CN-121842943-B - Heat radiation structure of circuit board for resonance gyroscope

CN121842943BCN 121842943 BCN121842943 BCN 121842943BCN-121842943-B

Abstract

The invention relates to the technical field of circuit board heat dissipation, in particular to a heat dissipation structure of a circuit board for a resonant gyroscope, which comprises a heat dissipation circuit board and a heat dissipation base, wherein the heat dissipation base is positioned below the heat dissipation circuit board, a heat insulation plate is fixedly arranged in the middle of the heat dissipation base, the top of the heat insulation plate can be fixedly arranged at the bottom of the heat dissipation circuit board, a heat dissipation shell is fixedly arranged on the heat dissipation base, the heat dissipation shell is circularly arranged below the heat dissipation circuit board, the bottom of the heat dissipation base rotates and is slidably provided with a driving adjusting shaft, the top of the driving adjusting shaft is fixedly provided with a heat conduction circular plate, the bottom of the heat conduction circular plate is fixedly provided with a heat dissipation fin group, and through the heat dissipation base and the heat dissipation fin group which can be selected, high-heat elements and low-heat elements on the heat dissipation circuit board can be accurately and efficiently dissipated, and meanwhile, the circuit board with multiple element distribution is adapted.

Inventors

LI YONGDE
ZHOU JIANHONG

Assignees

四川图林科技有限责任公司

Dates

Publication Date: 20260508
Application Date: 20260311

Claims (10)

1. The utility model provides a heat radiation structure of circuit board for resonance gyroscope, includes heat dissipation circuit board, its characterized in that still includes: The heat dissipation base is positioned below the heat dissipation circuit board, the middle part of the heat dissipation base is fixedly provided with a heat insulation plate, the top of the heat insulation plate can be fixedly arranged at the bottom of the heat dissipation circuit board, the heat dissipation base is fixedly provided with a heat dissipation shell, the heat dissipation shell is circularly arranged below the heat dissipation circuit board, the bottom of the heat dissipation base rotates and is slidably provided with a driving adjusting shaft, the top of the driving adjusting shaft is fixedly provided with a heat conduction circular plate, the bottom of the heat conduction circular plate is fixedly provided with a heat dissipation fin group, and the heights of fins in the heat dissipation fin group are gradually decreased from high to low along the circumferential direction of the heat conduction circular plate, and are distributed in a step shape as a whole; the heat dissipation base top rotates and installs a rotation section of thick bamboo, be equipped with elastic element between rotation section of thick bamboo and the drive adjustment axle, elastic element one end is located on the rotation section of thick bamboo inside wall, and the other end is located on the drive adjustment axle lateral wall, the rotation section of thick bamboo is hollow form and cover and locates the drive adjustment axle outside.
2. The heat radiation structure of a circuit board for a resonant gyroscope of claim 1, wherein the heat radiation base is divided into a left heat radiation partition and a right heat radiation partition by a heat insulation plate, a heat radiation fin group is fixedly arranged at the bottom of a heat conduction circular plate in each partition, and the heat conduction circular plates in the two partitions are independently rotated and adjusted.
3. The heat dissipating structure of the circuit board for a resonator gyroscope of claim 1, wherein the heat dissipating fins of the heat dissipating fin group are fixedly provided with copper heat conducting strips.
4. The heat dissipation structure of a circuit board for a resonator gyroscope of claim 1, wherein the bottom of the driving adjusting shaft is fixedly provided with an adjusting rotating rod, and the bottom of the heat dissipation base is provided with a clamping groove.
5. The heat dissipation structure of a circuit board for a resonator gyroscope of claim 4, wherein the clamping grooves are distributed at the bottom of the heat dissipation base in a circular circumference, and the outermost end of the adjusting rotating rod is arranged to be a cylinder which can be matched with the clamping grooves.
6. The heat dissipating structure of claim 5, wherein the spacing between adjacent grooves is no greater than 15 °.
7. The heat radiation structure of the circuit board for the resonant gyroscope of claim 1, wherein the heat radiation base is provided with air inlets which are arc-shaped and circumferentially distributed on the heat radiation base, the top of the radiator shell is provided with air outlets which are arc-shaped and circumferentially distributed on the top of the radiator shell like the air inlets.
8. The heat radiation structure of the circuit board for the resonant gyroscope of claim 7, wherein a connecting plate is fixedly arranged on the outer side wall of the bottom of the rotating cylinder, an arc-shaped baffle is fixedly arranged outside the connecting plate, and the arc-shaped baffle is slidably arranged on the top of the heat radiation base.
9. The heat dissipation structure of a circuit board for a resonator gyroscope of claim 8, wherein a pull rod is fixedly arranged at the top of the arc-shaped baffle, an air outlet baffle is fixedly arranged at the top of the pull rod, and the air outlet baffle is slidably arranged at the top of the inner side wall of the radiator shell.
10. The heat dissipating structure of a circuit board for a resonator gyroscope of claim 9 wherein said arcuate baffle has a length covering three-quarters of the air inlet and said air outlet baffle has a length covering three-quarters of the air outlet.

