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CN-121972369-A - Intelligent glue homogenizing device and method based on semiconductor wafer processing

CN121972369ACN 121972369 ACN121972369 ACN 121972369ACN-121972369-A

Abstract

The invention discloses an intelligent glue homogenizing device and method based on semiconductor wafer processing, and relates to the technical field of semiconductor wafer processing. According to the intelligent glue homogenizing device and method based on semiconductor wafer processing, through the cooperation of a splash guard mechanism, a glue remaining removing mechanism, a sucker mechanism, a driving large gear, a servo motor, an air pump and a collecting box, the servo motor is used as a power source, the servo motor is in meshed transmission through the driving large gear, the sucker mechanism and the glue remaining removing mechanism are synchronously driven, the wafer rotation glue homogenizing and glue remaining removing synchronous operation is realized, the sucker mechanism self-driven balance adjustment can be carried out, the rotation gravity center can be adaptively corrected, radial runout and gravity center deviation are restrained, the wafer is ensured to stably rotate, the glue film uniformity is improved, the splash guard mechanism is matched with the glue remaining removing mechanism, residual glue on the inner wall of the splash guard mechanism is automatically scraped, residual accumulation is avoided, concentrated collection through the collecting box is prevented, the influence of glue remaining pollution on processing precision is prevented, and high-efficiency, stability and automatic glue homogenizing operation is integrally realized.

Inventors

  • HONG MEI

Assignees

  • 苏州博欧自动化科技集团有限公司

Dates

Publication Date
20260505
Application Date
20260407

Claims (10)

