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CN-121780033-B - Repairable high-thermal-conductivity nano composite three-proofing coating and preparation method and application thereof

CN121780033BCN 121780033 BCN121780033 BCN 121780033BCN-121780033-B

Abstract

The application relates to the technical field of three-proofing coatings, in particular to a repairable high-thermal-conductivity nano composite three-proofing coating, and a preparation method and application thereof. The repairable high-thermal-conductivity nano composite three-proofing coating comprises, by weight, 50-60 parts of modified organosilicon-epoxy hybrid resin, 8-12 parts of alkylated nano boron nitride, 5-8 parts of alkylated nano silicon dioxide, 3-5 parts of star-shaped furan-maleimide-furan crosslinking agent, 1-1.5 parts of microcapsule imidazole, 0.1-0.5 part of sulfonium salt and 100 parts of high-boiling-point solvent, wherein the high-boiling-point solvent comprises at least one of propylene glycol methyl ether acetate and dipropylene glycol dimethyl ether. The application compactly forms a film through the modified organosilicon-epoxy hybrid resin, the nano filler is compounded to strengthen the barrier, the reversible crosslinking structure is endowed with repairability, under the mutual cooperation, the limitation that the traditional three-proofing paint can only be protected by thick coating is broken through under the condition of low thickness, and the application is applicable to the high-reliability protection scene of precise electronic devices.

Inventors

  • LI CHAO
  • ZHANG WEI
  • WU LIANLIAN
  • WANG CHENGQUN

Assignees

  • 深圳市捷创新材料股份有限公司
  • 深圳市捷安纳米复合材料有限公司

Dates

Publication Date
20260508
Application Date
20260305

Claims (6)

  1. 1. The repairable high-thermal-conductivity nano composite three-proofing coating is characterized by comprising, by weight, 50-60 parts of modified organosilicon-epoxy hybrid resin, 8-12 parts of alkylated nano boron nitride, 5-8 parts of alkylated nano silicon dioxide, 3-5 parts of star-shaped furan-maleimide-furan cross-linking agent, 1-1.5 parts of microcapsule imidazole, 0.1-0.5 part of sulfonium salt and 100 parts of high-boiling point solvent, wherein the high-boiling point solvent comprises at least one of propylene glycol methyl ether acetate and dipropylene glycol dimethyl ether; the preparation method of the modified organosilicon-epoxy hybrid resin comprises the following steps: mixing 100 parts of bisphenol A epoxy resin, 35-45 parts of hydroxyl-terminated polydimethylsiloxane and 0.2-0.4 part of triphenylphosphine, heating for reaction, and cooling to obtain modified organosilicon-epoxy hybrid resin; the preparation method of the star-shaped furan-maleimide-furan crosslinking agent comprises the following steps: and mixing and dissolving the furanmethanol and the maleimide benzoic acid in toluene, heating for reaction, and performing rotary evaporation to obtain the star-shaped furan-maleimide-furan crosslinking agent.
  2. 2. The repairable high-thermal-conductivity nano composite three-proofing coating according to claim 1, wherein the preparation method of the alkylated nano boron nitride or the alkylated nano silicon dioxide comprises the following steps: Adding nano boron nitride or nano silicon dioxide into a high boiling point solvent, homogenizing, then adding hexamethyldisilazane, and heating for reaction to obtain alkylated nano boron nitride or alkylated nano silicon dioxide.
  3. 3. The reworkable high thermal conductivity nanocomposite three-proofing coating according to claim 1, wherein the mass ratio of alkylated nano boron nitride to alkylated nano silica is 1.5-2:1.
  4. 4. A method for preparing the reworkable high thermal conductivity nanocomposite three-proofing coating according to any one of claims 1 to 3, comprising the steps of: Under the condition of avoiding light, stirring and mixing the formula amount of modified organic silicon-epoxy hybrid resin, star-shaped furan-maleimide-furan crosslinking agent, microcapsule imidazole, sulfonium salt and high boiling point solvent, adding alkylated nano boron nitride and alkylated nano silicon dioxide, stirring and mixing, filtering and defoaming to obtain the reworkable high-thermal-conductivity nano composite three-proofing coating.
  5. 5. Use of a reworkable high thermal conductivity nanocomposite three-proofing coating according to any one of claims 1 to 3, comprising the steps of: the repairable high-heat-conductivity nano composite three-proofing coating is coated on the element, 365nm LED surface is dried for 30s, then primary curing is carried out for 20-30min at 80-100 ℃, and then secondary curing is carried out for 20-30min at 120-150 ℃ to obtain the coated element.
  6. 6. The application of the reworkable high thermal conductivity nanocomposite three-proofing coating according to claim 5, further comprising the steps of: Peeling, namely heating the fault part of the fault element after the coating element becomes the fault element, peeling the original reworkable high-heat-conductivity nano composite three-proofing coating, and cooling to room temperature to obtain the peeled fault element; recoating, namely coating the novel repairable high-heat-conductivity nano composite three-proofing coating on the stripping fault element, firstly drying a 365nm LED surface for 30s, then performing primary curing for 20-30min at 80-100 ℃, and then performing secondary curing for 20-30min at 120-150 ℃ to obtain the novel coating element.

