CN-121696488-B - Wafer reflow soldering device

CN121696488BCN 121696488 BCN121696488 BCN 121696488BCN-121696488-B

Abstract

The application provides a wafer reflow soldering device, which relates to the technical field of chip packaging and comprises a frame, an upper cover lifting device, a chamber device and a plurality of soldering devices, wherein the upper cover lifting device is arranged in the frame, the chamber device is arranged in the frame and comprises an upper cover component and a lower cover component, the lower cover component is connected with the frame, the upper cover component is connected with the upper cover lifting device so as to move up and down through the upper cover lifting device and can be separated from the lower cover component or be in butt joint with the lower cover component to form a sealed chamber, a plurality of wafer processing stations and conveying parts capable of sequentially conveying wafers to the plurality of wafer processing stations to heat the wafers step by step are arranged in the sealed chamber, and the plurality of soldering devices are respectively arranged corresponding to the plurality of wafer processing positions on a conveying path of the wafers. The wafer reflow soldering device provided by the application improves the uniformity of soldering temperature and simultaneously prevents the oxidation condition of wafer soldering.

Inventors

Cui Huimeng
LI ZIYAN
JIA XIAOYAN
YANG LI
DONG BIN

Assignees

诚联恺达(河北)科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20260212

Claims (5)

1. A wafer reflow soldering apparatus, comprising: A frame (1); the upper cover lifting device (2) is arranged inside the frame (1); the chamber device (4) is arranged in the frame (1), the chamber device (4) comprises an upper cover assembly and a lower cover assembly, the lower cover assembly is connected with the frame (1), the upper cover assembly is connected with the upper cover lifting device (2) so as to move up and down through the upper cover lifting device (2), the upper cover assembly can be separated from the lower cover assembly or is in butt joint with the lower cover assembly to form a sealed chamber, a sealed space formed after the upper cover assembly is in butt joint with the lower cover assembly is a first sealed space, and a plurality of wafer processing stations and conveying pieces capable of sequentially conveying wafers to the wafer processing stations to heat the wafers step by step are arranged in the sealed chamber; A plurality of welding devices (3), wherein the welding devices (3) are respectively arranged corresponding to a plurality of wafer processing positions on the conveying path of the wafer, and the heating temperatures of the welding devices (3) are sequentially increased; The upper cover assembly includes: the upper cover bottom plate (404), the upper cover bottom plate (404) is connected with the upper cover lifting device (2), and the upper cover bottom plate (404) is provided with a plurality of upper openings which respectively correspond to a plurality of wafer processing stations; A plurality of upper cavity flanges (401), wherein the upper cavity flanges (401) are arranged on the upper surface of the upper cover bottom plate (404) and correspond to the positions of the upper openings respectively, and the upper cavity flanges (401) can move up and down to open and close the upper openings; a plurality of revolving cylinders (406), the plurality of revolving cylinders (406) being provided to an edge of the upper cover bottom plate (404) and being capable of applying pressure to the upper cover assembly and the lower cover assembly when the upper cover assembly and the lower cover assembly are docked to form the sealed chamber; The lower cover assembly includes: A lower chamber flange (407), wherein the lower chamber flange (407) is arranged on the frame (1), and a plurality of lower openings are formed in positions, corresponding to the plurality of upper openings, on the lower chamber flange (407); A lower chamber flange bottom plate (414), wherein the lower chamber flange bottom plate (414) is connected with the lower surface of the lower chamber flange (407), and a plurality of lower opening positions are respectively provided with a lower chamber small flange (413) so as to be connected with the welding devices (3) one by one through the lower chamber small flanges (413); the welding device (3) is arranged to the bottom wall of the frame (1), the welding device (3) comprising: a lower heating base chamber flange (3108), said lower heating base chamber flange (3108) being connected to said lower chamber small flange (413); The heating plate framework (3101), a heating piece is arranged in the heating plate framework (3101), the heating plate framework (3101) can extend into the sealing cavity from the lower opening, the upper edge of the heating plate framework (3101) is tightly attached to a flow equalizing plate sealing groove (416) arranged below