CN-121972372-A - System and method for controlling adhesive application

Abstract

The invention discloses a system and a method for controlling adhesive application. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied to each substrate, compare the adhesive applied to each substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensors may include one or more of a valve sensor coupled to the adhesive supply, a flow sensor coupled to the manifold, a flow sensor coupled to one or more hoses, and a flow sensor coupled to the spray gun.

Inventors

• PETER W. ESTELLE

Assignees

• 诺信公司

Dates

Publication Date

20260505

Application Date

20171030

Priority Date

20171023

Claims (20)

1. 1. A method for controlling adhesive application, the method comprising: melting a solid or semi-solid binder; pumping the melted adhesive to an applicator using a pump for application to a plurality of moving substrates; measuring the length of the application area prior to applying the melted adhesive to the application area to determine the amount of melted adhesive that needs to be applied to the application area; Measuring an amount of adhesive applied to the plurality of moving substrates by detecting a flow rate of the adhesive using a flow sensor; detecting the number of the plurality of moving substrates; determining an amount of adhesive applied to each substrate, wherein the melted adhesive is applied based on the application area; Comparing the applied adhesive to each substrate with a target value, and And adjusting the pressure of the pump based on the comparison.
2. 2. The method of claim 1, wherein pumping comprises pumping the melted adhesive through a manifold, wherein the flow sensor is located in the manifold, and wherein measuring the amount of adhesive applied comprises detecting a flow of the adhesive through one or more hoses connected to the manifold with one or more flow sensors.
3. 3. The method of claim 1, wherein measuring the amount of adhesive applied further comprises detecting an opening of a valve of a supply device.
4. 4. The method of claim 1, further comprising detecting flow with a flow sensor in a hose in communication with the applicator.
5. 5. The method of claim 1, wherein detecting the number of the plurality of moving substrates comprises detecting the number of the plurality of moving substrates on a conveyor belt past one or more substrate sensors.
6. 6. The method of claim 1, further comprising receiving the target value through a user interface.
7. 7. The method of claim 1, wherein detecting the coated area comprises detecting a length of a seam of the plurality of moving substrates.
8. 8. The method of claim 1, wherein detecting the coated area is with a camera and/or a laser.
9. 9. A control system for controlling adhesive application, the control system comprising: a supply device comprising a solid or semi-solid adhesive; a melter configured to melt the solid or semi-solid binder; An applicator; A pump configured to pump molten adhesive to the applicator for application to a plurality of moving substrates; A flow sensor configured to measure an amount of adhesive applied to the plurality of moving substrates by detecting a flow rate of the adhesive; One or more substrate sensors configured to detect the number of the plurality of moving substrates and the coated area of the plurality of moving substrates, Wherein the substrate sensor is configured to measure a length of the application area prior to applying the melted adhesive to the application area to determine an amount of the melted adhesive that needs to be applied to the application area; a controller in communication with the flow sensor and the substrate sensor, the controller configured to: determining an amount of adhesive applied to each substrate, wherein the adhesive is applied based on the application area; Comparing the applied adhesive to each substrate with a target value, and And adjusting the pressure of the pump based on the comparison.
10. 10. The control system of claim 9, further comprising: a manifold, wherein the flow sensor is located in the manifold, and One or more flow sensors configured to detect a flow of the adhesive through one or more hoses connected to the manifold.
11. 11. The control system of claim 9, further comprising a sensor configured to detect opening of a valve of the supply device to measure an amount of adhesive applied.
12. 12. The control system of claim 9, further comprising a flow sensor positioned in a hose in communication with the applicator and configured to detect flow in the hose.
13. 13. The control system of claim 9, wherein the one or more substrate sensors are configured to detect a number of the plurality of moving substrates on a conveyor belt.
14. 14. The control system of claim 9, further comprising a user interface configured to receive the target value.
15. 15. The control system of claim 9, wherein the one or more substrate sensors are configured to detect a length of a seam of the plurality of moving substrates.
16. 16. The control system of claim 9, wherein the one or more substrate sensors comprise a camera and/or a laser.
17. 17. A non-transitory computer-readable medium storing instructions that, when executed, cause one or more processors to perform a process for controlling adhesive application, the process comprising: melting a solid or semi-solid binder; pumping the melted adhesive to an applicator using a pump for application to a plurality of moving substrates; measuring the length of the application area prior to applying the melted adhesive to the application area to determine the amount of melted adhesive that needs to be applied to the application area; Measuring an amount of adhesive applied to the plurality of moving substrates by detecting a flow rate of the adhesive using a flow sensor; Detecting the number of the plurality of moving substrates and the coating areas of the plurality of moving substrates; determining an amount of adhesive applied to each substrate, wherein the adhesive is applied based on the application area; Comparing the applied adhesive to each substrate with a target value, and And adjusting the pressure of the pump based on the comparison.
18. 18. The non-transitory computer readable medium of claim 17, wherein pumping comprises pumping the melted adhesive through a manifold, wherein the flow sensor is located in the manifold, and wherein measuring the amount of adhesive applied comprises detecting a flow of the adhesive through one or more hoses connected to the manifold with one or more flow sensors.
19. 19. The non-transitory computer readable medium of claim 17, wherein measuring the amount of adhesive applied further comprises detecting an opening of a valve of a supply with a sensor.
20. 20. The non-transitory computer readable medium of claim 17, further comprising detecting flow with a flow sensor in a hose in communication with the applicator.

