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CN-121722709-B - Cross Die communication device

CN121722709BCN 121722709 BCN121722709 BCN 121722709BCN-121722709-B

Abstract

The invention relates to the technical field of integrated circuit chip design, in particular to a cross-Die communication device which comprises a first communication link and a second communication link, wherein the first communication link comprises a first cross-Die communication module arranged in a first Die and a second cross-Die communication module arranged in a second Die, the first cross-Die communication module and the second cross-Die communication module are interconnected based on a non-high-speed transmission protocol, the second communication link comprises a first link interface arranged in the first Die and a second link interface arranged in the second Die, the first link interface and the second link interface are connected through an interconnection network generated by link training, the first communication link is used for transmitting non-high-speed data between the first Die and the second Die, and the second communication link is used for transmitting high-speed data between the first Die and the second Die. The invention reduces complexity of cross-Die communication and improves stability of cross-Die communication.

Inventors

  • CAI JUNHUI

Assignees

  • 沐曦集成电路(南京)有限公司

Dates

Publication Date
20260508
Application Date
20260213

Claims (8)

  1. 1. A cross Die communication apparatus comprising a first communication link and a second communication link for effecting first Die and second Die communications; The first communication link comprises a first cross-Die communication module arranged in a first Die and a second cross-Die communication module arranged in a second Die, and the first cross-Die communication module and the second cross-Die communication module are interconnected based on a non-high-speed transmission protocol; The second communication link comprises a first link interface arranged in a first Die and a second link interface arranged in a second Die, and the first link interface and the second link interface are connected through an interconnection network generated by link training; The first communication link is used for transmitting non-high-speed data between a first Die and a second Die, wherein the non-high-speed data is data with a corresponding clock rate less than or equal to 1 GHz; The second communication link is used for transmitting high-speed data between the first Die and the second Die, and the high-speed data is data with the corresponding clock rate being greater than 1 GHz; The first cross Die communication module comprises a first data packet generation module, a first transmission module, a first clock transmission pin, a first request transmission pin and a first response transmission pin, and the first transmission module is respectively connected with the first data packet generation module, the first clock transmission pin, the first request transmission pin and the first response transmission pin; The second cross Die communication module comprises a second receiving module, a second unpacking module, a second clock receiving pin, a second request receiving pin and a second response receiving pin, wherein the second receiving module is respectively connected with the second unpacking module, the second clock receiving pin, the second request receiving pin and the second response receiving pin; the first clock sending pin is connected with the second clock receiving pin, the first request sending pin is connected with the second request receiving pin, and the first response sending pin is connected with the second response receiving pin; The first cross Die communication module further comprises a first receiving module, a first unpacking module, a first clock receiving pin, a first request receiving pin and a first response receiving pin, wherein the first receiving module is respectively connected with the first unpacking module, the first clock receiving pin, the first request receiving pin and the first response receiving pin; The second cross Die communication module further comprises a second data packet generation module, a second sending module, a second clock sending pin, a second request sending pin and a second response sending pin, wherein the second sending module is respectively connected with the second data packet generation module, the second clock sending pin, the second request sending pin and the second response sending pin; The first clock receiving pin is connected with the second clock transmitting pin, the first request receiving pin is connected with the second request transmitting pin, and the first response receiving pin is connected with the second response transmitting pin.
  2. 2. The apparatus of claim 1, wherein the device comprises a plurality of sensors, The device also comprises a first request processing module arranged in the first Die and a second request processing module arranged in the second Die; The first request processing module is used for sending an access request to the first inter-Die communication module based on a preset intra-Die data transmission protocol; the first cross-Die communication module is used for converting the received access request into a request data packet and transmitting the request data packet to the second cross-Die communication module based on a non-high-speed transmission protocol; The second inter-Die communication module is used for converting the received request data packet into an access request and transmitting the access request to the second request processing module based on a preset intra-Die data transmission protocol; the second request processing module is used for processing the received access request, generating response information, and transmitting the response information to the second inter-Die communication module based on a preset inter-Die data transmission protocol; The second cross-Die communication module is used for converting the response information into a response data packet and transmitting the response data packet to the first cross-Die communication module based on a non-high-speed transmission protocol; The first inter-Die communication module is used for converting the response data packet into response information and sending the response information to the first request processing module based on a preset intra-Die data transmission protocol.
  3. 3. The apparatus of claim 1, wherein the device comprises a plurality of sensors, The first data packet generation module is used for acquiring a starting identifier, a data packet valid transmission bit, a source Die identifier, a destination Die identifier, a read-write request identifier, request data and an ending identifier based on an access request, splicing and generating a request data packet, and sending the request data packet to the first sending module; The first sending module is used for generating a parity verification code based on data in the request data packet after receiving the request data packet, adding the parity verification code between the request data of the request data packet and an end identifier, and transmitting information in the request data packet to the second receiving module according to a transmission time sequence through the first request sending pin based on a preset change edge of a clock signal transmitted by the first clock sending pin.
  4. 4. The apparatus of claim 3, wherein the device comprises a plurality of sensors, The second receiving module generates a parity verification code based on data in an effective transmission bit of the request data packet after receiving a starting identification of the request data packet, compares the parity verification code with the parity verification code in the request data packet, and sends the request data packet to the second unpacking module after receiving an ending identification of the request data packet if the starting identification is the same, and discards the currently transmitted request data packet and generates prompt information if the ending identification of the request data packet is different; The second unpacking module is used for analyzing the received request data packet, generating request information and sending the request information to the second request processing module.
  5. 5. The apparatus of claim 1, wherein the device comprises a plurality of sensors, The second data packet generation module is used for acquiring a starting identifier, a data packet valid transmission bit, a source Die identifier, a destination Die identifier, a response identifier, response data and an ending identifier based on response information, splicing the response data packets to generate a response data packet, and transmitting the response data packet to the second transmission module; The second sending module is used for generating a parity verification code based on data in the response data packet after receiving the response data packet, adding the parity verification code between the response data of the response data packet and the end identifier, and transmitting information in the response data packet to the first receiving module according to a transmission time sequence through the second request sending pin based on a preset change edge of a clock signal transmitted by the second clock sending pin.
  6. 6. The apparatus of claim 3, wherein the device comprises a plurality of sensors, The first receiving module generates a parity verification code based on data in an effective transmission bit of the response data packet after receiving a starting identification of the response data packet, compares the parity verification code with the parity verification code in the response data packet, and sends the response data packet to the first unpacking module after receiving an ending identification of the response data packet if the starting identification is the same, and discards the currently transmitted response data packet and generates prompt information if the ending identification of the response data packet is different; the first unpacking module analyzes the received response data packet, generates response information and sends the response information to the first request processing module.
  7. 7. The apparatus of claim 2, wherein the device comprises a plurality of sensors, The first request processing module and the second request processing module are both register networks, the preset Die internal data transmission protocol comprises an AXI bus protocol, an AHB bus protocol and a RIB bus protocol, and the non-high-speed transmission protocol is a preset SPI protocol.
  8. 8. The apparatus of claim 1, wherein the device comprises a plurality of sensors, The interconnection network includes Mesh, ring Topologies, nvlink.

