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CN-121843560-B - Clamping platform for stacking and packaging semiconductor chips

CN121843560BCN 121843560 BCN121843560 BCN 121843560BCN-121843560-B

Abstract

The invention discloses a clamping platform for stacking and packaging semiconductor chips, and particularly relates to the technical field of semiconductor chip processing, wherein the clamping platform comprises a sleeve frame body, a mounting body, a plurality of groups of clamping mechanisms and a bidirectional imaging assembly; the device comprises a sleeve frame body, a mounting body, a plurality of groups of clamping mechanisms, a bidirectional imaging assembly, an active compensation clamping assembly, a sensor module and a sensor module, wherein the mounting body is rotatably arranged on the sleeve frame body, the clamping mechanisms are distributed at intervals along the circumferential direction of the mounting body, each group of clamping mechanisms comprises clamping blocks which can synchronously move in opposite directions or in opposite directions and form a square mounting area, the bidirectional imaging assembly is arranged on the clamping blocks, the active compensation clamping assembly is integrated on the clamping blocks and comprises a pressure control cavity formed in the clamping blocks, a clamping pair arranged on the clamping blocks and a plurality of compensation blocks connected to the clamping pair in a sliding manner. A set of multipoint and multi-degree-of-freedom active compensation clamping assembly is integrated in the clamping block of the clamping mechanism, and a set of high-precision vibration suppression and position compensation system is constructed by combining all-dimensional visual feedback provided by the bidirectional imaging assembly.

Inventors

  • AO GUOJUN
  • LI ZONGYA
  • GAO HUI
  • LIAO XIAOPING

Assignees

  • 南京睿芯峰电子科技有限公司

Dates

Publication Date
20260508
Application Date
20260312

Claims (10)

  1. 1. The clamping platform for stacking and packaging the semiconductor chips comprises a sleeve frame body (1) and is characterized by further comprising a mounting body (2), a plurality of groups of clamping mechanisms (3) and a bidirectional imaging assembly (6); the mounting body (2) is rotatably arranged on the sleeve frame body (1); the clamping mechanisms (3) are distributed at intervals along the circumferential direction of the mounting body (2), and each clamping mechanism (3) comprises clamping blocks (31) which can synchronously move towards each other or away from each other and form a square mounting area and are used for clamping a semiconductor chip; the bidirectional imaging component (6) is arranged on the clamping block (31) and is used for imaging the semiconductor chip, the clamping block (31) and the mounting body (2) and the clamping block (31) which are positioned at the working station; an active compensation clamping component is integrated on the clamping block (31); The active compensation clamping assembly comprises a pressure control cavity (331) formed in the clamping block (31), a clamping pair (321) arranged on the clamping block (31) and used for blocking the pressure control cavity (331), and a plurality of compensation blocks (324) connected to the clamping pair (321) in a sliding manner; The active compensation clamping assembly further comprises a sensor module (333) for monitoring the displacement of the compensation block (324) and the pressure in the pressure control cavity (331).
  2. 2. The clamping stage for semiconductor chip stack packaging according to claim 1, wherein the clamping block (31) has a clamping surface (311) and a bonding surface (313) perpendicular to each other and a toothed surface (312) adjacent to the clamping surface (311) and the bonding surface (313); A guide block (322) is arranged in the middle of the bonding surface (313), the guide block (322) is connected in a clamping pair (321) adjacent to the guide block in a sliding way, and the adjacent clamping surface (311) is in surface contact with the bonding surface (313); a sealing gasket (323) is arranged between the clamping surface (311) and the clamping pair (321).
  3. 3. The clamping platform for semiconductor chip stacking and packaging according to claim 2, wherein the clamping mechanism (3) further comprises a linear guide rail (32) installed in the installation body (2), a sliding block (39) slidingly connected to the linear guide rail (32), and a first driving unit arranged in the installation body (2), the first driving unit is in transmission connection with the clamping blocks (31) and is used for driving the pair of clamping blocks (31) to synchronously move, and the sliding block (39) is installed at the bottom of the clamping blocks (31).
  4. 4. The clamping platform for semiconductor chip stacking and packaging according to claim 3, wherein the first driving unit comprises a first motor (38), a worm (37) connected with an output shaft of the first motor (38), a worm wheel (36) meshed with the worm (37), a transmission shaft (35) coaxially and fixedly connected with the worm wheel (36), a second gear (33) meshed with a toothed surface (312) and an inner gear ring (34) meshed with all the second gears (33); One end of the transmission shaft (35) is fixedly connected with one of the gears II (33); The inner gear ring (34) is rotationally connected in the installation body (2), and the second gear (33) is connected in the installation body (2) through a shaft pin.
  5. 5. The clamping platform for semiconductor chip stacking and packaging as set forth in claim 4, wherein the clamping pair (321) is provided with sliding cavities (3211) corresponding to the compensating blocks (324) one by one, the compensating blocks (324) are slidably connected in the sliding cavities (3211), and a sealing rubber plug is arranged on a contact surface of the compensating blocks (324) and the sliding cavities (3211).
  6. 6. The clamping platform for stacking and packaging semiconductor chips, as set forth in claim 5, characterized in that a motor II (4) is installed at the top of the installation body (2), and a transmission assembly is arranged in the installation body (2); The transmission assembly comprises an external gear ring I (21) fixed on the mounting body (2) and a gear I (22) connected with the output shaft of the motor II (4), wherein the gear I (22) is meshed with the external gear ring I (21).
  7. 7. The clamping platform for stacking and packaging semiconductor chips as defined in claim 6, wherein the pressure control cavity (331) is formed by a closed space surrounded by the rear part of the compensation block (324) in the sliding cavity (3211) and the end wall of the sliding cavity (3211); The pressure control hole (332) penetrates through the wall body of the clamping block (31) and is communicated with the pressure control cavity (331), and the sensor module (333) comprises a pressure sensor arranged in the pressure control cavity (331) and a displacement sensor arranged in the pressure control cavity (331) and used for compensating the displacement of the block (324).
  8. 8. The clamping platform for semiconductor chip stacking and packaging according to claim 7, wherein the bidirectional imaging assembly (6) comprises at least one inward-looking imaging unit and at least one outward-looking imaging unit, the inward-looking imaging unit is used for imaging the upper surface of the semiconductor chip clamped by the clamping mechanism (3) and between the semiconductor chip and the clamping block (31), and the outward-looking imaging unit is used for imaging between the clamping block (31) and the mounting body (2).
  9. 9. The clamping platform for semiconductor chip stacking and packaging as set forth in claim 8, further comprising a control system electrically connected to the sensor module (333), the bi-directional imaging module (6), the first driving unit, the second motor (4), and the pressure control system connected to the pressure control hole (332); The control system is configured to receive monitoring data of the sensor module (333) and image data of the bidirectional imaging component (6), analyze the position deviation of the semiconductor chip and the vibration state of the position deviation of the clamping block (31), and generate a control instruction to adjust the pressure in the pressure control cavity (331) or control the first driving unit or the second motor (4) for compensatory adjustment.
  10. 10. The clamping platform for semiconductor chip stacking and packaging according to claim 9, wherein the control system is further configured to dynamically track and compensate and position the solder joint according to a preset solder wire path and a real-time image fed back by the bidirectional imaging component (6) during the solder wire bonding process of the chip.

