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CN-121972478-A - Be used for clear auxiliary fixtures of photoetching machine wafer carrier

CN121972478ACN 121972478 ACN121972478 ACN 121972478ACN-121972478-A

Abstract

The invention relates to an auxiliary tool for cleaning a wafer carrier of a photoetching machine, which comprises a carrier ring main body, a plurality of carrier parts, at least one connecting rod, a positioning part and a cleaning device, wherein the carrier parts are arranged on the upper surface of the carrier ring main body at intervals along the circumferential direction and used for supporting the wafer carrier, the connecting rod is arranged along the diameter direction of the carrier ring main body, two ends of the connecting rod are respectively connected with inner walls at two opposite sides of the carrier ring main body, and the positioning part is arranged below the connecting rod and used for being connected with the cleaning device so as to realize positioning and fixing of the auxiliary tool. The invention can solve the problems of incomplete cleaning, low efficiency and high safety risk in the prior art, and realize nondestructive, efficient and thorough cleaning.

Inventors

  • XIE FENGFENG
  • LIN PENG

Assignees

  • 格科半导体(上海)有限公司

Dates

Publication Date
20260505
Application Date
20260123

Claims (15)

  1. 1. Be used for clear auxiliary fixtures of photoetching machine wafer carrier, characterized in that includes: A carrier ring body; the bearing parts are arranged on the upper surface of the bearing ring main body at intervals along the circumferential direction and used for supporting the wafer carrier; At least one connecting rod, which is arranged along the diameter direction of the bearing ring main body, and two ends of the connecting rod are respectively connected with the inner walls of the two opposite sides of the bearing ring main body; And the positioning part is connected with the lower part of the connecting rod and used for being connected with the cleaning device so as to realize the positioning and fixing of the auxiliary tool.
  2. 2. The auxiliary tool for cleaning a wafer carrier of a lithography machine according to claim 1, wherein the bearing part has an arc-shaped block structure, and a side of the bearing part facing the center of the bearing ring main body has a stepped surface; The stepped surface comprises a first horizontal supporting surface and a second horizontal supporting surface with different heights, and the first horizontal supporting surface is closer to the center of the bearing ring main body than the second horizontal supporting surface; And the height of the first horizontal supporting surface is lower than that of the second horizontal supporting surface.
  3. 3. The tool according to claim 2, wherein the first horizontal support surface is configured to support the wafer carrier such that a cleaning space is formed between a backside of the wafer carrier and the carrier ring body when the wafer carrier is supported.
  4. 4. The tool as claimed in claim 3, wherein the stepped surface further comprises a vertical sidewall surface, the first horizontal supporting surface and the second horizontal supporting surface are connected by the vertical sidewall surface, and all vertical sidewall surfaces of all the carriers together define a circumferential inner diameter; the diameter of the wafer carrying platform is larger than the inner diameter of the carrying ring main body and smaller than the inner diameter of the circumference defined by all the vertical side wall surfaces.
  5. 5. The auxiliary tool for cleaning a wafer stage of a lithography machine according to claim 4, wherein the inner diameter of the carrier ring body 1 is between 85% and 90% of the diameter of the wafer stage.
  6. 6. The auxiliary tool for cleaning a wafer carrier of a lithography machine according to claim 1, wherein the positioning portion has a cylindrical structure protruding downward from a bottom center of the connecting rod when one of the connecting rods is provided.
  7. 7. The tool according to claim 1, wherein when a plurality of connecting rods are provided, the connecting rods are cross-connected at a center point of the carrier ring body, and the positioning part is a cylindrical structure protruding downwards from the cross-connection.
  8. 8. An auxiliary tool for cleaning a wafer carrier of a lithography machine as claimed in claim 6 or 7, wherein a groove hole is provided in the cleaning device, and the cleaning device is matched with the positioning part, so that the positioning part is inserted into the groove hole to realize positioning and fixing.
  9. 9. The auxiliary tool for cleaning wafer carriers of a lithography machine according to claim 1, wherein the number of the carrying parts is at least three, and the carrying parts are uniformly arranged on the upper surface of the carrying ring main body at intervals.
  10. 10. The auxiliary tool for cleaning a wafer carrier of a lithography machine according to claim 2, wherein the first horizontal supporting surface has a height of 2cm to 3cm, and the second horizontal supporting surface has a height of 3.5cm to 4.5cm.
  11. 11. The tool according to claim 2, wherein the surface of the first horizontal supporting surface is coated with an anti-slip coating, and the thickness of the anti-slip coating is greater than 3mm.
  12. 12. The auxiliary tool for cleaning a wafer carrier of a lithography machine according to claim 2, wherein the surface of the first horizontal supporting surface is a smooth surface, and the surface roughness Ra is less than or equal to 1um.
  13. 13. The tool of claim 1, wherein the outer diameter of the carrier ring body is 310mm-330mm.
  14. 14. The auxiliary tool for cleaning a wafer carrier of a lithography machine according to claim 1, wherein the auxiliary tool is made of a copper-based antistatic alloy.
  15. 15. The tool according to claim 1, wherein the connecting rod has a width of 1.5cm to 2.5cm.

