CN-121702592-B - Flexible temperature and stress integrated sensor array based on shielding strip and preparation method

CN121702592BCN 121702592 BCN121702592 BCN 121702592BCN-121702592-B

Abstract

The invention discloses a flexible temperature and stress integrated sensor array based on shielding strips and a preparation method thereof, and relates to the technical field of microelectronics, wherein the sensor array comprises a first conductive layer and a second conductive layer, wherein the first conductive layer comprises a plurality of first wires which are arranged in parallel along a first direction; the first conductive layer comprises a plurality of second conductive wires which are arranged in parallel along a second direction, the first conductive wires and the second conductive wires define a plurality of areas which are arranged in an array, each area comprises four subareas which are arranged diagonally, two stress sensors and one temperature sensor are arranged in each area, the shielding strip layer is positioned between the first conductive layer and the second conductive layer and comprises a plurality of shielding strips which are arranged in parallel along the second direction, and the second conductive wires are positioned on the upper surface of the shielding strips, wherein the first direction and the second direction are intersected. The invention obviously reduces the area occupation ratio of the wires in the traditional layout and greatly improves the effective utilization rate of the sensing area.

Inventors

ZHANG JIE
Liu Jueliang
YUN XIAOLI
JIANG CHAO
WANG JIANJUN
HUANG JIN
ZHAO PENGBING
YANG YUPENG

Assignees

西安电子科技大学

Dates

Publication Date: 20260505
Application Date: 20260213

Claims (8)

1. An integrated temperature and stress sensor array based on shielding strips, comprising: A first conductive layer including a plurality of first conductive lines arranged in parallel along a first direction; the first conducting wire and the second conducting wire define a plurality of areas which are arranged in an array, each area comprises four subareas which are arranged diagonally, and each area is provided with two stress sensors and one temperature sensor; a shielding strip layer, which is positioned between the first conductive layer and the second conductive layer and comprises a plurality of shielding strips which are arranged in parallel along a second direction, wherein the second wires are positioned on the upper surface of the shielding strips; wherein the first direction intersects the second direction; the adjacent three first wires form a first wire unit, wherein in the first wire unit, the distance between the first group of two adjacent first wires is smaller than the distance between the second group of two adjacent first wires; The first wire unit and the second wire define one area, and the area comprises two first subareas defined by a first group of two adjacent first wires and the second wires and two second subareas defined by a second group of two adjacent first wires and the second wires; only one of the two first sub-areas in the same area is provided with a stress sensor, one of the two second sub-areas in the same area is provided with a stress sensor, the other is provided with a temperature sensor, and both sides of the temperature sensor are provided with the stress sensors.
2. The shielding strip based flexible temperature and stress integrated sensor array of claim 1, wherein the first conductive layer further comprises a first electrode connected to the first wire, a portion of the first wire connected first electrode being connected to the stress sensor, and a portion of the first wire connected first electrode being connected to the temperature sensor.
3. The shielding strip based flexible temperature and stress integrated sensor array of claim 1, wherein the second conductive layer further comprises a second electrode connected to the second wire, the second electrode connected to the same second wire being connected to both the stress sensor and the temperature sensor.
4. The shielding strip based flexible temperature and stress integrated sensor array of claim 1, wherein the first conductive layer further comprises a first lead, one end of the first lead being connected to the first wire, the other end of the first lead being connected to a first interface for insertion of an FPC connector; The second conductive layer further comprises a second lead, one end of the second lead is connected with the second lead, the other end of the second lead is connected with a second interface, and the second interface is used for being inserted into the FPC connector.
5. The shielding strip based flexible temperature and stress integrated sensor array of claim 1, wherein two stress sensors and one temperature sensor within the same area are used as a set of sensing units, wherein, The resistance change of the temperature sensor in the sensing unit is caused by temperature and the resistance change of the stress sensor is caused by temperature and stress.
6. The shielding strip based flexible temperature and stress integrated sensor array of claim 5, wherein decoupling the resistance change of the stress sensor due to temperature and the resistance change of the stress sensor due to stress comprises: when two-dimensional calibration is performed, defining a plurality of different temperature calibration points in a range of 25-100 ℃, applying different stresses to the stress sensor at each temperature calibration point, and acquiring a corresponding relation curve of the resistance and the stress of the stress sensor; during actual measurement, a temperature sensor in the sensing unit is adopted to acquire the temperature of the current stress sensor, a corresponding relation curve of the resistance and the stress of the stress sensor is selected according to the current temperature, and the interval in which the resistance is located is acquired through the resistance of the stress sensor And corresponding stress interval Calculating the predicted stress of the stress sensor using a linear interpolation formula, expressed as: ; Wherein, the Representing the acquired first Stress data for each of the index points, Representing the acquired first Stress data for each of the index points, Representing the acquired first The resistance data of the individual calibration points, Representing the acquired first The resistance data of the individual calibration points, The sequence number representing the index point is indicated, Indicating the current resistance value of the stress sensor, Representing the stress values predicted using linear interpolation.
7. A method for preparing the shielding strip-based flexible temperature and stress integrated sensor array according to any one of claims 1 to 6, comprising the steps of: Providing a substrate; Preparing a first conductive layer on the upper surface of the substrate, wherein the first conductive layer comprises a plurality of first wires which are arranged in parallel along a first direction; preparing a shielding strip layer on the upper surface of the first conductive layer, wherein the shielding strip layer comprises a plurality of shielding strips which are arranged in parallel along a second direction, and the first direction is intersected with the second direction; preparing a second conductive layer on the upper surface of the shielding strip layer, wherein the second conductive layer comprises a plurality of second wires which are arranged in parallel along a second direction; preparing a stress sensor on the upper surface of the substrate, wherein the stress sensor is positioned in an area defined by the first lead and the second lead; The temperature sensor is arranged in an area defined by the first conducting wires and the second conducting wires, wherein three adjacent first conducting wires form a first conducting wire unit, the distance between the first group of adjacent two first conducting wires in the first conducting wire unit is smaller than the distance between the second group of adjacent two first conducting wires, the first conducting wire unit and the second conducting wires define an area, the area comprises two first subareas defined by the first group of adjacent two first conducting wires and the second conducting wires and two second subareas defined by the second group of adjacent two first conducting wires and the second conducting wires, the stress sensor is arranged in only one first subarea in the two first subareas in the same area, the stress sensor is arranged in the other second subarea in the two second subareas in the same area, and the temperature sensors are arranged on two sides of the temperature sensor.
8. The method for manufacturing an integrated temperature and stress sensor array based on shielding strips according to claim 7, further comprising: and packaging a polyimide film on the upper surface of the sensor array.