Description

Clamping platform for stacking and packaging semiconductor chips Technical Field The invention relates to the technical field of semiconductor chip processing, in particular to a clamping platform for stacking and packaging semiconductor chips. Background Gold wire welding is a key process in chip packaging, and is to connect a bonding pad on a chip body with an external pin through an extremely fine gold wire so as to realize electrical interconnection. In the prior art, a group of ultrasonic wire bonders are generally used for carrying out gold wire bonding treatment on a chip, and in the bonding process, after a second welding spot is formed, gold wires are clamped and broken. At the moment that the gold wire is broken, an instant and tiny reaction force is generated on the chip, and the reaction force is not large, but the chip is extremely precise, light and thin, and slightly deviates, so that the subsequent gold wire welding is influenced, and finally the whole chip welding fails; In addition, when such a multilayer chip is handled by the existing wire bonding machine, a sequential operation mode is generally adopted, for example, all gold wires on one side of the chip are welded, then the chip is turned 180 degrees by a turning mechanism, and then the other side of the chip is welded. The method has the obvious defects that firstly, the efficiency is low, extra time is required for overturning and repositioning, secondly, one surface of the welding is finished firstly, and a welding spot and a gold wire of the welding are possibly subjected to thermal influence, mechanical vibration or stress and reliability risk when the other surface of the welding is welded subsequently; Aiming at the problems, the prior Chinese patent document with the publication number of CN114566456A, named as packaging equipment of a multi-layer stacked memory chip, proposes that two groups of welding and sealing mechanisms which are symmetrically distributed up and down relative to the chip are adopted, the two groups of welding and sealing mechanisms synchronously operate to respectively weld gold wires on the upper surface and the lower surface of the chip, the track directions of welding and sealing actions (especially gold wire breaking actions) of the two groups of mechanisms are opposite, and when the upper and the lower groups of welding wires break gold wires at the same time, the generated reaction forces are equal in magnitude and opposite in direction, and are symmetrical relative to the center of the chip, so that the reaction forces cancel each other, the chip is not influenced by net reaction forces in theory, the welding stability is improved, and double-sided simultaneous welding is realized; However, the scheme still has the defects that the scheme has the core thought that the scheme performs passive cancellation through force symmetry, but lacks active response capability for complex and various vibration sources (such as motor vibration of equipment, environmental conduction vibration, welding impact and the like) in actual production environment, a clamping mechanism is a rigid clamp, the capability of sensing vibration or chip offset in real time is not provided, active and flexible compensation adjustment cannot be performed, and once micro deviation exists in initial clamping due to asymmetric external force, clamp abrasion or workpiece tolerance or cancellation is incomplete, chips still can generate tiny displacement and accumulate to influence the yield of ultra-high precision packaging, and therefore, the clamping platform for semiconductor chip stacking and packaging is provided for solving the problems. Disclosure of Invention The present invention is directed to a clamping platform for stacking and packaging semiconductor chips, which solves the above-mentioned problems. In order to achieve the aim, the invention provides the technical scheme that the clamping platform for stacking and packaging the semiconductor chips comprises a sleeve frame body, a mounting body, a plurality of groups of clamping mechanisms and a bidirectional imaging assembly; the mounting body is rotatably arranged on the sleeve frame body; the clamping mechanisms are distributed at intervals along the circumferential direction of the mounting body, and each clamping mechanism comprises clamping blocks which can synchronously move in opposite directions or in opposite directions and form a square mounting area and are used for clamping the semiconductor chip; The bidirectional imaging component is arranged on the clamping block and is used for imaging the semiconductor chip, the clamping block, the mounting body and the clamping block which are positioned at the working station; the clamping block is integrated with an active compensation clamping component; the active compensation clamping assembly comprises a pressure control cavity formed in the clamping block, a clamping pair arranged on the clamping block and used fo