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CN-121715317-B - Acoustic atomization chip and manufacturing method thereof

CN121715317BCN 121715317 BCN121715317 BCN 121715317BCN-121715317-B

Abstract

The invention discloses an acoustic atomization chip and a manufacturing method thereof. The acoustic atomization chip comprises a piezoelectric substrate, a transducer, a protective layer, a transitional connecting layer, a supporting layer and a liquid transmission medium, wherein the transducer is arranged on the upper surface of the piezoelectric substrate, the protective layer covers the upper surface of the transducer, the lower surface of the piezoelectric substrate is tightly attached to the supporting layer through the transitional connecting layer, the transducer comprises two groups of symmetrical interdigital transducers, two rows of mechanical vibration sound waves with megahertz frequencies which are propagated in opposite directions can be excited on the surface of the piezoelectric substrate, a first accommodating hole and a second accommodating hole are respectively formed in the areas, corresponding to the aperture range of the transducer, of the piezoelectric substrate and the supporting layer, and the liquid transmission medium is arranged in an area space defined by the first accommodating hole and the second accommodating hole to form a medium transmission channel.

Inventors

  • LEI YULIN
  • XU YONGPENG

Assignees

  • 深圳市深芯智创科技有限公司

Dates

Publication Date
20260508
Application Date
20260226

Claims (7)

  1. 1. An acoustic atomization chip is characterized by comprising a piezoelectric substrate (1), a transducer (2), a protective layer (3), a transitional connection layer (4), a supporting layer (5) and a liquid transmission medium (6); The transducer (2) is arranged on the upper surface of the piezoelectric substrate (1), the protective layer (3) covers the upper surface of the transducer (2), and the lower surface of the piezoelectric substrate (1) is tightly attached to the supporting layer (5) through the transition connecting layer (4); The transducer (2) comprises two groups of symmetrical interdigital transducers, and can excite two rows of mechanical vibration sound waves with megahertz frequency which are propagated in opposite directions on the surface of the piezoelectric substrate (1); the piezoelectric substrate (1) and the supporting layer (5) are respectively provided with a first accommodating hole (11) and a second accommodating hole (51) in the area corresponding to the aperture range of the transducer (2), and the liquid transmission medium (6) is arranged in the area space defined by the first accommodating hole (11) and the second accommodating hole (51) to form a medium transmission channel; The center area of the piezoelectric substrate (1) is provided with a first accommodating hole (11), the center area of the supporting layer (5) is provided with a second accommodating hole (51), and the center lines of the first accommodating hole (11) and the second accommodating hole (51) are overlapped; The distance between the edge line of the first accommodating hole (11) along the direction perpendicular to the finger strip of the transducer (2) and the edge line of the inner side of the transducer (2) is larger than a first preset distance value, the edge line of the first accommodating hole (11) along the direction parallel to the finger strip of the transducer (2) does not exceed the aperture range of the transducer (2), and the size of the second accommodating hole (51) is smaller than the size of the first accommodating hole (11).
  2. 2. An acoustic atomising chip according to claim 1, characterized in that the intermediate area of the liquid transmission medium (6) is provided with a recess (61), the bottom of the recess (61) being located below the upper surface of the piezoelectric substrate (1) and above the upper surface of the supporting layer (5).
  3. 3. An acoustic atomising chip according to claim 2 wherein the centre line of the recess (61) is spaced from the centre line of the transducer (2) by less than a second predetermined distance value.
  4. 4. An acoustic atomising chip according to any of the claims 1-3 characterized in that the transducer (2) comprises a first set of interdigitated electrodes (21), a second set of interdigitated electrodes (22), a first set of reflective electrodes (23), a second set of reflective electrodes (24), a first bus electrode (25) and a second bus electrode (26); The second group of interdigital electrodes (22) are arranged in parallel and opposite to the first group of interdigital electrodes (21); The first group of interdigital electrodes (21) comprise a first electrode strip (211) and a second electrode strip (212) which are mutually crossed and arranged in parallel; the second group of interdigital electrodes (22) comprises a third electrode strip (221) and a fourth electrode strip (222) which are mutually crossed and arranged in parallel; the upper ends of the first electrode bar (211) and the third electrode bar (221) are connected with the first bus electrode (25), and the lower ends of the second electrode bar (212) and the fourth electrode bar (222) are connected with the second bus electrode (26); The first group of reflective electrodes (23) are arranged in parallel on the left side of the first group of interdigital electrodes (21), and the second group of reflective electrodes (24) are arranged in parallel on the right side of the second group of interdigital electrodes (22).
  5. 5. The acoustic atomizing chip according to claim 1, characterized in that the piezoelectric substrate (1) comprises a piezoelectric layer (12), a functional layer (13), an energy limiting layer (14) and a substrate (15) which are arranged in sequence from top to bottom; the piezoelectric layer (12) serves as a wave-transmitting medium; the functional layer (13) is used for balancing the temperature coefficient of the piezoelectric layer (12); The energy limiting layer (14) is used for limiting the acoustic energy to the surface of the piezoelectric layer (12) and inhibiting bulk wave leakage; the substrate (15) is used for enhancing the mechanical strength of the piezoelectric substrate (1) and improving the power capacity of the piezoelectric substrate (1).
  6. 6. The acoustic atomizing chip according to claim 5, characterized in that the material of the piezoelectric layer (12) is a single-layer or laminated material having piezoelectric characteristics, the material of the functional layer (13) is a material having negative temperature compensation characteristics, and the material of the energy limiting layer (14) is a high-impedance acoustic material having a large difference in sound velocity from the piezoelectric layer (12).
  7. 7. A method of making an acoustic atomising chip as claimed in any of claims 1-6, comprising: Transferring the mask pattern of the prepared transducer to the surface of a carrier substrate to form a transducer (2); forming a protective layer (3) on a non-bonding area of the surface of the transducer (2) by a sputtering or chemical vapor deposition method; attaching a carrier substrate to a carrier film, cutting, baking or irradiating with ultraviolet light, and stripping the film or separating by a pick-up process to obtain an independent piezoelectric substrate (1); a first accommodating hole (11) is processed by pulse laser in a region of the piezoelectric substrate (1) corresponding to the aperture range of the transducer (2); preparing a second accommodating hole (51) at a position of the supporting layer (5) corresponding to the first accommodating hole (11); the lower surface of the piezoelectric substrate (1) is bonded and connected with the upper surface of the supporting layer (5) by utilizing the transition connecting layer (4); And (3) punching the liquid transmission medium (6) into the interval defined by the first accommodating hole (11) and the second accommodating hole (51) by adopting a compacting process.