Description

Heat radiation structure of circuit board for resonance gyroscope Technical Field The invention relates to the technical field of circuit board heat dissipation, in particular to a heat dissipation structure of a circuit board for a resonant gyroscope. Background The resonant gyroscope is used as a high-precision inertial measurement device and is widely applied to complex dynamic scenes such as airborne, vehicle-mounted and ship-borne, the measurement precision of the resonant gyroscope directly depends on the frequency stability of a harmonic oscillator, and heat generated during the working of a circuit board is one of core factors which cause the frequency drift of the harmonic oscillator and influence the measurement precision. Along with the development of the resonant gyroscope towards miniaturization and high integration, the density of the circuit board elements is greatly improved, high-temperature areas (such as a driving chip and an amplifying circuit) and low-temperature areas (such as a logic control element) are distributed in a regional mode, heat is easy to accumulate in the high-temperature areas, if the heat cannot be rapidly led out and dissipated, the local junction temperature of the circuit board is too high, the service life of the elements is prolonged, the matching characteristics of the resonators and the circuits are damaged, and the measurement precision and the long-term stability of the gyroscope are seriously affected. Currently, a common heat dissipation structure of a resonant heat dissipation circuit board mainly includes a fixed fin type heat sink and a simple air duct type heat sink. The fixed fin type radiator adopts an integrated fin layout, cannot adapt to the differential heat dissipation requirements of high and low heat areas of a circuit board, and when long fins correspond to low heat areas and short fins correspond to high heat areas, insufficient heat dissipation area and heat accumulation are caused, space waste is caused by redundancy of the low heat areas, the whole heat dissipation efficiency is low, and quick heat export cannot be realized. Therefore, in the prior art, resonant heat dissipation circuit boards of different types, such as an on-board type, a vehicle-mounted type, a high-precision type or a common type, have different distribution angles and ranges of high and low hot areas due to function integration differences, and at present, in order to ensure heat dissipation efficiency, a special radiator is required to be designed for each type number independently, so that the fin layout is matched with the heat distribution of the type, and thus, the design period is long, the production flow is complicated, and the multi-type radiator is required to be independently opened and debugged, and the heat dissipation path is unsmooth and heat accumulation are possibly caused due to insufficient matching precision of the fin layout and the actual heat distribution of the special radiator, so that the rapid and high-efficiency heat dissipation cannot be realized. Disclosure of Invention The invention provides a heat dissipation structure of a circuit board for a resonant gyroscope, which aims to solve the technical problems. In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a heat radiation structure of circuit board for resonance gyroscope, includes heat dissipation circuit board, still includes: The heat dissipation base, it is located the heat dissipation circuit board below, heat dissipation base middle part fixed mounting has the heat insulating board, but heat insulating board top fixed mounting is in heat dissipation circuit board bottom, fixed mounting has the radiator shell on the heat dissipation base, the radiator shell is circular to set up in heat dissipation circuit board below, heat dissipation base bottom rotates and slidable mounting has the drive regulating spindle, drive regulating spindle top fixed mounting has the heat conduction plectane, heat conduction plectane bottom fixed mounting has the heat dissipation fin group, the fin height of heat dissipation fin group is continuous echelonment distribution from a highest point to a lowest point along the circumferencial direction of heat conduction plectane, and the echelonment distributes and can reach quick radiating effect to high heat element and low heat element. Furthermore, the left and right radiating subareas are divided by the heat insulation plate on the radiating base, and radiating fin groups are fixedly arranged at the bottoms of the heat conducting circular plates in each subarea, so that the independent fine control effect of the subareas is achieved. Further, a copper heat conduction belt is fixedly arranged on the radiating fins of the radiating fin group, so that heat conduction efficiency is enhanced. Furthermore, the bottom of the driving adjusting shaft is fixedly provided with an adjusting rotating