  1. 1. Intelligent glue homogenizing device based on semiconductor wafer processing, which is characterized by comprising: The anti-splash device comprises a case, wherein a splash guard mechanism is fixedly arranged at the top of the case, a chassis positioned in the splash guard mechanism is fixedly arranged at the top of the case through a plurality of supporting blocks, a driving shaft penetrating through the top of the case is rotatably arranged at the left side of the bottom of the chassis, a driving large gear positioned above the case is fixedly sleeved on the outer fixing sleeve of the driving shaft, a servo motor is fixedly arranged at the bottom of an inner cavity of the case, an output shaft of the servo motor is fixedly connected with the bottom of the driving shaft, an air pump is fixedly arranged at the bottom of the inner cavity of the case, a converging pipe is fixedly arranged in the middle of the bottom of the inner cavity of the case, an air extraction end of the air pump is fixedly communicated with one side of the converging pipe, an annular guide box is fixedly arranged at the top of the inner cavity of the case, a collecting box communicated with the annular guide box is fixedly arranged at the upper part of the rear wall of the inner cavity of the case, a sealing door is arranged at the rear end of the case, and a protecting cover is arranged at the top of the splash guard mechanism; The residual glue removing mechanism is used for removing glue on the inner wall of the splash guard mechanism and is arranged in the splash guard mechanism; the sucking disc mechanism is used for adsorbing and positioning the semiconductor wafer, and the sucking disc mechanism rotates to penetrate through the top of the chassis and is positioned between the chassis and the inner part of the splash guard mechanism.
  2. 2. The intelligent glue homogenizing device based on semiconductor wafer processing, as set forth in claim 1, wherein the splash guard mechanism comprises a splash guard body fixedly arranged at the top of the case, a plurality of exhaust ports communicated with the inside of the annular guide box are uniformly formed in one circle at the bottom of the splash guard body, an annular cover is fixedly arranged between the side walls of the top of the inner cavity of the splash guard body, an annular groove is formed in one circle at the bottom of the annular cover, and an outer toothed ring is rotationally arranged in the annular cover.
  3. 3. The intelligent glue homogenizing device based on semiconductor wafer processing, which is characterized in that the residual glue removing mechanism comprises an inner gear ring, the inner gear ring is rotatably arranged between the outer side of the bottom of the chassis and the lower part of the inner cavity of the splash guard body, the inner gear ring is meshed with the driving large gear, a conveying cylinder is fixedly arranged on one side of the inner gear ring through a clamp, the bottom of the conveying cylinder is positioned in the lower inner cavity of the splash guard body, a vertical groove is formed in one side, close to the inner wall of the splash guard body, of the conveying cylinder, and a scraping piece is fixedly arranged on one end of the side wall of the conveying cylinder and positioned in the vertical groove.
  4. 4. The intelligent glue homogenizing device based on semiconductor wafer processing according to claim 3, wherein one end of the scraping blade, which is far away from the conveying cylinder, is contacted with the inner wall of the splash guard body, a transverse plate is fixedly arranged between the front wall and the rear wall of the bottom of the inner cavity of the conveying cylinder, a shaft lever is rotatably arranged between the top of the inner cavity of the conveying cylinder and the transverse plate, the top of the shaft lever rotatably penetrates through the top of the conveying cylinder and is fixedly provided with a pinion, the top of the shaft lever penetrates through an annular groove, the pinion is positioned in the annular cover and meshed with the outer tooth ring, and a packing auger blade positioned in the conveying cylinder is fixedly sleeved outside the shaft lever.
  5. 5. The intelligent glue homogenizing device based on semiconductor wafer processing, which is characterized in that the sucker mechanism comprises a hollow rotating shaft, the bottom of the hollow rotating shaft is rotationally communicated with the top of a converging pipe, the top of the hollow rotating shaft is rotationally communicated between the top of a chassis and the top of the chassis, a placing disc is fixedly arranged at the top of the hollow rotating shaft, a round bottom cover sleeved outside the hollow rotating shaft is fixedly arranged at the bottom of the placing disc, the round bottom cover is positioned above the chassis, a driven pinion positioned below the chassis is fixedly sleeved outside the hollow rotating shaft, the driven pinion is meshed with a driving gearwheel, a dynamic balance adjusting assembly positioned in the round bottom cover is arranged at the bottom of the placing disc, a converging cavity is formed in the placing disc, a plurality of air inlets communicated with the converging cavity are uniformly formed in the top of the placing disc, and the inside of the hollow rotating shaft is communicated with the converging cavity.
  6. 6. The intelligent glue homogenizing device based on semiconductor wafer processing, as set forth in claim 5, wherein the dynamic balance adjusting assembly comprises an annular tube, a plurality of brackets are uniformly and fixedly sleeved outside the annular tube, the top of each bracket is fixedly connected with the bottom of a placing disc, a plurality of adjusting boxes positioned on the outer side of the annular tube in a circle are uniformly and fixedly arranged at the bottom of the placing disc, and a plurality of limiting boxes positioned on the inner side of the annular tube in a circle are uniformly and fixedly arranged at the bottom of the placing disc.
  7. 7. The intelligent glue homogenizing device based on semiconductor wafer processing as claimed in claim 6, wherein the number of the brackets, the regulating boxes and the limiting boxes is the same, one side, far away from the annular pipe, of the bottom of each regulating box is fixedly communicated with an elbow, and one end, far away from the regulating box, of each elbow is fixedly communicated with the bottom of the annular pipe.
  8. 8. The intelligent glue homogenizing device based on semiconductor wafer processing, as set forth in claim 7, is characterized in that a piston block is slidably disposed between the inner walls of each adjusting box, a counterweight slider is slidably disposed between the inner walls of each limiting box, a push rod is fixedly disposed between the piston block and the adjacent counterweight slider, the push rod slidably penetrates between the side wall of the adjusting box and the side wall of the limiting box, and each push rod penetrates through the adjacent bracket.
  9. 9. The intelligent glue homogenizing device based on semiconductor wafer processing as claimed in claim 8, wherein springs are sleeved outside each push rod, the springs are located between one side of the counterweight sliding block close to the adjusting box and the inner wall of the limiting box, and mercury is filled among the annular tube, each adjusting box and the inside of each bent tube.
  10. 10. An intelligent glue homogenizing method based on semiconductor wafer processing is characterized in that the intelligent glue homogenizing device based on semiconductor wafer processing is adopted according to any one of claims 1-9, and the method comprises the following steps: firstly, taking a protective cover off from the top of a splash guard mechanism, then placing a semiconductor wafer to be processed on the top of the sucker mechanism, enabling the center of the semiconductor wafer to be located at the center of the sucker mechanism, starting an air pump, vacuumizing the inside of the sucker mechanism through a converging pipe, firmly adsorbing the semiconductor wafer on the surface of the sucker mechanism, then dripping photoresist on the center of the surface of the semiconductor wafer, and covering the protective cover on the top of the splash guard mechanism again; step two, starting a servo motor to drive a driving shaft and a driving large gear to rotate, and rotating a residual photoresist removing mechanism, a sucking disc mechanism and a semiconductor wafer under the drive of the driving large gear, wherein the sucking disc mechanism can timely overcome radial runout in the high-speed rotation process to automatically adjust dynamic balance, so that the gravity center is prevented from shifting during rotation, photoresist is uniformly paved on the semiconductor wafer by utilizing centrifugal force, the film thickness is more uniform, and the photoresist homogenizing operation on the semiconductor wafer is completed; And thirdly, under the action of centrifugal force, superfluous photoresist is thrown onto the side wall of the inner cavity of the splash guard mechanism, and meanwhile, the residual photoresist cleaning mechanism works to scrape and send the photoresist on the side wall of the inner cavity of the splash guard mechanism into the annular guide box, finally, the photoresist is collected in the collecting box, and the sealing door is opened periodically to enable the inside of the collecting box to be exposed, so that the photoresist in the collecting box is cleaned uniformly.