an air inlet flow equalizing plate (415) at the lower side of the upper cavity flange (401), flow equalizing plate sealing grooves (416) are arranged on the upper and lower sides of the air inlet flow equalizing plate (415), and sealing rings are pressed in to form a sealed second sealing space (418); A PIN needle lifting disk (3119), wherein the PIN needle lifting disk (3119) is located below the heating disk skeleton (3101) and is movable in the up-down direction; The PIN thermocouples (3102) are arranged on the upper surface of the PIN lifting disc (3119) and are distributed around the circle center of the wafer at equal intervals, and the upper ends of the PIN thermocouples (3102) penetrate through the heating disc framework (3101) to support the wafer; A wafer positioning sheet (3103) is arranged at the upper end of the PIN thermocouple (3102), the upper end of the wafer positioning sheet (3103) is higher than the plane where the upper surface of the wafer is located, and the wall surface of the wafer positioning sheet (3103) abutted against the edge of the wafer is an inclined surface inclined towards the direction deviating from the wafer; The welding device (3) further comprises: A heating base cavity floor (3110), the heating base cavity floor (3110) being located below the lower heating base cavity flange (3108); A lower heating base chamber wall (3109), the lower heating base chamber wall (3109) disposed between the heating base chamber floor (3110) and the lower heating base chamber flange (3108); A base lift support plate (3112), the base lift support plate (3112) being located below the heating base cavity floor (3110); A base elevation support column (3111), both ends of the base elevation support column (3111) being connected between the heating base cavity bottom plate (3110) and the base elevation support plate (3112), respectively; And the electric pushing cylinder (3122) is arranged on the heating base cavity bottom plate (3110), and the telescopic end of the electric pushing cylinder (3122) is connected with the PIN needle lifting disc (3119).
2. A wafer reflow soldering apparatus in accordance with claim 1, wherein the soldering apparatus (3) further comprises: A base elevating mechanism connection plate (3117), the upper surface of the base elevating mechanism connection plate (3117) being connected to the lower portion of the heating pan frame (3101); And a cylinder (3113), the cylinder (3113) being provided to a lower surface of the base elevation support plate (3112), an output shaft of the cylinder (3113) being connected to a lower surface of the base elevation mechanism connection plate (3117).
3. The wafer reflow soldering apparatus in accordance with claim 2, wherein the heating plate frame (3101) includes: The upper surface of the heating plate is provided with a concave cavity, and the edge of the heating plate can be abutted against the lower surface of the upper cover bottom plate (404) to form a heating cavity; the chuck support plate (3106), the cross section of chuck support plate (3106) is T type structure, the upper surface of chuck support plate (3106) with the lower surface of heating plate is connected, the lower extreme of chuck support plate (3106) passes heating base chamber bottom plate (3110) with the output shaft end connection of cylinder (3113).
4. A wafer reflow soldering apparatus in accordance with claim 3, wherein the upper cover lifting means (2) comprises: The two transmission assemblies are connected with the upper cover bottom plate (404) of the upper cover assembly, and the two transmission assemblies are arranged opposite to the diagonal line of the upper cover bottom plate (404); the motor (203) is arranged on the upper surface of the frame (1), and an output shaft of the motor (203) is connected with the two transmission assemblies through a speed reducer (206).
5. The wafer reflow soldering apparatus of claim 4, wherein the drive assembly includes: a guide shaft support plate (210), the guide shaft support plate (210) being connected to the frame (1); an optical axis fixing base (211), the optical axis fixing base (211) being provided to an upper surface of the guide shaft support plate (210); A lead screw bearing housing (221), the lead screw bearing housing (221) being provided to an upper surface of the guide shaft support plate (210); An upper cover support (214), the upper cover support (214) being connected to the upper cover base (404); The linear optical axis (212), the said linear optical axis (212) passes the said upper cover support frame (214), and the both ends of the said linear optical axis (212) connect to the said optical axis fixing base (211) and said stander (1) separately; The screw rod (216) penetrates through the upper cover supporting frame (214) and is matched with the upper cover supporting frame (214) through a screw rod nut (217), and two ends of the screw rod (216) are respectively connected to the screw rod bearing seat (221) and the rack (1).

