CN-121720636-B - Liquid-cooled high-temperature pressure sensor and preparation method thereof

CN121720636BCN 121720636 BCN121720636 BCN 121720636BCN-121720636-B

Abstract

The invention discloses a liquid-cooled high-temperature pressure sensor and a preparation method thereof, which belong to the technical field of micro-electromechanical systems and extreme environment physical measurement, wherein the liquid-cooled high-temperature pressure sensor comprises a sensor packaging main body, a micro-channel cooling system and a sensor chip; the sensor packaging main body comprises a sensor base and a corrugated sheet, wherein a ceramic heat insulation ring is arranged in the sensor base, the corrugated sheet is connected with the sensor base to form a cavity, the sensor chip is fixed at the bottom of the cavity, the micro-channel cooling system comprises two cavity spiral pipes arranged in the cavity, an embedded spiral pipe arranged in the core body and a micro-channel integrated in the sensor chip, the lower parts of the two cavity spiral pipes encircle the outside of the sensor chip, the embedded spiral pipe is positioned under the sensor chip, and the micro-channel is arranged in the glass packaging layer of the sensor chip. The invention solves the problem that the micro environment of the pressure sensor chip cannot be effectively cooled in the prior art.

Inventors

HAN XIANGGUANG
YANG PING
LI SHUAIYI
ZHAO LIBO
CUI ZEYU
ZHOU YAXIONG
LIU RUONAN
XIA YONG
JIA CHEN
WANG JIUHONG

Assignees

西安交通大学

Dates

Publication Date: 20260512
Application Date: 20260213

Claims (9)

1. A liquid-cooled high-temperature pressure sensor, which is characterized by comprising a sensor package main body, a micro-channel cooling system and a sensor chip (7); The sensor package main body comprises a sensor base (13) and a corrugated sheet (5), wherein the sensor base (13) comprises a shell (1), a ceramic heat insulation ring (2) and a core body (3) which are sequentially arranged from outside to inside, the corrugated sheet (5) is connected with the shell (1) to form a cavity, hydraulic oil is filled in the cavity, and the sensor chip (7) is fixed at the bottom of the cavity; the micro-channel cooling system comprises a first cavity spiral pipe (8) and a second cavity spiral pipe (4) which are arranged in the cavity, an embedded spiral pipe (9) which is arranged in the core body (3) and a micro-channel (20) which is arranged in the sensor chip (7); The lower parts of the first intracavity spiral tube (8) and the second intracavity spiral tube (4) are respectively surrounded outside the sensor chip (7); the embedded spiral tube (9) is positioned right below the sensor chip (7); the sensor chip (7) comprises a sensitive layer (14), a sealing layer (15) and a glass packaging layer (16) which are sequentially bonded, wherein a micro-channel (20) is arranged in the glass packaging layer (16); the micro-channel (20) comprises a chip liquid inlet channel (33), a venturi nozzle array and a chip liquid outlet channel (34), wherein the venturi nozzle array comprises a plurality of venturi nozzles (21) circumferentially arranged along the chip liquid inlet channel (33), a contraction section (36) of each venturi nozzle (21) is positioned on one side close to the chip liquid inlet channel (33), an expansion section (38) of each venturi nozzle (21) is positioned on one side close to the chip liquid outlet channel (34), and the chip liquid inlet channel (33) and the chip liquid outlet channel (34) are both communicated with the venturi nozzle array.
2. A liquid cooled high temperature pressure sensor as claimed in claim 1, wherein the first intracavity spiral (8) is parallel to the second intracavity spiral (4) and staggered into a double helix.
3. The liquid-cooled high temperature pressure sensor of claim 1, wherein the upper half of the first intracavity spiral tube (8) has a smaller tube diameter than the lower half and a smaller pitch than the lower half, and the second intracavity spiral tube (4) has a smaller tube diameter than the lower half and a smaller pitch than the lower half.
4. A liquid-cooled high temperature pressure sensor according to claim 1, characterized in that the embedded spiral tube (9) is of a double helix structure in series connection.
5. The liquid-cooled high temperature pressure sensor of claim 1, wherein an annular channel (22) is arranged outside the venturi nozzle array, the annular channel (22) is communicated with the venturi nozzle array, and the chip liquid outlet channel (34) is vertically arranged and communicated with the annular channel (22).
6. The liquid-cooled high-temperature pressure sensor according to claim 1, wherein the inlets of the first intracavity spiral tube (8), the second intracavity spiral tube (4), the embedded spiral tube (9) and the micro-channel (20) are all communicated with the main liquid inlet channel (12), the outlets are all communicated with the main liquid outlet channel (11), and the main liquid inlet channel (12) and the main liquid outlet channel (11) are all arranged at the bottom of the core body (3).
7. The method for manufacturing a liquid-cooled high temperature pressure sensor of claim 1, comprising the steps of: step 1, forming a piezoresistive region, an insulating layer and a metal electrode on the front surface of a silicon wafer on an insulator; Step 2, processing the back surface of the silicon wafer on the insulator to form a sensitive layer (14); Step 3, thinning the monocrystalline silicon wafer to be used as a sealing layer (15), and bonding the sealing layer (15) with the back surface of the silicon wafer on the insulator to form a pressure cavity (18) so as to obtain a structure with a sensitive layer (14) and the sealing layer (15); step 4, processing a micro-channel (20) in the glass wafer, bonding the micro-channel with the back surface of the structure with the sensitive layer (14) and the sealing layer (15) obtained in the step 3 to form a glass packaging layer (16), and scribing to obtain a sensor chip (7); Step 5, preparing a combination body, wherein the combination body comprises a core body (3), a first intracavity spiral tube (8) and a second intracavity spiral tube (4), the inner of the core body (3) is preset with the embedded spiral tube (9), and the core body (3), a shell (1), a ceramic heat insulation ring (2) and metal pins (10) are assembled and sintered to obtain a sensor base (13); step 6, bonding the sensor chip (7) on the core body (3), and connecting a metal bonding pad of the sensor chip (7) with a metal pin (10) through a bond alloy wire (6); and 7, sealing the corrugated sheet (5) and the sensor base (13) to form a cavity, and injecting hydraulic oil into the cavity to obtain the liquid-cooled high-temperature pressure sensor.
8. The method for manufacturing a liquid-cooled high temperature pressure sensor according to claim 7, wherein in the step 4, a micro flow channel (20) is processed inside the glass wafer by using a femtosecond laser.
9. The method for manufacturing a liquid-cooled high temperature pressure sensor according to claim 7, wherein in the step 5, the assembly is manufactured by a metal 3D printing integrated molding method.