Description

Intelligent glue homogenizing device and method based on semiconductor wafer processing Technical Field The invention relates to the technical field of semiconductor wafer processing, in particular to an intelligent glue homogenizing device and method based on semiconductor wafer processing. Background Semiconductor wafers are the basic carrier for manufacturing chips, and are usually made of high-purity monocrystalline silicon, the surface of the semiconductor wafers is flat like a mirror, the semiconductor wafers are the foundation of integrated circuits, photoresist is coated on the surfaces of the wafers in chip production, circuit patterns are transferred onto the wafers through a series of precise processes such as photoetching, etching and doping, the photoresist is used as a key photosensitive material in a photoetching link, the pattern precision is determined, and billions of transistors are finally constructed on the wafers, so that the chips with complete functions are formed. The utility model discloses a high-efficient glue homogenizing device is used in semiconductor wafer processing to reference publication number CN118550157B, when needs carry out the spin processing with the semiconductor wafer, the staff can place the semiconductor wafer on spin mechanism and carry out rotatory operation, simultaneously through supplying glue subassembly to introduce the colloid from the center of semiconductor wafer, evenly distribute the colloid at the in-process of semiconductor wafer high-speed rotation, simultaneously through selecting suitable spin thickness control subassembly to seal the edge of wafer according to the specification of wafer for the colloid can be according to the thickness of settlement and scribble, utilizes edge accuse glue mechanism to carry out the edge of trimming to the wafer simultaneously. Comprehensive analysis of the above referenced patents can lead to the following drawbacks: The existing intelligent photoresist homogenizing device and method based on semiconductor wafer processing mainly comprises a splash guard, a sucker mechanism, a servo motor and an air pump, when the intelligent photoresist homogenizing device and method are used, a semiconductor wafer is adsorbed on the sucker mechanism by the air pump in a negative pressure mode, the servo motor drives the sucker mechanism to rotate at a high speed, photoresist is uniformly spread on the surface of the wafer by means of centrifugal force, in actual operation, radial runout or gravity center deviation is easy to occur when the sucker mechanism rotates at a high speed due to the influences of processing precision, installation positioning deviation and the like of the wafer, however, the sucker mechanism is difficult to timely and automatically perform dynamic balance adjustment, uneven photoresist spreading and poor consistency of thickness of a glue film are caused, the photoresist homogenizing precision is directly reduced, glue solution thrown to the inner wall of the splash guard is difficult to timely scrape automatically, and residual glue solution is easy to accumulate. Disclosure of Invention Aiming at the defects of the prior art, the invention provides an intelligent glue homogenizing device and method based on semiconductor wafer processing, which solve the problems that in actual operation, radial runout or gravity center deviation is easy to occur when a sucking disc mechanism rotates at a high speed due to the influence of the processing precision, installation positioning deviation and the like of a wafer, but the sucking disc mechanism is difficult to timely and automatically perform dynamic balance adjustment, so that photoresist spreading is uneven, the consistency of the thickness of a glue film is poor, the glue homogenizing precision is directly reduced, glue solution thrown to the inner wall of a splash guard is difficult to automatically scrape in time, and glue solution residues are easy to accumulate. In order to achieve the purpose, the intelligent glue homogenizing device based on the semiconductor wafer processing comprises the following technical scheme: The anti-splash device comprises a case, wherein a splash guard mechanism is fixedly arranged at the top of the case, a chassis positioned in the splash guard mechanism is fixedly arranged at the top of the case through a plurality of supporting blocks, a driving shaft penetrating through the top of the case is rotatably arranged at the left side of the bottom of the chassis, a driving large gear positioned above the case is fixedly sleeved on the outer fixing sleeve of the driving shaft, a servo motor is fixedly arranged at the bottom of an inner cavity of the case, an output shaft of the servo motor is fixedly connected with the bottom of the driving shaft, an air pump is fixedly arranged at the bottom of the inner cavity of the case, a converging pipe is fixedly arranged in the middle of the bottom of the inner cavity of the case,