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CN-121670929-B - Large-scale flip-chip highlight exempts from to spray grid injection mold

CN121670929BCN 121670929 BCN121670929 BCN 121670929BCN-121670929-B

Abstract

The application discloses a large-scale flip-chip high-gloss spraying-free grid injection mold, which belongs to the technical field of injection molds and adopts the technical scheme that the large-scale flip-chip high-gloss spraying-free grid injection mold comprises a front mold mechanism and a rear mold mechanism, wherein the front mold mechanism is provided with a first substrate, a fixed front base, a first mold seat, a hot glue channel structure, a jacking device, a vacuumizing device and the like, the rear mold mechanism is provided with a second substrate, a fixed rear base, a second mold seat and the like, positioning lugs are inserted into positioning grooves to form a complete product cavity when the front mold and the rear mold are assembled, the hot glue channel structure feeds glue to nineteen glue feeding points through a plurality of injection pipes, and a control module adjusts the vacuumizing flow value of the vacuumizing device according to injection molding conditions, so that the effects of accurate assembly of the injection mold, controllable injection pressure and flow, uniform cavity temperature and quick air extraction are achieved, and the quality and the production efficiency of injection products are ensured.

Inventors

  • WU FEIFEI
  • SUN XIHENG
  • LI JIE
  • CUI YUPENG
  • YANG HAILONG

Assignees

  • 天津银宝山新科技有限公司

Dates

Publication Date
20260508
Application Date
20260205

Claims (8)