Description

Cross Die communication device Technical Field The invention relates to the technical field of integrated circuit chip design, in particular to a cross Die communication device. Background In the integrated circuit chip design process, multiple Die (Die) are packaged together to enable parallel processing tasks, thereby improving computing performance. Each Die can bear different computational loads, especially for scenarios requiring highly concurrent computation for machine learning, graphics processing, and the like. Communication between Die and Die is typically accomplished using a dedicated interconnection network (e.g., mesh, ring Topologies, nvlink) that requires link training (LINK TRAINING) prior to connection and that can only communicate with each other after the link training is successful. In the link training process, an interface (PHY) needs to be initialized, the configuration process is very complex, the situation that the link is unsuccessful can also occur, and in the use process, data errors can also occur, so that the chip function is abnormal. Furthermore, for cross-DIE access scenarios (e.g., register access, etc.) that are particularly for non-high speed data transmissions, the use of link training techniques is complex. Therefore, the simple, quick, stable and reliable inter-Die communication device is provided, and the technical problem to be solved is urgent. Disclosure of Invention The invention aims to provide a cross-Die communication device, which reduces the complexity of cross-Die communication and improves the stability of cross-Die communication. According to a first aspect of the present invention there is provided a cross Die communication apparatus comprising first and second communication links for enabling first and second Die communications; The first communication link comprises a first cross-Die communication module arranged in a first Die and a second cross-Die communication module arranged in a second Die, and the first cross-Die communication module and the second cross-Die communication module are interconnected based on a non-high-speed transmission protocol; The second communication link comprises a first link interface arranged in a first Die and a second link interface arranged in a second Die, and the first link interface and the second link interface are connected through an interconnection network generated by link training; The first communication link is used for transmitting non-high-speed data between a first Die and a second Die, wherein the non-high-speed data is data with a corresponding clock rate less than or equal to 1 GHz; the second communication link is used for transmitting high-speed data between the first Die and the second Die, wherein the high-speed data is data with a corresponding clock rate of more than 1 GHz. Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the cross-Die communication device provided by the invention can achieve quite technical progress and practicality, has wide industrial application value, and has at least the following beneficial effects: According to the method and the device, the cross-Die communication is realized based on the setting of the cross-Die communication module in the Die, complex link training is not needed, the complexity of the cross-Die communication is reduced, and the stability of the cross-Die communication is improved. Drawings In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Fig. 1 is a schematic diagram of a cross Die communication device according to an embodiment of the present invention. Detailed Description The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention. The embodiment of the invention provides a cross-Die communication device, which is shown in fig. 1 and comprises a first communication Link and a second communication Link, wherein the first communication Link and the second communication Link are used for realizing communication of a first Die and a second Die, the first communication Link comprises a first cross-Die communication module arranged in the first Die and a second cross-Die communicat