Description

Flexible temperature and stress integrated sensor array based on shielding strip and preparation method Technical Field The invention belongs to the technical field of microelectronics, and particularly relates to a shielding strip-based flexible temperature and stress integrated sensor array and a preparation method thereof. Background In recent years, with the development of microelectronic technology, flexible sensors with variable performance parameters have come into the public view. The flexible sensor has wide application in the fields of intelligent robots, intelligent medical treatment, intelligent transportation, new material industry, industrial production and the like. Currently, single flexible stress, temperature and humidity sensors are favored by many researchers, and a great deal of research has been carried out, and the principle is generally that the change of environmental physical quantity is converted into the change of electrical signals such as resistance, capacitance and the like of the sensor, and the manufacturing modes are also divided into a plurality of modes, such as screen printing, ink-jet printing, surface spraying and the like. In the prior art, for a flexible sensor unit, a flexible temperature sensor based on a cross-linked PEDOT: PSS is developed by a researcher, and the prepared temperature sensor has excellent stability under the environment of 30-80% Relative Humidity (RH) by introducing a cross-linking agent and a fluorinated polymer passivating agent (CYTOP), and the temperature sensitivity coefficient is as high as-0.77%/K within 25-50 ℃. And a researcher prepares a temperature sensitive unit on a PET substrate by taking reduced graphene oxide (r-GO), single-wall carbon nanotubes (SWCNTs) and multi-wall carbon nanotubes (MWCNTs) as sensitive materials respectively through a spray coating mode, and test results show that compared with the r-GO, the temperature sensitive unit has the most excellent temperature sensitive characteristic, has a negative resistance temperature coefficient, has a resistance temperature coefficient of 6.345 multiplied by 10 -3/° C, and has response time of 1.2s, but the temperature sensor has low precision. And researchers aim at the difficulty in realizing high temperature and transient response of the temperature sensor at the same time, and a flexible sensing array based on an ultrathin molybdenum-tungsten-sulfur alloy film is provided, so that the prepared flexible temperature sensor can realize transient response to temperature within an ultra-wide temperature range (-253-800 ℃), but has poor testing precision aiming at a high-temperature environment and can only monitor temperature physical quantity. Also, researchers have prepared conductive composite inks from CNT and polydimethylsiloxane, and multi-walled carbon nanotubes/polydimethylsiloxane (MWCNT/PDMS) flexible strain sensors with up to 100% working range but sensitivity (GF) of only 1.55, by screen printing. There have also been researchers using screen printing technology to make a flexible strain sensor of LIG using Laser Induced Graphene (LIG) on PDMS flexible substrates with a sensitivity of 96 at 0-13% strain, which, through performance testing, exhibits good I-V characteristics, stable step response, fast response speed (about 0.24 s) and recovery speed (about 0.25 s) and good durability (over 1000 cycles), but its manufacturing process is complex and manufacturing cost is high. For sensor array integration, researchers also manufacture a 4 multiplied by 4 strain sensor array by a direct writing printing technology, the sensor array has a sensitivity coefficient of 14.5 and can monitor strain in the range of 0-1.5 percent, and the sensor array has smaller sensitivity coefficient and strain monitoring range and can only monitor physical quantity of strain although the sensor array integration is carried out. In the flexible sensing field, the manufacturing modes of the sensor mainly include direct writing printing, ink-jet printing, screen printing and the like. Inkjet printing and direct-write printing, while exhibiting advantages in sensor customization and complex structure fabrication, are still faced with three constraints of cost, efficiency and materials in practical applications as high-precision additive manufacturing techniques. From the cost perspective, inkjet printing and direct-write printing technologies rely on expensive precision printing equipment, the price of which directly determines the molding quality of the final sensor, the printing speed is relatively slow in efficiency, and particularly when preparing large-area sensor arrays, the single-pass printing coverage is limited, and multiple splices or repeated scans are often required, so that the overall output efficiency is reduced, and performance non-uniformity can be possibly caused by alignment deviation. Screen printing processes offer certain advantages over printing in terms of available man