CN-121711899-B - Circuit board glue removing method, controller, glue removing equipment, system and circuit board

CN121711899BCN 121711899 BCN121711899 BCN 121711899BCN-121711899-B

Abstract

The application is suitable for the technical field of industry, and provides a circuit board glue removing method, a controller, glue removing equipment, a system and a circuit board. The circuit board glue removing method comprises the steps of detecting outline information of a glue overflow area on a circuit board to be processed after a high polymer material layer is pressed on the circuit board to be processed, dividing the glue overflow area into one or more sub-scanning areas, generating a laser scanning path corresponding to the sub-scanning areas according to the local glue overflow width of the glue overflow area in each sub-scanning area, obtaining a laser scanning pattern formed by the sub-scanning areas, and executing laser glue removing operation on the glue overflow area according to the laser scanning pattern. The embodiment of the application can reduce the ineffective glue removing area and improve the precision and efficiency of glue removing.

Inventors

Hou Linjian
LIN XIAOJUN
CHEN GUODONG
LV HONGJIE

Assignees

深圳市大族微电子科技有限公司

Dates

Publication Date: 20260508
Application Date: 20260213

Claims (12)

1. The method for removing the adhesive of the circuit board is characterized by comprising the following steps of: after the high polymer material layer is pressed on the circuit board to be processed, detecting outline information of a glue overflow area on the circuit board to be processed, wherein the outline information comprises global glue overflow widths, and the global glue overflow widths comprise glue overflow widths of all positions in the glue overflow area; dividing the glue overflow area into one or more sub-scanning areas, and generating a laser scanning path corresponding to each sub-scanning area according to the local glue overflow width of the glue overflow area in each sub-scanning area to obtain a laser scanning pattern formed by each sub-scanning area, wherein the local glue overflow width comprises the glue overflow width of each position of the glue overflow area in the corresponding sub-scanning area; and executing laser photoresist removing operation on the photoresist overflow area according to the laser scanning pattern.
2. The method for removing glue from a circuit board according to claim 1, wherein the generating a laser scan path corresponding to a sub-scan area according to the local glue overflow width of the glue overflow area in each sub-scan area comprises: Determining the long side direction of each sub-scanning area; and determining a laser scanning path corresponding to the sub-scanning area and scanning along the long side direction of the sub-scanning area according to the local glue overflow width in each sub-scanning area and the spot size during laser scanning.
3. The method for removing photoresist from a circuit board according to claim 2, wherein determining a laser scanning path corresponding to the sub-scanning area and scanning along a long side direction of the sub-scanning area according to the local photoresist overflow width in each sub-scanning area and the spot size during laser scanning comprises: Determining the distribution position of a local glue overflow area in each sub-scanning area on the circuit board to be processed; If the distribution position is the corner position of the circuit board to be processed, dividing the local glue overflow area in the sub-scanning area into two sub-areas along the extension line of one side of the pressing area, determining sub-scanning paths corresponding to the sub-areas and scanning along the long side direction of the sub-areas according to the sub-local glue overflow width and the light spot size of each sub-area, and combining the sub-scanning paths of all the sub-areas in the same sub-scanning area to obtain a laser scanning path corresponding to the sub-scanning area; And if the distribution position is a non-corner position of the circuit board to be processed, determining a laser scanning path which corresponds to the sub-scanning area and scans along the long side direction of the sub-scanning area according to the local glue overflow width and the light spot size in each sub-scanning area.
4. The method for removing photoresist from a circuit board according to claim 2, wherein said determining the long side direction of each sub-scanning area comprises: Determining the distribution position of a local glue overflow area in each sub-scanning area on the circuit board to be processed; If the distribution position is a non-corner position of the circuit board to be processed, determining a long-side direction corresponding to each sub-scanning area according to a long-side extending direction of a circumscribed rectangle of the local glue overflow area in each sub-scanning area; If the distribution positions are corner positions of the circuit board to be processed, dividing the local glue overflow area into two sub-areas along the extension line of one side of the pressing area according to the aim of minimizing the number of scanning paths in the sub-scanning area, and determining the long side direction of each sub-area according to the long side extension direction of the circumscribed rectangle of the local glue overflow area in each sub-area.
5. The method for removing glue from a circuit board according to any one of claims 1 to 4, wherein the profile information includes a global glue overflow thickness, and the global glue overflow thickness includes glue overflow thicknesses at respective positions in the glue overflow area; determining laser scanning power corresponding to each sub-scanning area according to the local glue overflow thickness of the glue overflow area in each sub-scanning area; And executing laser glue removing operation on the glue overflow area according to the laser scanning pattern, wherein the laser glue removing operation is executed on the glue overflow area in each sub-scanning area according to the corresponding laser scanning power.
6. The method for removing adhesive from a circuit board according to any one of claims 1 to 4, wherein the sub-scanning areas are adjacently arranged to form an area array distributed annularly along the outer periphery of the bonding area; The dividing the glue overflow area into one or more sub-scanning areas includes: Aligning one side of the area array with one side of the rectangle circumscribed by the glue overflow area to divide the glue overflow area into one or more sub-scanning areas; Or dividing the glue overflow area into one or more sub-scanning areas with the aim of minimizing the local glue overflow width variation in each sub-scanning area; Or setting the central position of the initial sub-scanning area in the area array and a preset target point on the circuit board to be processed according to a preset relative position relationship so as to divide the glue overflow area into one or more sub-scanning areas.
7. The method for removing glue from a circuit board according to any one of claims 1 to 4, wherein the performing a laser glue removing operation on the glue overflow area according to the laser scanning pattern includes: According to the distribution sequence of each sub-scanning area in the preset direction, performing laser photoresist removing operation on the local photoresist overflow area in each sub-scanning area in sequence; Or sequencing the sub-scanning areas according to the maximum glue overflow thickness or the maximum glue overflow width, and sequentially executing laser glue removal operation on the local glue overflow areas in the sub-scanning areas according to the sequencing order.
8. The method for removing glue from a circuit board according to any one of claims 1 to 4, wherein the detecting the profile information of the glue overflow area on the circuit board to be processed includes: and in the target positioning process, controlling a contour detection sensor to scan the circuit board to be processed to obtain the contour information.
9. A controller comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the steps of the method for removing glue from a circuit board according to any one of claims 1 to 8 when the computer program is executed by the processor.
10. A glue removal apparatus, comprising: The device comprises a processing platform, a contour detection sensor, a photoresist removing laser and a controller, wherein the processing platform, the contour detection sensor and the photoresist removing laser are all connected with the controller; The processing platform is used for bearing a circuit board to be processed; the contour detection sensor is used for collecting contour information of the circuit board to be processed; The controller is used for controlling the photoresist removing laser to perform laser photoresist removing operation on the circuit board to be processed based on the method as claimed in any one of claims 1 to 8.
11. A circuit board processing system, characterized in that the circuit board processing system comprises a pressing device and the adhesive removing device of claim 10; The pressing equipment is used for pressing and processing the circuit board to be processed, so that glue overflow is formed on the periphery of the circuit board to be processed; The photoresist removing device is used for performing laser photoresist removing operation on the circuit board to be processed based on the method of any one of claims 1 to 8.
12. A wiring board, wherein the wiring board is processed by the wiring board processing system according to claim 11.

