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CN-121971100-A - Flexible microelectrode and preparation method thereof

CN121971100ACN 121971100 ACN121971100 ACN 121971100ACN-121971100-A

Abstract

The application discloses a flexible microelectrode and a preparation method thereof, relating to the technical field of brain-computer interfaces, comprising a conducting wire layer, a first packaging layer and a second packaging layer, wherein the conducting wire layer is positioned on one side surface of the first packaging layer; the lead layer comprises a lead, a tail connecting point and an electrode site, the second packaging layer covers the first packaging layer and coats the lead layer, the second packaging layer exposes the electrode site and the tail connecting point, grooves are formed in the surface of the first packaging layer, the second packaging layer conformally covers the surfaces of the first packaging layer and the lead layer, and/or the first packaging layer and the second packaging layer are made of thermoplastic materials, and the first packaging layer and the second packaging layer are fused and fixed into an integral structure. According to the application, the first packaging layer and the second packaging layer form a similar embedded structure, or when the first packaging layer and the second packaging layer are made of thermoplastic materials and are fused and integrally formed, the risk of separation of the lead in the flexible microelectrode and the packaging layer is reduced, and the service life of the flexible microelectrode is prolonged.

Inventors

  • YU XINGNAN
  • ZHANG LI
  • SUN YUE

Assignees

  • 明视脑机科技(苏州)有限公司

Dates

Publication Date
20260505
Application Date
20260209

Claims (12)

  1. 1. A flexible microelectrode is characterized by comprising a first packaging layer; the lead layer is positioned on one side surface of the first packaging layer and comprises a plurality of leads, one end of each lead is connected with a tail connection point, and the other end of each lead is connected with an electrode site; The second packaging layer covers the surface of the first packaging layer, which is provided with the lead layer, and covers the lead layer; the surface of the first packaging layer, which is close to one side of the wire layer, is provided with a groove, and the second packaging layer conformally covers the surfaces of the first packaging layer and the wire layer; and/or the first packaging layer and the second packaging layer are made of thermoplastic materials, and the first packaging layer and the second packaging layer are fused and fixed into an integral structure.
  2. 2. The flexible microelectrode of claim 1, wherein the flexible electrode comprises a tail connection region and at least two electrode wires leading from the same side of the tail connection region; The tail connection points connected with the wires are all positioned in the tail connection area, and the electrode sites connected with the wires are all positioned at one end of the electrode wire far away from the tail connection area; The electrode wire comprises a plurality of wires which are arranged continuously.
  3. 3. The flexible microelectrode of claim 2, wherein an end of the wire electrode distal from the tail connection region is provided with a guide ring having a first through hole for mounting a metal rod.
  4. 4. The flexible microelectrode of claim 2, wherein the electrode wire comprises a first region and a second region, the first region being located between the second region and the tail connection region; The width of the second area is reduced from a second width gradient along the length direction of the electrode wire, and the second width is larger than the first width.
  5. 5. The flexible microelectrode according to claim 4, wherein the electrode sites to which the wires are connected are both located in the second region; For a plurality of wires in the same wire electrode, the lengths of the wires are sequentially increased in the width direction of the wire electrode.
  6. 6. The flexible microelectrode according to claim 4, wherein the electrode sites to which the wires are connected are both located in the second region; The wires in the same electrode wire are symmetrically distributed based on an axis parallel to the length direction of the electrode; For a plurality of wires in the same wire electrode, the length of the wires is inversely related to the distance of the axis.
  7. 7. The flexible microelectrode of claim 1, wherein the electrode site has a second through-hole for increasing contact area.
  8. 8. The flexible microelectrode according to claim 1, wherein the portion of the wire that connects to the electrode site is an arc.
  9. 9. The flexible microelectrode of claim 1, wherein the electrode site has a charge injection capacity greater than a charge injection capacity of the wire.
  10. 10. A method of making a flexible microelectrode comprising: Providing a carrier plate; Forming a first packaging layer on the surface of the carrier plate; Forming a wire layer on the surface of the first packaging layer, which is far away from the carrier plate, wherein the wire layer comprises a plurality of wires, one end of each wire is connected with a tail connection point, and the other end of each wire is connected with an electrode site; Forming a second packaging layer on the surface, far away from the carrier plate, of the first packaging layer, wherein the second packaging layer coats the lead layer; The surface of one side of the first packaging layer, which faces away from the carrier plate, is provided with a groove, and the second packaging layer conformally covers the surfaces of the first packaging layer and the wire layer; and/or, the first packaging layer and the second packaging layer are made of thermoplastic materials, and after the second packaging layer is formed, before the carrier plate is removed, the packaging structure further comprises the step of melting the first packaging layer and the second packaging layer into an integral structure through heat treatment.
  11. 11. The method of claim 10, wherein if the first encapsulation layer has the recess, the method of forming the first encapsulation layer comprises: Forming an initial packaging layer on the surface of the carrier plate; patterning the surface of one side of the initial packaging layer, which faces away from the carrier plate, so as to form the first packaging layer with the grooves; or forming a first packaging layer with the grooves based on a printing process.
  12. 12. The production method according to claim 10 or 11, characterized by further comprising: And removing the carrier plate.