Description

Liquid-cooled high-temperature pressure sensor and preparation method thereof Technical Field The invention belongs to the technical field of Micro-Electro-MECHANICAL SYSTEMS, MEMS and extreme environment physical measurement, and particularly relates to a liquid-cooled high-temperature pressure sensor and a preparation method thereof. Background Piezoresistive pressure sensors are important in industrial testing due to the remarkable engineering advantages of high sensitivity, wide frequency response range, compact structure and the like. However, pressure sensors present significant challenges when placed in thermal fields of greater than 125 ℃, such as aerospace engines, high speed wind tunnel tests, and metallurgical chemical field applications. Under the environment of more than 125 ℃, PN junction electrical isolation of a pressure sensor chip made of monocrystalline silicon is easy to fail, reverse leakage current surge causes PN junction breakdown, and finally device damage is caused. In addition, high temperatures above 400 ℃ can also cause high temperature creep in pressure sensor chips made of wide bandgap semiconductor materials, such as Silicon-On-Insulator (SOI), silicon carbide, sapphire, etc., resulting in nonlinear drift of the piezoresistive coefficients, severe thermal zero drift and sensitivity decay. Therefore, the upper temperature tolerance of the pressure sensor chip is a critical factor in determining the upper operating temperature limit of the pressure sensor. In order to overcome the problems, the prior art adopts a technical route of adding a liquid cooling structure outside the sensor, and mainly adopts two technical routes of remote induced pressure cooling and additional external liquid cooling jacket cooling. In the pressure transmission process, the cooling mode of the pressure guiding pipe causes a 'pipe cavity effect' caused by the slender pressure guiding pipeline, so that dynamic signals are cut down, dynamic frequency response distortion is caused, and the pressure guiding pipeline is easy to block in a complex medium measurement environment. The cooling mode of the external liquid cooling jacket is extremely high in thermal resistance due to the fact that the cooling source and the chip are separated by the thick-wall shell and the multi-layer medium, heat around the pressure sensor chip cannot be taken away timely, and accurate constant temperature control on the microenvironment of the pressure sensor chip cannot be achieved. The high thermal resistance structure brings remarkable thermal hysteresis effect, namely when the outside is subjected to transient thermal shock, the heat accumulated by the core of the pressure sensor chip cannot be timely led out by external cooling, and the constant temperature control of the microenvironment of the pressure sensor chip cannot be realized. Meanwhile, the large liquid cooling suite increases the volume and weight of the pressure sensor, so that the pressure sensor is difficult to install in a space limited area of the aerospace engine, and the design optimization of key components of the aerospace engine is severely restricted. The pressure medium is cooled in one of the two cooling modes, and the cooling effect is acted on the sensor base and transmitted to the sensor chip through the sensor base, so that the constant temperature control on the microenvironment of the pressure sensor chip cannot be realized, and the measurement capability of the high-temperature pressure sensor at high temperature is limited. Disclosure of Invention The invention provides a liquid-cooled high-temperature pressure sensor and a preparation method thereof, and aims to solve the problem that the micro-environment of a pressure sensor chip cannot be effectively cooled in the prior art. In order to achieve the above purpose, the present invention adopts the following technical scheme: In a first aspect, the present invention provides a liquid-cooled high temperature pressure sensor, comprising a sensor package body, a microchannel cooling system, and a sensor chip; the sensor packaging main body comprises a sensor base and a corrugated sheet, wherein the sensor base comprises a shell, a ceramic heat insulation ring and a core body which are sequentially arranged from outside to inside, the corrugated sheet is connected with the shell to form a cavity, hydraulic oil is filled in the cavity, and the sensor chip is fixed at the bottom of the cavity; The micro-channel cooling system comprises a first intracavity spiral pipe and a second intracavity spiral pipe which are arranged in the cavity, an embedded spiral pipe which is arranged in the core body, and a micro-channel which is arranged in the sensor chip; the lower parts of the first intracavity spiral tube and the second intracavity spiral tube are all surrounded outside the sensor chip; the embedded spiral tube is positioned right below the sensor chip; the sensor chip comprises a sensitive lay