  1. 1. The large-scale flip-chip highlight spraying-free grid injection mold is characterized by comprising a front mold mechanism (1) and a rear mold mechanism (2) which are used for being fixed with an injection molding machine; The front mold mechanism (1) comprises a first substrate (11), a fixed front base (12) and a first mold seat (13), wherein the fixed front base (12) is connected with the first substrate (11), the first mold seat (13) is connected with the fixed front base (12), a first mold cavity (131) is formed in the first mold seat (13), and a positioning convex block (132) is arranged on the first mold seat (13); The rear mold mechanism (2) comprises a second substrate (21), a fixed rear base (22) and a second mold seat (23), wherein the fixed rear base (22) is connected with the second substrate (21), the second mold seat (23) is connected with the fixed rear base (22), a second mold cavity (231) is formed in the second mold seat (23), a positioning groove (232) is formed in the second mold seat (23), and the positioning groove (232) is matched with the positioning convex block (132); When the front die mechanism (1) and the rear die mechanism (2) are clamped, the positioning lug (132) is inserted into the positioning groove (232), and the first die cavity (131) and the second die cavity (231) are matched to form a complete product die cavity; The front mold mechanism (1) further comprises a hot glue channel structure (14), the hot glue channel structure (14) comprises a wire frame (141), a glue channel (142) and a plurality of injection molding pipes (143), the wire frame (141) is connected with the first substrate (11), the glue channel (142) is connected with the wire frame (141), the plurality of injection molding pipes (143) are all connected with the glue channel (142), a product cavity is provided with nineteen glue inlet points, each glue inlet point comprises ten side glue inlet points (1432) and nine straight glue inlet points (1433), the hot glue channel structure (14) is arranged at a set position, the glue channel (142) is provided with a glue inlet, the center of the glue inlet is taken as an origin, the length direction of the first mold seat (13) is taken as an X axis, the center coordinates of the glue outlet of the nineteenth glue inlet points are respectively taken as （0,76）、（-273,37）、（273、37）、（-508.27,-31.26）、（508.27,-31.26）、（34.5,-93.5）、（1,-186）、（-455,-246）、（455,-246）、（-211,246.5）、（-425,243.5）、（-270.92,-86.65）、（-254,-246）、（-640,-246）、（211,246.5）、（425,243.5）、（270.92,-86.65）、（254,-246）、（640,-246）, units mm, the glue inlet time of each glue inlet point is based on the setting distance between the glue inlet point and the origin, and each glue inlet point is connected with the glue inlet point (143) at the same time when the glue inlet point is located nearer; The front mold mechanism (1) further comprises a jacking device (16) for demolding products and a vacuumizing device (18) for vacuumizing the product cavity, the vacuumizing device (18) is electrically connected with a control module, the control module is configured to control vacuumizing time of the vacuumizing device (18) to be within 2s, the vacuumizing device (18) comprises a plurality of vacuum pumps (181), a vacuumizing branch pipe (182), a collecting pipe (183), a vacuumizing pipeline (184) and a plurality of air passage jacking blocks (185), the plurality of vacuum pumps (181) are fixedly connected with the first mold base (13), each vacuum pump (181) is connected with the vacuumizing branch pipe (182), the vacuumizing branch pipe (182) is communicated with the collecting pipe (183), and the collecting pipe (183) is communicated with the vacuumizing pipeline (184); the air channel jacking blocks (185) are respectively positioned at two ends of the first die cavity (131) along the length direction, the air channel jacking blocks (185) form a part of the first die cavity (131), a plurality of air suction ports are arranged on the air suction pipeline (184), air grooves (1851) are formed in the side walls of the air channel jacking blocks (185), the air grooves (1851) are used for communicating the corresponding air suction ports with the product die cavity, and the depth of the air grooves (1851) is 0.02mm; the injection molding pipes (143) are connected with a pressure sensor and a flowmeter for detecting injection molding pressure, the pressure sensor and the flowmeter are electrically connected with the control module, and the control module is configured to automatically adjust the air extraction flow value of the vacuumizing device (18) according to the filling speed, flow and injection molding pressure of each injection molding pipe (143); The front die mechanism (1) and the rear die mechanism (2) are connected with a temperature control device (3) for controlling the temperature of a product cavity, and the temperature control device is used for making the surface temperature of the cavity uniform; The front die mechanism (1) and the rear die mechanism (2) are both connected with an integrated energy source plate (5), and the integrated energy source plate (5) is connected with a plurality of interfaces for providing energy for each component.
  2. 2. The large-scale flip-chip high-gloss spraying-free grid injection mold of claim 1, wherein the die assembly fit clearance between the front die mechanism (1) and the rear die mechanism (2) is not more than 0.01mm.
  3. 3. The large-scale flip-chip high-gloss spraying-free grid injection mold according to claim 1, further comprising a guide positioning device (6), wherein the guide positioning device (6) comprises a positioning rod (61), a fixed shaft (62) and a bearing (63), a positioning slot (133) and a mounting groove (134) are formed in the first mold base (13), the positioning slot (133) is matched with the positioning rod (61), the mounting groove (134) is communicated with the positioning slot (133), the fixed shaft (62) and the bearing (63) are arranged in the mounting groove (134), the fixed shaft (62) is fixedly connected with the first mold base (13), the inner wall of the bearing (63) is fixedly connected with the fixed shaft (62), the outer wall of the bearing (63) protrudes out of the mounting groove (134), and when the first mold base (13) and the second mold base (23) are clamped, the positioning rod (61) is inserted into the positioning slot (133) and abuts against the bearing (63).
  4. 4. The large-scale flip-chip high-gloss spraying-free grid injection mold according to claim 1, wherein the rear mold mechanism (2) further comprises an active demolding device (24), and the active demolding device (24) comprises an elastic component (241) and an elastic block structure (242); The elastic block structure (242) comprises a first elastic block (2421), a second elastic block (2422), a third elastic block (2423), a fourth elastic block (2424), a fifth elastic block (2425) and a sixth elastic block (2426), wherein the first elastic block (2421) and the fourth elastic block (2424) are symmetrically arranged, the second elastic block (2422) and the fifth elastic block (2425) are symmetrically arranged, the third elastic block (2423) and the sixth elastic block (2426) are symmetrically arranged, the second elastic block (2422) is positioned between the first elastic block (2421) and the third elastic block (2423), the fifth elastic block (2425) is positioned between the fourth elastic block (2424) and the sixth elastic block (2426), the first elastic block (2421) and the third elastic block (2423) are respectively connected with one glue point (1432), and the second elastic block (2422) and the fourth elastic block (2424) are respectively connected with the fourth glue point (1432); The first elastic block (2421), the second elastic block (2422), the third elastic block (2423), the fourth elastic block (2424), the fifth elastic block (2425) and the sixth elastic block (2426) form a part of the second die cavity (231), and clamping grooves for forming grid buckles are formed in each elastic block; The elastic component (241) is connected with the first elastic block (2421), the second elastic block (2422), the third elastic block (2423), the fourth elastic block (2424), the fifth elastic block (2425) and the sixth elastic block (2426), the elastic component (241) is connected with the fixed back base (22), and the elastic component (241) is used for enabling the corresponding elastic blocks to tilt and move, and one end of the fixed back base (22) tilts to a direction away from each other from the other end.
  5. 5. The injection mold for the large-sized flip-chip high-gloss spraying-free grid, as set forth in claim 1, wherein the jacking device (16) comprises a jacking cylinder (161), a jacking plate (162), a jacking rod (163) and a jacking block (164), the jacking cylinder (161) is fixedly connected with the side wall of the first mold base (13), the jacking plate (162) is arranged between the first mold base (13) and the fixed front base (12), the first mold base (13) is provided with a movable groove (135) for the jacking plate (162) to move, the jacking plate (162) is arranged in the movable groove (135), the side wall of the jacking plate (162) is provided with a protruding plate, the protruding plate penetrates through the first mold base (13) to extend to the outside, a driving shaft of the jacking cylinder (161) is fixedly connected with the protruding plate, the jacking rod (163) is provided with a plurality of lifting plates, and the jacking plate (162) is connected with the jacking block (164), and the jacking block (164) is uniformly distributed in the first mold base (164), and the first mold base (164) is provided with a plurality of lifting blocks (164).
  6. 6. The large-scale flip-chip high-gloss spraying-free grid injection mold of claim 1, wherein the temperature control device (3) is a plurality of groups of water through pipelines (31), the water through pipelines (31) are connected with water sources, the distance between each water through pipeline (31) and the corresponding product cavity surface is 25mm, the diameter of each water through pipeline (31) is 15mm, and the distance between every two adjacent water through pipelines (31) is 80mm.
  7. 7. The large-scale flip-chip high-light spraying-free grid injection mold as claimed in claim 1 or 6, wherein the first mold seat (13) is connected with a mold cavity temperature sensor (17), the mold cavity temperature sensor (17) is electrically connected with the control module, and the control module is electrically connected with the temperature control device (3).
  8. 8. The large-scale flip-chip high-light spraying-free grid injection mold of claim 1, wherein the first mold seat (13) and the second mold seat (23) are embedded with a template temperature sensor (4), and the probe insertion depth of the template temperature sensor (4) is 200mm.

