a micro-tube heater, wherein the power of the micro-tube heater is dynamically adjusted by a proportional-integral-derivative control algorithm. In a second aspect, the present application provides a solder verification method, for use in the above first aspect and/or various possible implementation manners of the first aspect, the method including: preliminary heating is carried out on the nitrogen through a waste heat recovery module, so that preheated nitrogen is obtained; the preheating nitrogen is subjected to secondary heating through a heating module, so that hot nitrogen with target temperature is obtained; based on a laminar flow spray head, hot nitrogen is uniformly sprayed onto the surface of the carrier, and welding spots on the carrier are heated by the hot nitrogen so as to finish solder verification; in the secondary heating process, the oxygen concentration of a heating area in the heating module is detected through the oxygen concentration adjusting module, and the flow of hot nitrogen is dynamically adjusted according to the oxygen concentration, so that the oxygen concentration of the heating area is maintained within a preset range. In one possible embodiment, before the preliminary heating of the nitrogen gas by the waste heat recovery module, the method further includes: according to the transfer state of the carrier, the temperature of the preheating disc and the fan power of the cooling disc in the waste heat recovery module are adjusted to compensate the heat loss in the transfer process of the carrier. In one possible embodiment, adjusting the temperature of the preheating tray and the fan power of the cooling tra