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CN-121693113-B - Surface detection equipment and detection system

CN121693113BCN 121693113 BCN121693113 BCN 121693113BCN-121693113-B

Abstract

The invention discloses surface detection equipment and a detection system, which comprise a clamping device, a first detection device and at least one clamping assembly, wherein the clamping device comprises a clamping mechanism and a Z-axis module for driving the clamping mechanism to lift, the clamping mechanism comprises a plurality of clamping units which are distributed at equal intervals along the circumferential direction of a wafer, the first detection device is positioned below the clamping device and comprises a visual mechanism and a first X-axis module which can drive the visual mechanism to move through the clamping device along the X-axis direction, the clamping unit comprises at least one clamping assembly, the clamping assembly comprises a clamping piece, an elastic piece and a driving cylinder, the clamping piece can be close to or far from the circumferential edge of the wafer along the radial direction of the wafer, a piston rod of the driving cylinder can drive the clamping piece to be far away from the wafer and enable the elastic piece to stretch, and when the driving cylinder is retracted, the elastic piece is further driven to rebound when the driving action of the clamping piece is retracted, the clamping piece is further driven to clamp the wafer, and the clamping piece is configured to form line contact with the circumferential edge of the wafer. By adopting the structure, the secondary damage in the wafer detection process can be effectively reduced.

Inventors

  • SUN FENG
  • ZHAO JIANHUA
  • JIANG LI

Assignees

  • 苏州赛腾精密电子股份有限公司

Dates

Publication Date
20260505
Application Date
20260206

Claims (10)

  1. 1. A surface inspection apparatus, comprising: The clamping device (100) comprises a clamping mechanism (110) for clamping a wafer (500) and a Z-axis module (120) for driving the clamping mechanism (110) to lift along the Z-axis direction, wherein the clamping mechanism (110) comprises a plurality of clamping units (130) which are distributed at equal intervals along the circumferential direction of the wafer (500); A first detection device (200) located below the clamping device (100) and comprising a vision mechanism (210) and a first X-axis module (220) capable of driving the vision mechanism (210) to move through the clamping device (100) along the X-axis direction; The clamping unit (130) comprises at least one clamping assembly (140), the clamping assembly (140) comprises a clamping piece (150), an elastic piece (160) and a driving air cylinder (170), the clamping piece (150) can be close to or far away from the periphery of the wafer (500) along the radial direction of the wafer (500), when a piston rod of the driving air cylinder (170) stretches out, the clamping piece (150) can be driven to be far away from the wafer (500) and the elastic piece (160) can be stretched, when the driving air cylinder (170) removes the driving action on the clamping piece (150), the elastic piece (160) rebounds to drive the clamping piece (150) to clamp the wafer (500), and the clamping piece (150) is configured to form line contact with the periphery of the wafer (500).
  2. 2. The surface inspection apparatus of claim 1, wherein the clamp (150) includes at least one clamping surface inclined to the Z-axis, the clamping surface configured to form a line contact with a ridge corresponding to a periphery of the wafer (500).
  3. 3. The surface inspection apparatus of claim 2, wherein the ridge is formed by an end face of the wafer (500) intersecting a peripheral edge of the wafer (500).
  4. 4. The surface inspection apparatus of claim 2, wherein the wafer (500) is provided with a chamfer (510) at its periphery, at least one of the clamping surfaces being in line contact with a ridge formed by the chamfer (510).
  5. 5. The surface inspection apparatus of claim 2, wherein the clamping member (150) includes an upper clamping surface (1521) and a lower clamping surface (1522) disposed at an included angle, the upper clamping surface (1521) and the lower clamping surface (1522) being inclined to the Z-axis, the upper clamping surface (1521) and the lower clamping surface (1522) respectively forming line contacts with different ridges corresponding to the periphery of the wafer (500).
  6. 6. The surface inspection apparatus of claim 5, wherein an angle α,60 ° - α <90 °) is provided between a horizontal plane at which a line of intersection of the upper clamping surface (1521) and the lower clamping surface (1522) is located and the upper clamping surface (1521); an included angle beta is formed between the horizontal plane of the intersection line of the upper clamping surface (1521) and the lower clamping surface (1522), and is more than or equal to 15 degrees and less than or equal to 30 degrees.
  7. 7. The surface inspection apparatus of claim 1, wherein the clamping mechanism (110) includes a base (180) for mounting each of the clamping units (130), the clamping member (150) comprising: a base (151) slidably connected to the base (180); The clamping block (152) is fixedly connected with the base body (151) and is positioned below the base (180); Wherein, centre gripping subassembly (140) including set up in base (180), and with mounting block (182) of centre gripping piece (150) one-to-one, elastic component (160) are connected between pedestal (151) and mounting block (182).
  8. 8. The surface inspection apparatus according to claim 7, characterized in that a limiting structure is provided between the mounting block (182) and the seat (151), said limiting structure being adapted to limit the extreme gripping position of the gripping member (150); An adjusting structure for adjusting the stretching degree of the elastic piece (160) is arranged between the base body (151) and the elastic piece (160) and/or between the mounting block (182) and the elastic piece (160).
  9. 9. The surface inspection apparatus of claim 7, wherein the number of the clamping units (130) is three and are circumferentially arranged on the base (180), each clamping unit (130) includes two clamping assemblies (140), the two clamping assemblies (140) are disposed at an acute angle, and the two clamping assemblies (140) of the same clamping unit (130) are gradually apart in a center-to-edge direction of the wafer (500).
  10. 10. A detection system, comprising: the surface inspection apparatus according to any one of claims 1 to 9; The bearing device (300) comprises a rotating table mechanism (310) for bearing and rotating the wafer (500) and a second X-axis module (320) for driving the rotating table mechanism (310) to move to a first detection station or a second detection station along the X-axis direction, and the clamping device (100) is positioned right above the rotating table mechanism (310) when the rotating table mechanism (310) is positioned at the first detection station; a second detection device (400) located at the second detection station; wherein the rotating table mechanism (310), the visual mechanism (210) and the clamping mechanism (110) are sequentially arranged from bottom to top along the Z axis, and the rotating table mechanism (310) and the visual mechanism (210) are suitable for moving along the X axis direction, so that projections of the rotating table mechanism (310), the visual mechanism (210) and the clamping mechanism (110) in the Z axis direction are not overlapped.