Description

Repairable high-thermal-conductivity nano composite three-proofing coating and preparation method and application thereof Technical Field The application relates to the technical field of three-proofing coatings, in particular to a repairable high-thermal-conductivity nano composite three-proofing coating, and a preparation method and application thereof. Background The organic coating protection technology is one of effective strategies for improving the reliability of electronic products, and has the characteristics of low cost, easiness in processing, excellent protection performance and the like. The organic coating protects the circuit boards and their associated equipment in the electronic product from the environment, thereby improving and extending their useful life, ensuring safety and reliability of use. Under realistic conditions, such as chemical environments (fuel, coolant, etc.), vibration, high dust, salt mist, humidity, high temperature, etc., the circuit board may have problems of corrosion, softening, deformation, mildew, etc., resulting in failure of the circuit board circuit. The circuit board protective coating can be coated on the outer surface of the circuit board to form a light and flexible film. It can protect the circuit board from damage under the above-mentioned severe conditions. The main materials of the protective coating for circuit boards can be classified into acrylic type, polyurethane type, organosilicon type, epoxy type, polyditoluene type, etc. The protection grade of the traditional acrylic acid, polyurethane or common organic silicon three-proofing paint only reaches IP54-IP66, and the requirements of MIL-STD-810G/H or IP68 of IEC60529 are difficult to meet. The epoxy/polyurethane pouring sealant can improve the protection level, but the thickness of the adhesive layer is more than or equal to 2mm, the thermal resistance is large, the epoxy/polyurethane pouring sealant is irreversible and cannot be locally repaired, so that the heat dissipation failure of the whole machine and the maintenance cost are greatly increased. Disclosure of Invention The application provides a repairable high-thermal-conductivity nano composite three-proofing coating, which aims to solve the technical problems that the three-proofing coating for components such as a circuit board and the like can realize high protection level under low thickness and can realize local repair. In a first aspect, the application provides a repairable high-thermal-conductivity nano composite three-proofing coating, which adopts the following technical scheme: The repairable high-thermal-conductivity nano composite three-proofing coating comprises, by weight, 50-60 parts of modified organosilicon-epoxy hybrid resin, 8-12 parts of alkylated nano boron nitride, 5-8 parts of alkylated nano silicon dioxide, 3-5 parts of star-shaped furan-maleimide-furan crosslinking agent, 1-1.5 parts of microcapsule imidazole, 0.1-0.5 part of sulfonium salt and 100 parts of high-boiling-point solvent, wherein the high-boiling-point solvent comprises at least one of propylene glycol methyl ether acetate and dipropylene glycol dimethyl ether. By adopting the technical scheme, the organosilicon chain segment of the modified organosilicon-epoxy hybrid resin provides hydrophobicity and effectively blocks water vapor permeation, the epoxy group enhances chemical bonding with a metal substrate to prevent the coating from peeling, the hybrid structure forms a compact crosslinked network, molecular gaps are reduced, and corrosion medium diffusion is inhibited, so that the modified organosilicon-epoxy hybrid resin is a foundation for realizing thin-layer high protection. The microcapsule imidazole core material is a latent curing agent, is released by heating or mechanical pressure to trigger the epoxy group to cure at low temperature, and the microcapsule shell avoids early reaction, prolongs the storage period and realizes local repair. The alkylation nano boron nitride surface alkylation treatment improves the dispersibility of the nano boron nitride in resin, avoids agglomeration, enables lamellar structures to be stacked in parallel to form a labyrinth effect, prolongs a water-oxygen permeation path, establishes a heat conduction network with high heat conductivity, rapidly leads out local hot spots, and avoids coating cracking caused by thermal stress. The alkylated nano silicon dioxide fills the gaps between the boron nitride sheets, further improves the density of the coating, enhances the capillary resistance effect by surface hydrophobic modification, and reduces the water adsorption rate. The star topology structure of the star furan-maleimide-furan crosslinking agent provides multiple reaction sites to form a three-dimensional network, so that the mechanical strength of the coating is improved, and the reversible reaction characteristic (furan/maleimide bond) is high Wen Shijian, so that the coating can be repaired, and self-heal