Description

Wafer reflow soldering device Technical Field The application relates to the technical field of chip packaging, in particular to a wafer reflow soldering device. Background Along with rapid iteration of the global semiconductor industry in the high-density, miniaturized and high-reliability directions, advanced packaging technologies such as Wafer Level Packaging (WLP), system In Package (SiP) and the like become core paths for improving the performance of chips, and wafer reflow soldering is used as a key process for realizing accurate connection between the chips and the substrate and interconnection bumps in a packaging process, and the device performance of a wafer reflow soldering device directly determines the yield and reliability of terminal products. Wherein reflow is a process of gradually melting solder paste smeared on the surface of the wafer into a molten state by heating. The traditional welding equipment has a plurality of limitations that the hot air reflow oven adopted in the early stage is difficult to realize the precise control of the temperature of a wafer level micro-area, the defects of bump oxidation, solder overflow and the like are easily caused, the traditional infrared reflow equipment is heated unevenly, the processing requirements of wafers with the size of 300mm and larger cannot be adapted, the heating rate is low, and the process requirements of high-density interconnection are difficult to meet. With the continuous improvement of chip integration, bump pitches are reduced from micron level to nanometer level, more severe standards are provided for temperature uniformity, thermal stress control and pollutant removal efficiency in the welding process, and the traditional equipment cannot match the technical indexes of the advanced process. In addition, since solder paste smeared on the surface of the wafer is easy to oxidize, the sealing performance of the wafer reflow soldering device needs to be improved, and the solder paste is prevented from being oxidized. Disclosure of Invention The application aims to solve the problems and provide a wafer reflow soldering device which can improve the uniformity of soldering temperature and prevent the oxidation of wafer soldering. The application provides a wafer reflow soldering device which comprises a frame, an upper cover lifting device, a cavity device and a plurality of soldering devices, wherein the upper cover lifting device is arranged in the frame, the cavity device is arranged in the frame and comprises an upper cover assembly and a lower cover assembly, the lower cover assembly is connected with the frame, the upper cover assembly is connected with the upper cover lifting device so as to move up and down through the upper cover lifting device and can be separated from the lower cover assembly or is in butt joint with the lower cover assembly to form a sealed cavity, a plurality of wafer processing stations and conveying pieces capable of sequentially conveying wafers to the plurality of wafer processing stations to heat the wafers step by step are arranged in the sealed cavity, and the plurality of soldering devices are respectively arranged corresponding to the plurality of wafer processing positions on a conveying path of the wafers and sequentially increase heating temperatures of the plurality of soldering devices. According to the technical scheme provided by certain embodiments of the application, the upper cover assembly comprises an upper cover bottom plate, a plurality of upper cavity flanges, a plurality of rotary cylinders and a plurality of lower cover assemblies, wherein the upper cover bottom plate is connected with the upper cover lifting device, the upper cover bottom plate is provided with a plurality of upper openings corresponding to a plurality of wafer processing stations respectively, the upper cavity flanges are arranged on the upper surface of the upper cover bottom plate and correspond to the positions of the upper openings respectively, the upper cavity flanges can move in the up-down direction to open and close the upper openings, and the rotary cylinders are arranged at the edges of the upper cover bottom plate and can apply pressure to the upper cover assembly and the lower cover assembly when the upper cover assembly and the lower cover assembly are butted to form the sealing chamber. According to the technical scheme provided by certain embodiments of the application, the lower cover assembly comprises a lower chamber flange, a lower chamber flange bottom plate and lower chamber flange bottom plates, wherein the lower chamber flange is arranged on the frame, a plurality of lower openings are formed in positions, corresponding to the plurality of upper openings, of the lower chamber flange, the lower chamber flange bottom plate is connected with the lower surface of the lower chamber flange, and lower chamber small flanges are arranged in positions, corresponding to the plurality of lower ope