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CN-121972272-A - Grinding device for high-purity silicon powder

CN121972272ACN 121972272 ACN121972272 ACN 121972272ACN-121972272-A

Abstract

The application discloses a grinding device for high-purity silicon powder, which comprises a grinding cylinder, a preliminary grinding mechanism and a filtering mechanism, wherein the preliminary grinding mechanism and the grinding cylinder are arranged in a penetrating manner, the filtering mechanism is arranged in the grinding cylinder and is arranged between the inner wall of the grinding cylinder and the preliminary grinding mechanism, the filtering mechanism comprises a filtering cover and a plurality of groups of adsorption cylinders, the filtering cover is longitudinally arranged in the grinding cylinder, an annular ring is fixedly sleeved on the outer wall of the filtering cover and is arranged in an annular groove formed in the inner wall of the grinding cylinder, the bottom surface of the filtering cover is provided with a plurality of groups of filtering holes, each group of adsorption cylinders are respectively arranged in the corresponding filtering holes, and surrounding coils are arranged in the adsorption cylinders.

Inventors

  • ZHU GUANGBIN
  • Tian Tongyi

Assignees

  • 徐州凌云硅业股份有限公司

Dates

Publication Date
20260505
Application Date
20260317

Claims (8)

  1. 1. The utility model provides a grinder of high-purity silica flour which characterized in that includes: a grinding cylinder (1) longitudinally arranged; a preliminary grinding mechanism (4), wherein the preliminary grinding mechanism (4) and the grinding cylinder (1) form a penetrating arrangement; The filtering mechanism (5) is arranged in the grinding cylinder (1), the filtering mechanism (5) is arranged between the inner wall of the grinding cylinder (1) and the preliminary grinding mechanism (4), wherein, The filtering mechanism (5) comprises a filtering cover (51) and a plurality of groups of adsorption cylinders (58), the filtering cover (51) is longitudinally arranged in the grinding cylinder (1), an annular ring (52) is fixedly sleeved on the outer wall of the filtering cover (51), and the annular ring (52) is arranged in an annular groove (53) formed in the inner wall of the grinding cylinder (1); The bottom surface of filter mantle (51) is multiunit filtration pore (502), every group adsorption tube (58) set up respectively in the inside of corresponding filtration pore (502), the inside surrounding coil that is provided with of adsorption tube (58).
  2. 2. Grinding device of high purity silicon powder according to claim 1, characterized in that said preliminary grinding means (4) comprise: the servo motor (41) is arranged at a position right below the grinding cylinder (1), a U-shaped motor seat (42) is fixedly arranged at the bottom of the servo motor (41), and the upper end part of the motor seat (42) is fixedly arranged with the bottom surface of the grinding cylinder (1) through a bolt; the bottom end of the installation shaft (43) is fixedly installed with the output end of the servo motor (41), and one end of the installation shaft (43) far away from the servo motor (41) movably penetrates through the bottom surface of the grinding cylinder (1) and extends into the grinding cylinder (1); the prismatic table grinding block (44) is arranged in the grinding cylinder (1), and the bottom surface of the prismatic table grinding block (44) is fixedly arranged at the top end of the mounting shaft (43).
  3. 3. Grinding device of high purity silicon powder according to claim 2, wherein the filtering mechanism (5) further comprises: The first springs (54) are arranged in a plurality of groups, the first springs (54) are arranged in the annular groove (53) in an annular array, the top ends of the first springs (54) are fixedly arranged on the bottom surface of the annular ring (52), and the bottom ends of the first springs (54) are fixedly arranged on the bottom of the inner wall of the annular groove (53); the auxiliary cover (55) is sleeved outside the mounting shaft (43), the inner diameter size of the auxiliary cover (55) is larger than the outer diameter size of the mounting shaft (43), and the bottom surface of the auxiliary cover (55) is fixedly mounted with the bottom of the inner wall of the filter cover (51); wherein the top surface of the auxiliary cover (55) is provided with a plurality of circular grooves (57) distributed in an annular array; The number of the auxiliary rods (56) is correspondingly consistent with that of the round grooves (57), and the top ends of the auxiliary rods (56) are fixedly arranged on the bottom surface of the prismatic table grinding block (44).
  4. 4. Grinding device for high purity silicon powder according to claim 1, wherein the filtering mechanism (5) further comprises: The spiral sheet (503) is sleeved on the outer wall of the mounting shaft (43), the upper diameter of the spiral sheet is larger than the lower diameter of the spiral sheet, and the positive spiral direction is the same as the rotation direction of the device.
  5. 5. Grinding device for high purity silicon powder according to claim 1, further comprising a grinding reinforcing mechanism (6), said grinding reinforcing mechanism (6) being connected to said preliminary grinding mechanism (4), said grinding reinforcing mechanism (6) being located between said preliminary grinding mechanism (4) and said filtering mechanism (5), said grinding reinforcing mechanism (6) comprising: a cylindrical grinding block (61) disposed in the filter housing (51); The bottom end of the T-shaped support column (62) is fixedly arranged with the bottom surface of the cylindrical grinding block (61), and the upper end part of the T-shaped support column (62) is arranged in an inner groove (63) formed in the bottom surface of the prismatic table grinding block (44) through a spherical hinged support; the second spring (64) is arranged in the inner groove (63), the bottom end of the second spring (64) is fixedly arranged with the top end of the T-shaped support column (62), and the top end of the second spring (64) is fixedly arranged with the top of the inner wall of the inner groove (63); An upper grinding disc (65) is arranged above the inner wall of the filter cover (51).
  6. 6. Grinding device of high purity silicon powder according to claim 1, wherein the filtering mechanism (5) further comprises a conductive disc (59) and a conductive block (501), a plurality of groups of adsorption cylinders (58) are electrically connected with the conductive disc (59), the conductive block (501) is arranged on the inner wall of the grinding cylinder (1) through a plurality of groups of springs, the conductive block (501) is electrically connected with the conductive disc (59), and the conductive block (501) is communicated with an external power supply.
  7. 7. Grinding device for high purity silicon powder according to claim 2, wherein the distance between the outer surface of the prismatic table grinding block (44) and the inner wall of the grinding cylinder (1) decreases gradually from top to bottom.
  8. 8. A grinding device for high purity silicon powder according to claim 3, wherein the bottom end of the auxiliary rod (56) is spherical, and the auxiliary rod (56) is made of rubber material.