Description

System and method for controlling adhesive application The present application is a divisional application of chinese application entitled "systems and methods for controlling adhesive application" with application number 201711032669.9, application day 2017, 10 month 30. Cross Reference to Related Applications The present application claims priority from U.S. provisional patent application No.62/414,793 filed 10/30/2016, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates generally to systems and processes for controlling adhesive application, and more particularly to systems and processes for controlling adhesive application in a closed loop manner based on the amount of adhesive applied per substrate. Background The amount of adhesive applied to the substrate is generally critical. For example, ensuring that the proper amount of adhesive is applied to the package may greatly affect sales of the packaged goods. On the one hand, applying too much adhesive to the package may increase the cost of the packaged goods, while also reducing aesthetics due to the existence of adhesive "squeeze-out" joints. On the other hand, too little adhesive applied may affect the integrity of the package, possibly causing damage to the packaged goods. Even some of these drawbacks may make the entire product line rejected by potential customers. Current systems do not provide adequate control of the application of adhesive to a substrate. It would therefore be desirable to provide a closed loop system configured to control adhesive application based on the application rate and the number of substrates. Disclosure of Invention The foregoing needs are met, to a great extent, by the systems and processes described herein. One aspect of the present disclosure relates to a process. Such a process may include measuring the amount of adhesive applied to a plurality of substrates by a pump, detecting the number of substrates, determining the amount of adhesive applied to each substrate, comparing the adhesive applied to each substrate to a target value, and adjusting the pressure of the pump based on the comparison. Another aspect of the present disclosure relates to a control system for controlling adhesive application that includes a first sensor configured to measure an amount of adhesive applied by a pump to a plurality of substrates, a second sensor configured to detect a number of substrates, and a controller in communication with the first sensor and the second sensor. The controller is configured to determine an amount of adhesive applied to each substrate, compare the adhesive applied to each substrate to a target value, and adjust a pressure of the pump based on the comparison. Yet another aspect of the disclosure relates to a non-transitory computer-readable medium storing instructions that, when executed, cause one or more processors to perform a process for controlling adhesive application. The process may include measuring an amount of adhesive applied to a plurality of substrates by a pump, detecting a number of substrates, determining an amount of adhesive applied to each substrate, comparing the adhesive applied to each substrate to a target value, and adjusting a pressure of the pump based on the comparison. Drawings In order to facilitate an understanding of the present disclosure, various aspects of the present disclosure are illustrated by way of example in the accompanying drawings. FIG. 1 shows an illustrative schematic of a hot melt adhesive system. FIG. 2 shows an illustrative schematic diagram of a control system that may be used with the illustrative hot melt adhesive system of FIG. 1. FIG. 3 shows an illustrative process of controlling adhesive application that may be performed by the illustrative control system of FIG. 2. The same reference indicators will be used throughout the drawings and the following detailed description to refer to the same or like parts. Detailed Description The hot melt adhesive system 10 may be configured to provide convenience and understanding to users and quality control personnel by enabling control of the amount of adhesive applied per substrate. The hot melt adhesive system 10 may use sensors and controllers to calculate the total amount of adhesive consumed and to detect the number of substrates. The hot melt adhesive system 10 may be configured to apply a consistent amount of adhesive (e.g., an "add-on" weight or volume) to a substrate. The hot melt adhesive system 10 may be configured to receive the target adhesive applied by each substrate and thus continuously control the components. Accordingly, the hot melt adhesive system 10 can ensure that sufficient adhesive is applied while increasing the economy and aesthetics of adhesive application by reducing waste. It should be understood that the hot melt adhesive system 10 shown and described herein is merely illustrative and that controlling the amount