Description

Circuit board glue removing method, controller, glue removing equipment, system and circuit board Technical Field The application belongs to the technical field of industry, and particularly relates to a circuit board glue removing method, a controller, glue removing equipment, a system and a circuit board. Background A circuit board is a packaging substrate used to carry and interconnect different chips and/or electronic components. In the manufacturing process of the circuit board, after the lamination of the high polymer material layer, such as an ABF (Ajinomoto Build-up Film) Film, a polyester (PET, polyethylene Terephthalate) Film and the like, is performed on the circuit layer, the high polymer material has certain fluidity, and after lamination, the board edge can extrude an irregularly distributed glue overflow area, and the overflowed high polymer material can interfere with the subsequent working procedure, so that the glue overflow area needs to be cleaned to perform lamination on the copper foil layer of the next layer. However, since the glue overflow distribution after each lamination is different, in the related art, when the laser glue removal process is used to remove the glue overflow, in order to ensure that the irregular glue overflow profile is completely covered, a regular processing pattern (such as a ring shape) capable of surrounding the whole glue overflow area is generally set, and a laser scanning path (such as a single parallel straight line scanning track) with uniform and fixed density and direction is adopted in the processing pattern to perform full-coverage scanning, but the ineffective glue removal area in this way is large and the glue removal efficiency is low. Disclosure of Invention The embodiment of the application provides a circuit board glue removing method, a controller, glue removing equipment, a system and a circuit board, which can reduce invalid glue removing areas and improve the precision and efficiency of glue removing. The first aspect of the embodiment of the application provides a circuit board glue removing method, which comprises the steps of detecting outline information of glue overflow areas on a circuit board to be processed after a high polymer material layer is pressed on the circuit board to be processed, wherein the outline information comprises global glue overflow widths, the global glue overflow widths comprise glue overflow widths of all positions in the glue overflow areas, dividing the glue overflow areas into one or more sub-scanning areas, generating laser scanning paths corresponding to the sub-scanning areas according to the local glue overflow widths of the glue overflow areas in each sub-scanning area, obtaining laser scanning patterns formed by all the sub-scanning areas, wherein the local glue overflow widths comprise the glue overflow widths of all positions of the glue overflow areas in the corresponding sub-scanning areas, and executing laser glue removing operation on the glue overflow areas according to the laser scanning patterns. In some embodiments of the first aspect, generating a laser scan path corresponding to the sub-scan area according to the local flash width in each sub-scan area includes determining a long side direction of each sub-scan area, and determining a laser scan path corresponding to the sub-scan area and scanning along the long side direction of the sub-scan area according to the local flash width in each sub-scan area and a spot size at the time of laser scanning. In some embodiments of the first aspect, determining a laser scanning path corresponding to a sub-scanning area and scanning along a long side direction of the sub-scanning area according to a local glue overflow width in each sub-scanning area and a spot size during laser scanning includes determining a distribution position of the local glue overflow area in each sub-scanning area on a circuit board to be processed, dividing the local glue overflow area in the sub-scanning area into two sub-areas along an extension line of one side of a press-fit area if the distribution position is a corner position of the circuit board to be processed, determining a sub-scanning path corresponding to the sub-areas and scanning along the long side direction of the sub-areas according to the local glue overflow width and the spot size of each sub-area, combining the sub-scanning paths of each sub-area in the same sub-scanning area to obtain the laser scanning path corresponding to the sub-scanning area, and determining the scanning path corresponding to the sub-scanning area along the long side direction of the sub-scanning area if the distribution position is a non-corner position of the circuit board to be processed according to the local glue overflow width and the spot size in each sub-scanning area. In some embodiments of the first aspect, determining the long-side direction of each sub-scanning area includes determining a distribution position of a lo