CN-121972449-A - Metal material removing device

CN121972449ACN 121972449 ACN121972449 ACN 121972449ACN-121972449-A

Abstract

The application relates to the technical field of electronic manufacturing and discloses a metal material removing device which comprises a reaction barrel, a first circulating system and a first stirring assembly, wherein a cleaning medium is arranged in the reaction barrel, the cleaning medium can remove metal materials on electronic elements, the first circulating system comprises a first pump body, a water inlet of the first pump body is communicated with the bottom end of the reaction barrel, a water outlet of the first pump body is communicated with the reaction barrel, the first stirring assembly comprises a first driving end which is arranged in the reaction barrel and is positioned at the center of the bottom end in the barrel, the first driving end is provided with a first stirring slurry group, and when the electronic elements are positioned below the liquid level of the cleaning medium, the first pump body pumps the cleaning medium, and the first driving end drives the first stirring slurry group to rotate so as to stir the cleaning medium. Therefore, the application not only improves the metal material removal efficiency, but also effectively prevents secondary pollution or scratch to electronic elements caused by retention of impurities in vortex flow.

Inventors

FAN YUAN
YU HAIHUA
YU HAO
WANG WEI

Assignees

北京联控前瞻技术有限公司

Dates

Publication Date: 20260505
Application Date: 20260319

Claims (10)

1. A metal material removing apparatus, comprising: The reaction barrel is loaded with a cleaning medium, and the cleaning medium can remove metal materials on the electronic element; the first circulating system comprises a first pump body, a water inlet of the first pump body is communicated with the bottom end of the reaction barrel, and a water outlet of the first pump body is communicated with the reaction barrel; the first stirring assembly comprises a first driving end which is arranged in the reaction barrel and positioned at the center of the inner bottom end of the reaction barrel, and a first stirring paddle group is arranged on the first driving end; when the electronic element is positioned below the liquid level of the cleaning medium, the first pump body pumps the cleaning medium, and the first driving end drives the first stirring paddle set to rotate so as to stir the cleaning medium.
2. The metallic material removal apparatus as recited in claim 1, wherein the metallic material removal apparatus includes a mount located at an outlet of the reaction tank, the first agitating assembly comprising: The rotor is mounted on the top end face of the mounting seat and is coaxially arranged with the reaction barrel, the rotor forms the first driving end, a plurality of first stirring paddles are connected to the outer peripheral face of the rotor at equal intervals, and the stirring faces of the first stirring paddles extend along the axial direction of the reaction barrel.
3. The metallic material removal apparatus as recited in claim 2, wherein the first circulation system further comprises: The cooling barrel, the cooling barrel with the bottom opening intercommunication of reaction barrel, first pump body pass through first pipeline with the cooling barrel intercommunication, the top in the cooling barrel is provided with cooling structure, the circulation has cooling medium in the cooling structure.
4. A metallic material removing apparatus as recited in claim 3, wherein the mounting base comprises: The top end pipe orifice is in butt joint and communicated with the bottom end opening of the reaction barrel, the rotor is rotationally connected to the top end pipe orifice of the liquid discharge pipe, a communication valve is arranged in the liquid discharge pipe, the top end surface of the cooling barrel and the bottom end pipe orifice of the liquid discharge pipe are arranged at intervals, The top end of the cooling barrel is provided with a plurality of liquid passing holes, and the outer periphery of the top end of the cooling barrel extends towards the reaction barrel along the axial direction of the liquid discharge pipe to form an annular wall surface surrounding the liquid passing holes.
5. The metal material removal apparatus as set forth in any one of claims 1 to 4, wherein the metal material removal apparatus includes: The sample loading plate is provided with a sample loading hole, an annular step is formed in the sample loading hole, and the top end surface of the annular step is supported on the electronic element; and the moving mechanism is connected with the carrying disc and used for driving the carrying disc to be inserted into or separated from the reaction barrel.
6. The metallic material removing apparatus as recited in claim 5, wherein the metallic material removing apparatus includes: The clamping disc is provided with a through hole penetrating through the clamping disc, the shape of the through hole is the same as that of the annular step, when the electronic component is placed on the annular step, the clamping disc is suitable for being abutted to the end face of the carrying disc, and the through hole and the annular step are oppositely arranged to clamp and fix the electronic component.
7. The metallic material removing apparatus as recited in claim 5, wherein a water outlet of the first pump body is communicated with a tempering tank, a heating structure is provided at a bottom end in the tempering tank, a heating medium is circulated in the heating structure, the heating medium is used for heating a cleaning medium in the tempering tank, and the tempering tank is communicated with a top end of the reaction tank through a supply pump and a second pipe.
8. The metallic material removing apparatus as recited in claim 5, wherein the metallic material removing apparatus further comprises: A washing tub loaded with a washing medium; the translation piece, the translation piece can be followed the first direction and removed, wash the bucket with the reaction bucket is along first direction interval setting, moving mechanism's removal end is connected to the translation piece, the removal end can wear to establish wash the opening of bucket stretches into or extracts wash the bucket.
9. The metallic material removing apparatus as recited in claim 8, wherein the metallic material removing apparatus further comprises: the second stirring assembly comprises a second driving end, the second driving end is arranged in the cleaning barrel and located at the bottom end outlet of the cleaning barrel, and the second driving end is provided with a second stirring paddle set.
10. The metallic material removing apparatus as recited in claim 8, wherein the metallic material removing apparatus further comprises: Drying barrel, be provided with in the drying barrel and sweep and blow the board, sweep and blow the board and be the annular setting, sweep and blow and be formed with a plurality of holes of sweeping on the board, sweep and blow and be formed with the cavity in the board, a plurality of sweep and blow the hole intercommunication the cavity, the cavity passes through intake pipe and outside air supply intercommunication, wherein, drying barrel is located along first direction the washing barrel is kept away from the side of reaction barrel, remove the end and can wear to establish the opening of drying barrel stretches into or extracts drying barrel.

