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CN-121972539-A - Laser bending process and laser bending device

CN121972539ACN 121972539 ACN121972539 ACN 121972539ACN-121972539-A

Abstract

The application discloses a laser bending process and a laser bending device, which belong to the technical field of laser processing, wherein the laser bending process comprises the following steps: and carrying out laser tempering treatment on the area to be bent in the piece to be bent to obtain a tempered piece to be bent, and carrying out bending treatment on the tempered piece to be bent to obtain the bent piece. In the laser tempering treatment and bending treatment process, an external magnetic field is applied to the to-be-bent piece, the direction of the external magnetic field is parallel to the plane of the to-be-bent piece, and the external magnetic field at least partially penetrates through the to-be-bent piece. The external magnetic field can exert electromagnetic force on the area to be bent for laser tempering treatment, refine grains, adjust energy distribution in the laser tempering treatment process, ensure the stability of tempering treatment, reduce bending stress, relieve the deformation of the bending piece and the coarse condition of the grains, and improve the quality of the bending piece.

Inventors

  • YANG BIN
  • LIU ZHIQIANG
  • LI XIANG
  • LIANG LONG
  • GENG JINGTAO
  • XIAO MING

Assignees

  • 无锡锐科光纤激光技术有限责任公司

Dates

Publication Date
20260505
Application Date
20260203

Claims (10)

  1. 1. A laser bending process, comprising: carrying out laser tempering treatment on a region (51) to be bent in the part (50) to be bent to obtain a tempered part to be bent; Bending the tempered piece to be bent to obtain a bent piece; in the laser tempering treatment and the bending treatment, an external magnetic field is applied to the to-be-bent piece (50), the direction of the external magnetic field is parallel to the plane of the to-be-bent piece (50), and the external magnetic field at least partially penetrates through the to-be-bent piece (50).
  2. 2. The laser bending process according to claim 1, wherein the magnetic field strength of the externally applied magnetic field is 0.1T-0.3T.
  3. 3. The laser bending process according to claim 1, characterized in that, during the laser tempering treatment, a tensile prestressing force is applied to the piece (50) to be bent; The direction of the stretching prestress is parallel to the plane of the piece (50) to be bent, and the stretching prestress and the direction of the externally applied magnetic field are mutually intersected.
  4. 4. A laser bending process according to claim 3, wherein the tensile pre-stress is 0.2 σs-0.4 σs, wherein σs represents the material yield strength of the piece (50) to be bent.
  5. 5. The laser bending process according to claim 1, characterized in that before subjecting the area (51) to be bent of the piece (50) to be bent to a laser tempering treatment, it further comprises: aiming at the piece (50) to be bent of different materials, constructing a temperature-power mapping model according to the temperature of laser tempering treatment of the piece (50) to be bent and the corresponding power of laser; The laser tempering treatment of the to-be-bent area (51) of the to-be-bent piece (50) comprises the following steps: and adjusting the power of the laser according to the temperature-power mapping model, and performing constant-temperature tempering treatment on the area (51) to be bent of the bending piece.
  6. 6. The laser bending process according to claim 1, wherein the laser tempering of the area (51) to be bent in the piece (50) to be bent comprises: the bending area (51) in the piece (50) to be bent is irradiated by laser, when the temperature of the bending area (51) is lower than a preset temperature, the power of the laser is increased, and when the temperature of the bending area (51) is higher than the preset temperature, the power of the laser is maintained, and the magnetic field strength of the external magnetic field is improved.
  7. 7. The laser bending process of claim 6, wherein the power adjustment amplitude of the laser is 1W-10W; and/or the magnetic field intensity of the externally applied magnetic field is adjusted to be 0.05T.
  8. 8. The laser bending process according to any one of claims 1 to 7, wherein after bending the tempered piece to be bent, the laser bending process further comprises: and quenching the bending piece.
  9. 9. A laser bending device for implementing a laser bending process according to any one of claims 1 to 8, comprising: the laser emission unit (10) is used for emitting laser and tempering the area (51) to be bent of the piece (50) to be bent; The magnetic field generating unit is used for applying an external magnetic field parallel to the plane of the piece (50) to be bent to the piece (50) to be bent; and the bending unit (30) is used for bending the piece (50) to be bent.
  10. 10. The laser bending device of claim 9, wherein the laser bending device further comprises: the prestress applying unit is used for applying prestress parallel to the plane of the piece (50) to be bent to the piece (50) to be bent; And the cooling unit is used for quenching the bent piece.