Description

Acoustic atomization chip and manufacturing method thereof Technical Field The invention belongs to the technical field of atomization, and particularly relates to an acoustic atomization chip and a manufacturing method thereof. Background An effective treatment for respiratory diseases is aerosol inhalation administration. The medicine is dispersed into tiny fog drops or particles by the atomizing device, so that the fog drops or particles are suspended in the gas and enter the respiratory tract and the lung, thereby achieving the purpose of treating respiratory tract system diseases. Compared with other modes, the lung has large respiratory area and rich blood vessels, the medicine directly acts on target organs, has low chemical degradation degree, and has the advantages of less medicine consumption, quick medicine effect, small side effect, no pain, liver first pass effect avoidance and the like. Nebulization inhalers continue to iterate, and have so far undergone a common three-generation evolution from ultrasonic nebulizers, compression nebulizers to mesh nebulizers. The ultrasonic atomizer is easy to damage biomacromolecules and drug structures, has larger particle size and larger residual liquid due to high temperature output by thermal cavitation, and gradually exits from the market. The compression atomizer has large noise, is heavy and inconvenient, has high energy consumption and needs to be plugged in for use. The mesh atomizer has low liquid medicine compatibility, meshes are easy to block and breed bacteria, and the dispersion stability of liquid drops of the device is influenced, and the service life of the device is prolonged. In recent years, a novel surface acoustic wave atomizer based on a surface acoustic wave atomization technology is proposed, which converts a high-frequency electric signal into a mechanical vibration surface acoustic wave signal with nanometer amplitude by using the inverse piezoelectric effect of a piezoelectric material, places liquid on a surface acoustic wave transmission path, absorbs the acoustic wave energy, further forms a surface capillary wave on the surface of the liquid, and directly breaks up the liquid to form aerosol fog drops. The liquid is not limited by meshes, high-speed air flow is not needed to guide, high shear stress is not needed, cavitation and high heat reaction are not needed, the biocompatibility is good, the universality of the liquid medicine is strong, and the suspension and emulsion can be atomized, so that the liquid medicine is a new direction of future atomization technology development. Disclosure of Invention In order to enrich the process route and increase the selection space of the surface acoustic wave atomizer, the embodiment of the invention provides an acoustic atomization chip and a manufacturing method thereof. In a first aspect, an embodiment of the present invention provides an acoustic atomization chip, including a piezoelectric substrate 1, a transducer 2, a protective layer 3, a transitional connection layer 4, a support layer 5, and a liquid transmission medium 6; The transducer 2 is arranged on the upper surface of the piezoelectric substrate 1, the protective layer 3 covers the upper surface of the transducer 2, and the lower surface of the piezoelectric substrate 1 is tightly attached to the supporting layer 5 through the transition connecting layer 4; the transducer 2 comprises two groups of symmetrical interdigital transducers and can excite two rows of mechanical vibration sound waves with megahertz frequency which are propagated in opposite directions on the surface of the piezoelectric substrate 1; The piezoelectric substrate 1 and the supporting layer 5 are respectively provided with a first accommodating hole 11 and a second accommodating hole 51 in the area corresponding to the aperture range of the transducer 2, and the liquid transmission medium 6 is arranged in the area space defined by the first accommodating hole 11 and the second accommodating hole 51 to form a medium transmission channel. In one or some alternative embodiments, the central area of the piezoelectric substrate 1 is provided with a first accommodating hole 11, the central area of the supporting layer 5 is provided with a second accommodating hole 51, and the central lines of the first accommodating hole 11 and the second accommodating hole 51 are coincident. In one or some alternative embodiments, the distance between the edge line of the first accommodating hole 11 along the direction perpendicular to the finger of the transducer 2 and the edge line on the inner side of the transducer 2 is greater than a first preset distance value, and the edge line of the first accommodating hole 11 along the direction parallel to the finger of the transducer 2 does not exceed the aperture range of the transducer 2. In one or some alternative embodiments, the second receiving hole 51 has a smaller size than the first receiving hole 11. In one or so