Description

Surface detection equipment and detection system Technical Field The invention relates to the technical field of appearance detection, in particular to surface detection equipment and a detection system. Background Currently, for defect detection on the back surface of a wafer, a clamping mechanism is generally adopted to grasp the wafer and transfer the wafer to the upper part of a vision mechanism so as to obtain back surface morphology information. However, the existing clamping mechanism has obvious defects, and is extremely easy to cause secondary damage to the wafer in the detection process. Specifically, the clamping mechanism adopts a hard clamping jaw, when the wafer is grabbed and released, the lack of buffered rigid contact can generate larger mechanical impact on the brittle wafer, friction and vibration exist in the wafer transferring process, and tiny relative displacement or vibration can be generated between the wafer and the clamping mechanism in the high-speed motion, scram or track conversion process, so that scratches or pollution are generated on the surface of the wafer. Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art. Disclosure of Invention The invention aims to provide surface detection equipment and a detection system, which can effectively reduce secondary damage in the wafer detection process. The invention aims at realizing the following technical scheme that the surface detection equipment comprises the following components: the clamping device comprises a clamping mechanism for clamping a wafer and a Z-axis module for driving the clamping mechanism to lift along the Z-axis direction, wherein the clamping mechanism comprises a plurality of clamping units which are distributed at equal intervals along the circumferential direction of the wafer; The first detection device is positioned below the clamping device and comprises a visual mechanism and a first X-axis module capable of driving the visual mechanism to move through the clamping device along the X-axis direction; The clamping unit comprises at least one clamping assembly, the clamping assembly comprises a clamping piece, an elastic piece and a driving air cylinder, the clamping piece can be close to or far away from the periphery of the wafer along the radial direction of the wafer, when a piston rod of the driving air cylinder stretches out, the clamping piece can be driven to be far away from the wafer and stretch the elastic piece, when the driving air cylinder withdraws the driving action of the clamping piece, the elastic piece rebounds to further drive the clamping piece to clamp the wafer, and the clamping piece is configured to form line contact with the periphery of the wafer. Further, the clamping member includes at least one clamping surface inclined to the Z axis, the clamping surface being configured to form a line contact with a ridge corresponding to the peripheral edge of the wafer. Further, the ridge line is formed by intersecting an end face of the wafer with a peripheral edge of the wafer. Further, the wafer circumferential edge is provided with a chamfer, and at least one clamping surface is in line contact with a ridge line formed by the chamfer. Further, the clamping piece comprises an upper clamping surface and a lower clamping surface which are arranged at an included angle, the upper clamping surface and the lower clamping surface are inclined to the Z axis, and the upper clamping surface and the lower clamping surface are respectively in line contact with the ridge line corresponding to the circumferential edge of the crystal. Further, an included angle alpha is formed between the horizontal plane where the intersection line of the upper clamping surface and the lower clamping surface is located and the upper clamping surface, and the included angle alpha is more than or equal to 60 degrees and less than or equal to 90 degrees; An included angle beta is formed between the horizontal plane where the intersection line of the upper clamping surface and the lower clamping surface is located and the lower clamping surface, and is more than or equal to 15 degrees and less than or equal to 30 degrees. Further, the clamping mechanism includes a base for mounting each of the clamping units, and the clamping member includes: The base body is connected with the base in a sliding manner; The clamping block is fixedly connected with the base and is positioned below the base; The clamping assembly comprises mounting blocks which are arranged on the base and correspond to the clamping pieces one by one, and the elastic pieces are connected between the base and the mounting blocks. Further, a limiting structure is arranged between the mounting block and the base body, and the limiting structure is suitable for limiting the limiting clamping position of the clamping piece; And an adjusting structure for adjusting the stretching degree of t