Description

Laser bending process and laser bending device Technical Field The application relates to the technical field of laser processing, in particular to a laser bending process and a laser bending device. Background The quenched high-carbon steel, cast iron and other materials are generally difficult to mechanically bend. In the related art, if mechanical bending processing is required for materials such as quenched high-carbon steel and cast iron, brittleness must be reduced through tempering treatment, partial plasticity is recovered, or bending stress is reduced by adopting a special process mode, but the special processes can only be applied to partial martensitic stainless steel (such as 410 and 420J 2) or low-carbon martensitic steel (such as Q690M), and have low success rate, and phenomena such as deformation, coarse grains and the like of a bending piece are easily caused, so that the quality of the bending piece is affected. Disclosure of Invention The embodiment of the application provides a laser bending process and a laser bending device, which can relieve the deformation and coarse grains of a bending piece and improve the quality of the bending piece. In order to achieve the above object, according to a first aspect of the present application, there is provided a laser bending process including: Carrying out laser tempering treatment on a to-be-bent area in the to-be-bent piece to obtain a tempered to-be-bent piece; bending the tempered piece to be bent to obtain a bent piece; in the laser tempering treatment and bending treatment process, an external magnetic field is applied to the to-be-bent piece, the direction of the external magnetic field is parallel to the plane of the to-be-bent piece, and the external magnetic field at least partially penetrates through the to-be-bent piece. Alternatively, the magnetic field strength of the externally applied magnetic field is 0.1T-0.3T. Optionally, applying tensile prestress to the piece to be bent in the laser tempering treatment process; the direction of the stretching prestress is parallel to the plane of the piece to be bent and is intersected with the direction of the externally applied magnetic field. Optionally, the tensile prestress is 0.2σs-0.4σs, wherein σs represents the material yield strength of the piece to be bent. Optionally, before the laser tempering treatment is performed on the area to be bent of the piece to be bent, the method further includes: aiming at the to-be-bent pieces of different materials, constructing a temperature-power mapping model according to the temperature of laser tempering treatment of the to-be-bent pieces and the corresponding power of laser; carrying out laser tempering treatment on the area to be bent of the piece to be bent, comprising the following steps: and adjusting the power of the laser according to the temperature-power mapping model, and carrying out constant-temperature tempering treatment on the to-be-bent area of the bent piece. Optionally, performing laser tempering treatment on the area to be bent in the piece to be bent, including: The method comprises the steps of irradiating a region to be bent in a piece to be bent by laser, increasing the power of the laser when the temperature of the region to be bent is lower than a preset temperature, maintaining the power of the laser when the temperature of the region to be bent is higher than the preset temperature, and improving the magnetic field strength of an external magnetic field. Optionally, the power adjustment amplitude of the laser is 1W-10W; And/or the magnetic field intensity of the externally applied magnetic field is adjusted to be 0.05T. Optionally, bending the tempered piece to be bent to obtain a bent piece, and then further including: quenching the bent piece. According to a second aspect of the present application, there is provided a laser bending device for implementing a laser bending process as described above, comprising: the laser emission unit is used for emitting laser and tempering the to-be-bent area of the to-be-bent piece; The magnetic field generating unit is used for applying an external magnetic field parallel to the plane of the piece to be bent to the piece to be bent; The bending unit is used for bending the piece to be bent. Optionally, the laser bending device further comprises: The prestress applying unit is used for applying prestress parallel to the plane of the piece to be bent to the piece to be bent; And the cooling unit is used for quenching the bent piece. The laser bending process comprises the steps of carrying out laser tempering treatment on a to-be-bent area in a to-be-bent piece to obtain a tempered to-be-bent piece, and carrying out bending treatment on the tempered to-be-bent piece to obtain the bent piece. In the laser tempering treatment and bending treatment process, an external magnetic field is applied to the to-be-bent piece, the direction of the external magnetic field is parallel to the p