Description

Flexible microelectrode and preparation method thereof Technical Field The application relates to the technical field of brain-computer interfaces, in particular to a flexible microelectrode and a preparation method thereof. Background With the rapid development of the brain-computer interface industry, electrodes are attracting attention as important components for connecting nerves in brain-computer interfaces. Meanwhile, compared with the traditional macroscopic electrode, the flexible microelectrode has the unique advantages of less damage to tissues due to volume microminiature, more electrode sites, namely high flux, and finer nerve signal acquisition and more accurate nerve stimulation regulation and control can be realized. However, the flexible microelectrode has some problems to be solved, such as a layering problem found in long-term observation, and the interface bonding force between the packaging layer and the internal lead is insufficient, so that the lead is easy to peel off from the packaging layer under the long-term action of in-vivo physiological environment, thereby causing the disconnection of an electrode circuit or distortion of signal transmission, and finally causing the complete failure of the microelectrode function, and seriously restricting the reliability and the service life of the microelectrode in a long-term brain-computer interface system. Disclosure of Invention In view of the above, the present application provides a flexible microelectrode and a preparation method thereof, so as to reduce the risk of separation of wires in the flexible microelectrode from a packaging layer. The specific scheme is as follows: the application provides a flexible microelectrode, which comprises a first packaging layer, a wire layer and a second packaging layer; the lead layer is positioned on one side surface of the first packaging layer and comprises a plurality of leads, one end of each lead is connected with a tail connection point, and the other end of each lead is connected with an electrode site; the second packaging layer covers the surface of the first packaging layer, which is provided with the lead layer, and coats the lead layer; The first packaging layer and the second packaging layer are made of thermoplastic materials, and the first packaging layer and the second packaging layer are fused and fixed into an integrated structure. According to the application, the groove structure is arranged on the surface of the first packaging layer, the second packaging layer is filled with the groove structure while coating the wire layer, so that the similar embedded structure is formed, the contact area and the interface friction force of the first packaging layer and the second packaging layer are greatly increased, the relative displacement of the wire layer and the packaging layer is restrained from the structural layer, the probability of stripping and falling of the wire layer and the packaging layer is reduced, and the service life of the flexible microelectrode is prolonged. Or when the first packaging layer and the second packaging layer are made of thermoplastic materials and are formed integrally by melting, physical gaps among the first packaging layer, the wire layer and the second packaging layer are eliminated, molecular-level bonding is formed at the interface of the packaging layers after melting and solidification, the bonding strength is high, the integrity of the flexible microelectrode is maintained, the situation of interlayer cracking or wire loosening is reduced, and the service life of the flexible microelectrode is prolonged. In some embodiments, the flexible electrode includes a tail connection region and at least two wires exiting from the same side of the tail connection region; The tail connection points connected with the wires are all positioned in the tail connection area, and the electrode sites connected with the wires are all positioned at one end of the electrode wire far away from the tail connection area; The electrode wire comprises a plurality of wires which are arranged continuously. In some embodiments, the end of the wire electrode remote from the tail connection region is provided with a guide ring having a first through hole for mounting a metal rod. In some embodiments, the electrode wire includes a first region and a second region, the first region being located between the second region and the tail connection region; the width of the second area is reduced from a second width gradient along the length direction of the electrode wire, and the second width is larger than the first width. In some embodiments, the electrode sites to which the leads are connected are all located in the second region; For a plurality of wires in the same wire electrode, the lengths of the wires sequentially increase in the width direction of the wire electrode. In some embodiments, the electrode sites to which the leads are connected are all located in the secon