Description

Metal material removing device Technical Field The invention relates to the technical field of electronic manufacturing, in particular to a metal material removing device. Background In the field of electronic manufacturing, high-density packaged integrated electronic chips, high-speed optical communication chips, and multilayer precision Printed Circuit Boards (PCBs) constitute core components of modern electronic devices. In the process of manufacturing and packaging, tin, gold, titanium and other metal materials are widely used to form structures such as solder joints, electrodes, interconnection lines, metal barrier layers and the like. However, due to the influence of factors such as process fluctuation or detection of repair requirements, defects such as solder joint bridging, metal material residues or element pollution are easy to occur in the manufacturing process, and if the defects are not treated, adverse effects are easy to be caused on the electrical performance and reliability of the device, so that accurate removal of metal materials such as tin, gold and the like to realize reworking repair becomes an important technical link for improving the product yield and reducing the manufacturing cost. Disclosure of Invention The invention provides a metal material removing device to solve the technical problems. The present invention provides a metallic material removing apparatus including: the reaction barrel is filled with a cleaning medium which can remove metal materials on the electronic element; The first circulating system comprises a first pump body, a water inlet of the first pump body is communicated with the bottom end of the reaction barrel, and a water outlet of the first pump body is communicated with the reaction barrel; the first stirring assembly comprises a first driving end which is arranged in the reaction barrel and positioned at the center of the inner bottom end of the reaction barrel, and a first stirring paddle group is arranged on the first driving end; When the moving mechanism moves to the position that the electronic element is positioned below the liquid level of the cleaning medium, the first pump body pumps the cleaning medium, and the first driving end drives the first stirring paddle set to rotate so as to stir the cleaning medium. The beneficial effects are that: when the electronic component is placed below the liquid level of the cleaning medium, the first pump body and the first stirring assembly are started. At this time, the radial shear stress generated by the first stirring assembly and the longitudinal suction force applied by the first pump body act together to accurately peel the metal material from the surface of the electronic component. Simultaneously, the longitudinal suction force applied by the first pump body can also pull generated metal scraps and scattered parts away from the electronic component area, so that damage to the electronic component is avoided. Therefore, the application not only improves the metal material removal efficiency, but also effectively prevents secondary pollution or scratch to electronic elements caused by retention of impurities in vortex flow. Optionally, the metal material removing apparatus includes a mounting seat, the mounting seat is located at an outlet of the reaction barrel, and the first stirring assembly includes: The rotor is mounted on the top end face of the mounting seat and is coaxially arranged with the reaction barrel, the rotor forms the first driving end, a plurality of first stirring paddles are connected to the outer peripheral face of the rotor at equal intervals, and the stirring faces of the first stirring paddles extend along the axial direction of the reaction barrel. Optionally, the first circulation system further comprises: the cooling barrel is positioned below the reaction barrel, is communicated with the bottom end opening of the reaction barrel, the first pump body is communicated with the cooling barrel through a first pipeline, a cooling structure is arranged at the top in the cooling barrel, and cooling medium flows in the cooling structure; optionally, the cooling tub includes: the top end pipe orifice is in butt joint and communicated with the bottom end opening of the reaction barrel, the mounting seat is connected to the top end pipe orifice of the liquid discharge pipe, a communication valve is arranged in the liquid discharge pipe, the top end surface of the cooling barrel and the bottom end pipe orifice of the liquid discharge pipe are arranged at intervals, The top end of the cooling barrel is provided with a plurality of liquid passing holes, and the outer periphery of the top end of the cooling barrel extends towards the reaction barrel along the axial direction of the liquid discharge pipe to form an annular wall surface surrounding the liquid passing holes. Optionally, the metal material removing apparatus includes: The sample loading plate is provided with a sample loa