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CN-121972370-A - Photoresist homogenizing method, photoresist homogenizing equipment and readable storage medium

CN121972370ACN 121972370 ACN121972370 ACN 121972370ACN-121972370-A

Abstract

The invention relates to the technical field of semiconductor processes, in particular to a photoresist homogenizing method, photoresist homogenizing equipment and a readable storage medium, which solve the problems that: in order to solve the problem of uniformity of film thickness of pigment glue on a square substrate, the invention provides a glue homogenizing method, which comprises a first spreading step, a second spreading step, a first spreading step and a second spreading step, wherein the first spreading step is used for keeping the substrate to rotate at a first rotating speed for a first period of time when a preset amount of photoresist is dripped to the center of the square substrate so as to drive glue to extend to form a liquid glue storage layer which does not cover the edge of the square substrate yet; the first rotating speed is 100-200rpm, the radius of the liquid colloid storage layer is controlled to be 0.3-0.6 times of the inscribed circle radius of the square substrate, and the second glue homogenizing step is to accelerate the square substrate from the first rotating speed to the second rotating speed at an angular acceleration of not less than 8000rpm/s without intermittence after the first spreading step is finished, and keep the second time period, so that the liquid colloid storage layer is expanded and covers the surface of the square substrate to form a glue film.

Inventors

  • LI PENG
  • WANG CHENGHONG
  • YE ZHENPENG
  • ZHANG WUXIN
  • ZHANG QI
  • XU KE
  • WANG XINGGUO

Assignees

  • 宁波润华全芯微电子设备有限公司

Dates

Publication Date
20260505
Application Date
20260409

Claims (10)

  1. 1. A photoresist evening method for coating a square substrate with a photoresist, wherein the photoresist is a pigment photoresist containing a solid pigment dispersion, the photoresist evening method comprising: A first spreading step, namely keeping the square substrate to rotate for a first time at a first rotating speed when the photoresist with a preset dosage is dripped to the center of the square substrate, so as to drive the glue solution to extend to form a liquid colloid storage layer which does not cover the edge of the square substrate, wherein the first rotating speed is 100-200rpm, and the radius of the liquid colloid storage layer is controlled to be between 0.3 and 0.6 times of the radius of an inscribed circle of the square substrate; And a second spin coating step, namely after the first spreading step is finished, accelerating the square substrate from the first rotating speed to a second rotating speed at an angular acceleration of not lower than 8000rpm/s without intermittence, and keeping for a second time period, so that the liquid colloid storage layer is expanded and covers the surface of the square substrate to form a glue film, and the second rotating speed is not lower than 1000rpm.
  2. 2. The photoresist evening method according to claim 1, wherein the first time period is 1 to 3 seconds and the second time period is 3 to 5 seconds, so as to complete planarization of the adhesive film before solvent evaporation causes preliminary shaping of the adhesive film.
  3. 3. The photoresist stripping method according to claim 1, wherein the second rotation speed is 1000-1600rpm.
  4. 4. The photoresist evening method according to claim 1, wherein after the second evening step, an in-situ stabilization step is performed, and the in-situ stabilization step is used for performing preliminary shaping of the adhesive film by solvent evaporation before the square substrate is moved out of the current process environment.
  5. 5. The photoresist stripping method according to claim 4, wherein the in-situ stabilization step lasts for a preset third duration, the third duration being 5 to 15 seconds.
  6. 6. The photoresist seasoning method of claim 4, wherein in the in situ stabilization step, the square substrate is held stationary or rotated at a third rotational speed lower than the first rotational speed.
  7. 7. The photoresist seasoning method of claim 6, wherein in the in-situ stabilization step, the third rotation speed is 40-70rpm when the square substrate rotates at the third rotation speed.
  8. 8. The photoresist unifying method according to claim 1, characterized in that, in the first spreading step, the volume of the photoresist dripped into the center of the square substrate is 0.60ml to 0.80ml.
  9. 9. A spin coater apparatus to which the spin coater method according to any one of claims 1 to 8 is applied, comprising: the rotary carrying platform is used for carrying the square substrate; The servo motor is connected with the rotary carrier and can provide angular acceleration not lower than 8000rpm/s to drive the rotary carrier to rotate; The photoresist dripping device is used for dripping photoresist to the square substrate; And the controller is used for controlling the rotary carrying platform and the glue dropping device.
  10. 10. A computer readable storage medium having stored thereon a computer program, which when executed by a processor drives a controller of a photoresist uniformizing device to perform a photoresist uniformizing method according to any one of claims 1 to 8.