Description

Large-scale flip-chip highlight exempts from to spray grid injection mold Technical Field The application relates to the technical field of injection molds, in particular to a large-scale flip-chip high-gloss spraying-free grid injection mold. Background In the field of injection molds, with the vigorous development of industrial manufacturing, especially the continuous progress of industries such as automobiles, household appliances, aerospace and the like, the requirement for large injection molds is in an increasing situation. The large injection mold has the advantage of realizing high-efficiency and accurate manufacturing of large products, and plays a vital role in the production of products in various industries. Taking the automobile industry as an example, the design aesthetics of the automobile is continuously upgraded, the requirements of a luxury automobile on the appearance of the grille are extremely high, and the defects of mirror surface grade smoothness, no weld marks, no orange peel and the like are required to be achieved. Before the appearance of a large-scale flip-chip high-gloss spraying-free grid injection mold, the following methods are conventionally adopted for solving the grid injection molding problem. One is to adopt simple mould structure, and front mould and rear mould cooperate through ordinary connected mode, and the shaping of product die cavity relies on single mould chamber face, and the setting of advance gluey point is comparatively random, probably only sets up a small amount of advance gluey points in certain positions of mould, and the arrangement of injection molding pipe also lacks systemicity. During demolding, a single ejection device is adopted, and the product is ejected out of the mold by means of mechanical force. However, for the production of large-sized high-light grille molds (large-sized high-light grille specifications 1473×395×258mm, mold specifications 3450×1680× 1661.5 mm), conventional mold structures lack precise positioning and matching when closing the molds, resulting in inaccurate molding of product cavities and affecting product quality. The glue inlet points are unreasonably arranged, so that glue flows unevenly in the injection molding process, and the problems of bubbles, sink marks and the like are easy to generate. The complex grid adopts multi-gate design, and the fusion joint is easy to form weld marks, and the consistency is poor. The temperature control of the die is inaccurate, the uniformity of the surface temperature of the die cavity cannot be guaranteed, and the problems of deformation and the like of products in the forming process are caused. Disclosure of Invention In order to ensure that the injection mold is accurate in mold closing, controllable in injection pressure and flow, uniform in cavity temperature and rapid in air extraction, thereby ensuring the quality and the production efficiency of injection products, the invention provides the large-sized inverted highlight spraying-free grid injection mold. The invention provides a large-scale flip-chip highlight spraying-free grid injection mold, which adopts the following technical scheme: A large-scale flip-chip highlight spraying-free grid injection mold comprises a front mold mechanism and a rear mold mechanism; The front die mechanism comprises a first substrate, a fixed front base and a first die seat, wherein the fixed front base is connected with the first substrate, the first die seat is connected with the fixed front base, a first die cavity is formed in the first die seat, and a positioning protruding block is arranged on the first die seat; The rear die mechanism comprises a second substrate, a fixed rear base and a second die seat, wherein the fixed rear base is connected with the second substrate, the second die seat is connected with the fixed rear base, a second die cavity is formed in the second die seat, a positioning groove is formed in the second die seat, and the positioning groove is matched with the positioning convex block; when the front die mechanism and the rear die mechanism are matched, the positioning protruding block is inserted into the positioning groove, and the first die cavity and the second die cavity are matched to form a complete product die cavity; The front mold mechanism further comprises a hot glue channel structure, the hot glue channel structure comprises a wire frame, a glue flow channel and a plurality of injection molding pipes, the wire frame is connected with the first substrate, the glue flow channel is connected with the wire frame, the injection molding pipes are connected with the glue flow channel, a product cavity is provided with nineteen glue inlet points and nine straight glue inlet points, the nineteen glue inlet points are arranged at set positions, a glue inlet is arranged on the glue flow channel, the center of the glue inlet is taken as an origin, a coordinate system is established by taking the length directio