CN-121729077-B - Three-dimensional integrated active heat dissipation structure

CN121729077BCN 121729077 BCN121729077 BCN 121729077BCN-121729077-B

Abstract

The application relates to the technical field of packaging and heat dissipation, and provides a three-dimensional integrated active heat dissipation structure which comprises an upper cover plate layer, a fan and pump layer, at least one liquid cooling flow channel layer, a high-power device layer, at least one soaking plate layer, at least one heat conduction material layer and a lower cover plate layer, wherein an air inlet hole is formed in the upper cover plate layer, the fan and pump layer is arranged below the upper cover plate layer, the at least one liquid cooling flow channel layer is arranged below the fan and the pump layer, the high-power device layer is arranged below the at least one liquid cooling flow channel layer, the at least one soaking plate layer is arranged on at least one surface of the high-power device layer, the at least one heat conduction material layer is arranged between the high-power device layer and the soaking plate layer, and the lower cover plate layer is arranged at the bottommost part of the whole structure. The structure aims at high, medium and low power devices, can be combined by selecting an air cooling layer, a single liquid cooling layer, a double liquid cooling layer and a soaking plate layer, and realizes three-dimensional heat management by three-dimensional integration and cooperative coupling of air cooling, liquid cooling and solid heat conduction structures.

Inventors

XIE JING
Liang Gengyu
XING JIANPENG
LI CHAOBO
WANG HUAN

Assignees

中国科学院微电子研究所

Dates

Publication Date: 20260508
Application Date: 20260225

Claims (9)

1. A three-dimensional integrated active heat dissipation structure, comprising: The upper cover plate layer is provided with an air inlet hole; The fan and pump layer is arranged below the upper cover plate layer and comprises a pump inlet array area, a pump outlet array area and a fan array area positioned between the pump inlet array area and the pump outlet array area; the at least one liquid cooling runner layer is arranged below the fan and the pump layer, and a micro runner array is formed in the at least one liquid cooling runner layer; The high-power device layer is arranged below the at least one liquid cooling runner layer; the at least one soaking plate layer is arranged on at least one surface of the high-power device layer; At least one layer of thermally conductive material disposed between the high power device layer and the soaking plate layer; The lower cover plate layer is arranged at the bottommost part of the whole structure; The fan array area is used for driving air flow flowing through the air inlet holes of the upper cover plate layer, and the pump inlet array area and the pump outlet array area are used for driving cooling liquid to circulate in the at least one liquid cooling runner layer; A turbulence strengthening structure for strengthening turbulence is arranged in the micro-channel array, and the cross section of the micro-channel array is rectangular, trapezoidal or pin ribbed; an auxiliary micro-channel is also arranged in the upper cover plate layer or on the lower surface of the upper cover plate layer; two ends of the auxiliary micro-channel are respectively in fluid communication with the inlet pump array area and the outlet pump array area of the fan and the pump layer, and are connected in parallel with the micro-channel array in the at least one liquid cooling flow channel layer to form an internal circulation liquid cooling loop capable of being selectively opened and closed; the pump inlet array area and the pump outlet array area of the fan and the pump layer are also provided with external circulation interfaces for connecting an external cooling loop; the three-dimensional integrated active heat dissipation structure is configured to have two modes of operation: in an internal circulation mode, the external circulation interface is closed, and the cooling working medium circulates in a closed loop formed by the auxiliary micro-channel and the micro-channel array of the at least one liquid cooling flow channel layer; in the external circulation mode, the external circulation interface is opened and communicated with the external liquid storage cavity, and the cooling working medium circulates in a loop formed by the external liquid storage cavity and the micro-channel array of the at least one liquid cooling channel layer.
2. The three-dimensional integrated active heat dissipation structure of claim 1, wherein the at least one liquid-cooled runner layer comprises an upper liquid-cooled runner layer and a lower liquid-cooled runner layer; the upper liquid cooling runner layer is arranged between the fan and pump layer and the high-power device layer; the lower liquid cooling runner layer is arranged between the high-power device layer and the lower cover plate layer.
3. The three-dimensional integrated active heat dissipation structure of claim 2, wherein the at least one soaking plate layer comprises an upper soaking plate layer and a lower soaking plate layer; The upper soaking plate layer is arranged between the upper liquid cooling runner layer and the high-power device layer; The lower soaking plate layer is arranged between the high-power device layer and the lower liquid cooling runner layer; the at least one layer of thermally conductive material includes an upper layer of thermally conductive material and a lower layer of thermally conductive material; the upper heat conducting material layer is arranged between the high-power device layer and the upper soaking plate layer; The lower heat conducting material layer is arranged between the high-power device layer and the lower soaking plate layer.
4. The three-dimensional integrated active heat dissipation structure of claim 1, wherein the liquid cooling flow channel layer is internally formed with a multi-stage fluid channel structure comprising: The liquid inlet channel is communicated with the pump inlet array area; The main pump inlet flow passage is connected with the liquid inlet passage and is used for equalizing and distributing cooling liquid; the micro-channel array is communicated with the pump inlet main channel through a plurality of micro-channel inlets; the main outlet pump flow channel is used for collecting liquid subjected to heat exchange by the micro flow channel array; And the liquid outlet channel is communicated with the main outlet pump flow channel and the outlet pump array area.
5. The three-dimensional integrated active heat dissipation structure of claim 1, wherein the soaking plate layer is a vacuum sealed cavity structure comprising: The soaking plate comprises a soaking plate main body, wherein a closed vapor-liquid two-phase heat transfer space is formed inside the soaking plate main body; the working fluid is encapsulated in the vapor-liquid two-phase heat transfer space; and the capillary core structure is arranged in the soaking plate main body and is used for realizing capillary reflux of liquid.
6. The three-dimensional integrated active heat dissipation structure of claim 1, wherein the high power device layer comprises: the high-power device array region is integrated with a power device array; and the packaging substrate is arranged below the high-power device array area and is used for bearing devices and conducting heat.
7. The three-dimensional integrated active heat dissipation structure of claim 1, further comprising: The fan air outlet layer is arranged between the fan and the pump layer and between the fan and the at least one liquid cooling runner layer, and comprises an inlet pump connecting pipeline, an outlet pump connecting pipeline and an air flow layer in the middle.
8. The three-dimensional integrated active heat dissipation structure of claim 1, wherein the fan and pump layer further comprises: And the electric interconnection area is electrically connected with the upper and lower adjacent layers through a micro-bump interconnection process.
9. The three-dimensional integrated active heat dissipation structure of claim 1, wherein the fan units in the fan array region and/or the pump units in the pump in array region and the pump out array region adopt a piezoelectric driving structure, the piezoelectric driving structure comprising: A substrate; an insulating layer formed on the substrate; a transition layer formed on the insulating layer; a lower electrode layer formed on the transition layer; a piezoelectric thin film layer formed on the lower electrode layer; And an upper electrode layer formed on the piezoelectric thin film layer.