Description

Photoresist homogenizing method, photoresist homogenizing equipment and readable storage medium Technical Field The invention relates to the technical field of semiconductor processes, in particular to a photoresist homogenizing method, photoresist homogenizing equipment and a readable storage medium. Background In the manufacture of semiconductor display panels (e.g., LCD, OLED), a uniform photoresist film is coated on a substrate. The pigment gum contains solid pigment dispersoid, and the solvent component, the volatilization characteristic and the leveling property of the pigment gum are obviously different from those of the common photoresist. When the conventional spin coating process is adopted, because the pigment glue is different from the common photoresist, the initial rotating speed is increased to cause the glue solution to be rapidly thinned, the high-volatility solvent is promoted to be instantaneously volatilized by a huge specific surface area, the edge area is skinned in advance and is difficult to flow, and in the conventional gentle acceleration, the effective shearing force generated by the edge of the glue solution is greatly attenuated, so that the glue solution for driving the edge to be preliminarily skinned is insufficient to flow. The attenuation of the shearing force and the rise of the solid content simultaneously occur at the edge of the glue solution, so that the glue solution is difficult to spread further to the corners after spreading to the edge, and finally, an uneven glue film is formed on a square substrate (such as a color filter and a mask plate) and is expressed as 'colored stripes' (rainbow-like stripes). In the related art, the air flow in the cavity is controlled by adding the cover plate during spin coating to improve the yield, but the problems of color patterns and uneven film thickness generated during spin coating of pigment glue cannot be solved, so that how to ensure the thickness and uniformity of the coating of the photoresist film layer on the surface of the square substrate is one of the problems to be solved urgently by those skilled in the art. Disclosure of Invention The invention solves the problem of how to solve the problem of uniformity of the film thickness of pigment glue on a square substrate. In order to solve the above problems, an embodiment of the present invention provides a photoresist uniformizing method applied to coating a photoresist on a square substrate, the photoresist being a pigment photoresist containing a solid pigment dispersion, the photoresist uniformizing method including: A first spreading step, namely keeping the square substrate to rotate for a first time at a first rotating speed when a preset amount of photoresist is dripped to the center of the square substrate, so as to drive the glue solution to extend to form a liquid colloid storage layer which does not cover the edge of the square substrate, wherein the first rotating speed is 100-200rpm, and the radius of the liquid colloid storage layer is controlled to be between 0.3 and 0.6 times of the radius of an inscribed circle of the square substrate; and a second spin coating step, namely after the first spreading step is finished, accelerating the square substrate from the first rotating speed to the second rotating speed at an angular acceleration of not less than 8000rpm/s without intermittence, and keeping the second time period to expand the liquid colloid storage layer and cover the surface of the square substrate to form a glue film, wherein the second rotating speed is not less than 1000rpm. Compared with the prior art, the technical effect achieved by adopting the technical scheme is that the filling problem of pigment glue at the corners of the square substrate is fundamentally solved through the synergistic effect of the first spreading step and the second glue homogenizing step. The design avoids the premature skinning of the edge caused by the traditional one-time full-spreading process, and simultaneously provides shearing force breaking through the yield stress of pigment glue in millisecond-level time by utilizing high acceleration, so that the glue solution completes corner rearrangement before the solvent volatilizes. In one embodiment of the present invention, the first duration is1 to 3 seconds and the second duration is 3 to 5 seconds to complete the planarization of the adhesive film before the solvent volatilizes to cause the adhesive film to be preliminarily shaped. Compared with the prior art, the technical scheme has the advantages that the first time length and the second time length are limited, the volatilization characteristics of the pigment peptizing agent are accurately matched, the reserve layer is ensured to be fully formed, and the phenomenon that the solvent in the edge area volatilizes excessively to cause skinning is avoided. The planarization process of the adhesive film can be completed before the viscosity of the adhesive solut