Description

Grinding device for high-purity silicon powder Technical Field The application relates to the technical field of silicon powder grinding, in particular to a high-purity silicon powder grinding device. Background During the formation of the silicon ore, magnetic minerals such as magnetite, hematite and the like may be associated. When silicon powder is produced by using such silicon ore as a raw material, the magnetic minerals are processed together with the silicon ore, and then mixed into the silicon powder to become magnetic impurities. For example, some of the precipitated silica minerals often form intergrowth with iron-containing minerals, which break down into small particles and become incorporated into the silica powder system during mining and subsequent crushing, grinding, etc. In the silicon powder processing process, equipment such as a crusher, a grinder and the like are used, and metal parts in the equipment can be worn during long-term operation. The metal scraps generated by the abrasion often contain ferromagnetic substances, and the scraps can enter silicon powder after common steel components are worn. The continuous friction between the grinding medium and the cylinder wall can lead to abrasion and peeling of the surface of the cylinder wall, and the peeled fragments can be mixed with silicon powder to become an important source of magnetic impurities. The existence of magnetic impurities is extremely harmful to the quality of the high-purity silicon powder. In the fields of semiconductors, photovoltaics and the like with extremely high requirements on the purity of silicon powder, even very small amounts of magnetic impurities can seriously influence the performance of products. In the manufacture of semiconductors, magnetic impurities can interfere with electron migration, so that the performance of a chip is unstable, and in the photovoltaic industry, the photoelectric conversion efficiency of a silicon wafer can be reduced. Disclosure of Invention The present application aims to solve at least one of the technical problems in the related art to some extent. Therefore, an object of the present application is to provide a grinding apparatus for high purity silicon powder, in which each impurity is adsorbed by approaching an adsorption cylinder with a greater chance after dispersion, thereby realizing complete adsorption of the impurity and improving purity of the silicon powder. In order to achieve the above purpose, the first aspect of the embodiment of the application provides a grinding device for high-purity silicon powder, which comprises a grinding cylinder, a preliminary grinding mechanism, a filtering mechanism and a plurality of groups of adsorption cylinders, wherein the grinding cylinder is longitudinally arranged, the preliminary grinding mechanism and the grinding cylinder are arranged in a penetrating manner, the filtering mechanism is arranged in the grinding cylinder and is arranged between the inner wall of the grinding cylinder and the preliminary grinding mechanism, the filtering mechanism comprises a filtering cover and the plurality of groups of adsorption cylinders, the filtering cover is longitudinally arranged in the grinding cylinder, an annular ring is fixedly sleeved on the outer wall of the filtering cover and is arranged in an annular groove formed in the inner wall of the grinding cylinder, the bottom surface of the filtering cover is provided with a plurality of groups of filtering holes, each group of adsorption cylinders are respectively arranged in the corresponding filtering holes, and surrounding coils are arranged in the adsorption cylinders. In addition, the grinding device for the high-purity silicon powder provided by the application can also have the following additional technical characteristics: The preliminary grinding mechanism comprises a servo motor, a mounting shaft, a prismatic table grinding block and a prismatic table grinding block, wherein the servo motor is arranged at a position right below a grinding cylinder, a U-shaped motor seat is fixedly arranged at the bottom of the servo motor, the upper end of the motor seat is fixedly arranged with the bottom surface of the grinding cylinder through a bolt, the bottom end of the mounting shaft is fixedly arranged with the output end of the servo motor, one end of the mounting shaft, which is far away from the servo motor, movably penetrates through the bottom surface of the grinding cylinder and extends into the grinding cylinder, and the prismatic table grinding block is arranged in the grinding cylinder and is fixedly arranged with the bottom surface of the prismatic table grinding block and the top end of the mounting shaft. The filter mechanism further comprises a plurality of groups of first springs, an auxiliary cover and a plurality of auxiliary rods, wherein the plurality of groups of first springs are arranged in the annular groove in an annular array mode, the top ends of the fi