Description

Be used for clear auxiliary fixtures of photoetching machine wafer carrier Technical Field The invention belongs to the technical field of maintenance of semiconductor manufacturing equipment, and particularly relates to an auxiliary tool for cleaning a wafer carrier of a photoetching machine. Background The photoetching machine is a core device for semiconductor manufacture, and the performance of the photoetching machine directly determines the process precision and the yield of an integrated circuit. The wafer carrier is used as a key subsystem of the photoetching machine and has multiple functions of wafer bearing, nano-scale accurate positioning (usually less than 5 nm), heat management and the like. As semiconductor process nodes continue to shrink to 3nm and below, pollution control on wafer carriers presents a significant challenge. During photolithography, photoresist volatiles, silicon dust particles (which may be as small as 0.1 μm in size), and environmental molecular contaminants, etc., may deposit on the surface of the stage. According to the international semiconductor technology roadmap, when the contaminant density exceeds 100 particles/cm 2, a series of serious problems will be raised, 1) vacuum adsorption holes are blocked, resulting in wafer warpage (> 50 μm), 2) surface flatness degradation (> 10nm RMS), affecting focus depth control, 3) electrostatic build-up causes pattern displacement (overlay error >3 nm). Therefore, periodic cleaning of the wafer carrier backside is a necessary condition to maintain product yield. Currently, cleaning the backside of a wafer carrier is often manually performed. The traditional method has the obvious defects that firstly, cleaning is incomplete, dead angles exist, micro-particle pollutants are difficult to thoroughly remove, secondly, the efficiency is low, the manual operation flow is complex, the maintenance period is long, thirdly, the safety risk is high, the surface of the back surface of the wafer carrying platform with ultrahigh precision is extremely easy to scratch or damage due to improper operation, the flatness and the functional integrity are affected, and huge economic loss is caused. Therefore, an auxiliary tool for cleaning a wafer carrier of a photoetching machine is designed to solve the problems of incomplete cleaning, low efficiency and high safety risk in the prior art, and the cleaning is quite necessary to realize nondestructive, efficient and thorough cleaning. It is to be understood that the foregoing is merely illustrative of the background art to which the present invention pertains and is not necessarily a representation of the prior art. Disclosure of Invention The invention aims to provide an auxiliary tool for cleaning a wafer carrier of a photoetching machine, which solves the problems of incomplete cleaning, low efficiency and high safety risk in the prior art and realizes nondestructive, efficient and thorough cleaning. The invention provides an auxiliary tool for cleaning a wafer carrier of a photoetching machine, which comprises a carrier ring main body, a plurality of carrier parts, at least one connecting rod, positioning parts and cleaning devices, wherein the carrier parts are arranged on the upper surface of the carrier ring main body at intervals along the circumferential direction and used for supporting the wafer carrier, the connecting rod is arranged along the diameter direction of the carrier ring main body, two ends of the connecting rod are respectively connected with inner walls of two opposite sides of the carrier ring main body, and the positioning parts are arranged below the connecting rod and used for being connected with the cleaning devices so as to realize positioning and fixing of the auxiliary tool. Preferably, the bearing part is of an arc-shaped block structure, one side of the bearing part, facing the center of the bearing ring main body, is provided with a stepped surface, the stepped surface comprises a first horizontal supporting surface and a second horizontal supporting surface with different heights, the first horizontal supporting surface is closer to the center of the bearing ring main body than the second horizontal supporting surface, and the height of the first horizontal supporting surface is lower than that of the second horizontal supporting surface. Preferably, the first horizontal supporting surface is used for supporting the wafer carrier, so that a cleaning space is formed between the back surface of the wafer carrier and the carrier ring main body when the wafer carrier is supported. Preferably, the step-shaped surface further comprises a vertical sidewall surface, the first horizontal supporting surface and the second horizontal supporting surface are connected by the vertical sidewall surface, and all vertical sidewall surfaces of all the bearing parts jointly define a circumferential inner diameter, wherein the diameter of the wafer carrying platform is larger than t