Description

Three-dimensional integrated active heat dissipation structure Technical Field The application relates to the technical field of packaging heat dissipation, in particular to a three-dimensional integrated active heat dissipation structure. Background At present, as microelectronic technology is moving into the "post-molar age", chip architecture is turned from two-dimensional plane to three-dimensional stack, system integration level and computing power are continuously and violently increased, and the problems of "power wall" and "hot wall" brought by the microelectronic technology are substituted for transistor density, so that the microelectronic technology becomes the final bottleneck for limiting performance, reliability and energy efficiency. Currently, the local heat flux density of high power chips often exceeds 500W/cm 2 and advances toward kilowatts, and the traditional "plug-in" passive heat dissipation technology has approached physical limits. The existing heat dissipation scheme mainly comprises three types of air cooling, liquid cooling and soaking plate heat conduction, however, the three types of heat dissipation schemes are often used independently, and obvious disadvantages exist. Air cooling is limited by low heat conductivity coefficient of air, heat dissipation capacity is low, high heat flux density requirements cannot be met, liquid cooling is high in efficiency, a traditional module can cool only one side of a chip generally, the three-dimensional heat dissipation problem of a multi-layer chip or double-sided heating structure in three-dimensional stacked packaging cannot be solved effectively, a system is complex, a soaking plate has good in-plane temperature uniformity, but self heat capacity is limited, and continuous large heat flux impact is difficult to deal with independently. More prominently, in a three-dimensional integrated package with limited space, the heat dissipation mode can not realize efficient coordination and coupling of multiple heat dissipation mechanisms of gas, liquid and solid in a limited volume, and is difficult to form a multi-dimensional and three-dimensional heat management channel penetrating the upper part, the lower part and the periphery of a chip, so that the inside of a stacked chip becomes a 'heat island', and further release of the performance of an advanced electronic system is severely restricted. Therefore, in the prior art, an integrated solution that can integrate multiple heat dissipation mechanisms in a compact space and realize three-dimensional, double-sided and synergistic efficient heat dissipation of a high-power chip is needed, so as to break through the heat dissipation bottleneck and ensure the performance and long-term reliability of the chip under high load. Disclosure of Invention The application aims to at least solve the technical problems that in the related art, the traditional heat dissipation mode is often used independently, and the efficient, cooperative and layered heat dissipation cannot be realized in the 3D integrated package with limited space, so that the heat diffusion problem of the stacked package or the double-sided heating structure cannot be effectively solved. In order to solve the technical problems, the application is realized as follows: The application provides a three-dimensional integrated active heat dissipation structure which comprises an upper cover plate layer, a fan and pump layer, at least one liquid cooling flow channel layer, a high-power device layer, at least one soaking plate layer, at least one heat conduction material layer, a lower cover plate layer and a lower cover plate layer, wherein the upper cover plate layer is provided with an air inlet hole, the fan and pump layer is arranged below the upper cover plate layer, the fan and pump layer comprises a pump inlet array area, a pump outlet array area and a fan array area positioned between the pump inlet array area and the pump outlet array area, the at least one liquid cooling flow channel layer is arranged below the fan and the pump layer, a micro flow channel array is formed inside the at least one liquid cooling flow channel layer, the high-power device layer is arranged below the at least one soaking plate layer, the at least one soaking plate layer is arranged on at least one surface of the high-power device layer, the at least one heat conduction material layer is arranged between the high-power device layer and the soaking plate layer, and the lower cover plate layer is arranged at the bottommost part of the whole structure, and the fan array area is used for driving air inlet holes flowing through the upper cover plate layer and the pump outlet array area to flow, and the cooling liquid is used for driving cooling liquid to circulate in the at least one liquid cooling flow channel layer. The application provides a three-dimensional integrated active heat dissipation structure, which realizes efficient, uniform and extensible t