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CN-121972682-A - SLM (selective laser deposition) -forming-based copper-silver alloy composite material and preparation method and application thereof

CN121972682ACN 121972682 ACN121972682 ACN 121972682ACN-121972682-A

Abstract

The invention provides a copper-silver alloy composite material based on SLM forming and a preparation method and application thereof, comprising the following steps of mixing silver powder and copper powder according to different mass ratios, preparing AgCu alloy powder, constructing a layered model by utilizing CAD software, and then leading the layered model into SLM equipment; placing silver powder, agCu alloy powder and copper powder in SLM equipment, performing SLM forming by the SLM equipment according to the constructed layered model to obtain an SLM forming blank, placing the SLM forming blank in a vacuum environment for heat treatment to obtain a blank, and performing hot isostatic pressing treatment on the blank to obtain the copper-silver alloy composite material. The invention effectively solves the problems of poor wettability, element segregation, weak interface combination and the like of copper-silver alloy in the high-temperature forming process through controlling the laser power and the scanning speed in the SLM forming process. And then, combining vacuum heat treatment and hot isostatic pressing treatment, eliminating residual stress, improving density and enhancing interface combination, so that the copper-silver alloy composite material has excellent conductivity, high mechanical strength and low thermal expansion coefficient.

Inventors

  • CHU ZHUQI
  • REN HAOYU
  • ZHANG XIAYU
  • LIU JUNSONG
  • WEI CHENLONG
  • FANG FEI
  • LU XIANGXIANG
  • LIU WEI
  • SHI ZHE
  • XU CHENGLEI

Assignees

  • 安庆师范大学

Dates

Publication Date
20260505
Application Date
20260130

Claims (10)

  1. 1. The preparation method of the copper-silver alloy composite material based on SLM forming is characterized by comprising the following steps of: S1, mixing silver powder and copper powder according to different mass ratios, preparing a series of AgCu alloy powder with silver powder mass content gradient, constructing a layered model with silver powder mass content gradient by using CAD software, setting the powder paving thickness of each layer, and then introducing the layered model into SLM equipment; S2, placing silver powder, agCu alloy powder with different silver powder quality and copper powder into SLM equipment, and performing SLM forming by the SLM equipment according to the constructed layered model to obtain an SLM forming blank, wherein the laser power of the SLM forming is 200-500W, and the scanning speed of the SLM forming is 500-1500 mm/S; S3, placing the SLM forming blank in a vacuum environment for heat treatment to obtain a blank, wherein the heat treatment temperature is 400-600 ℃, the heat treatment time is 1-3 h, and the vacuum degree of the vacuum environment is 5 multiplied by 10 -4 Pa~1×10 - Pa; And S4, carrying out hot isostatic pressing treatment on the blank to obtain the copper-silver alloy composite material, wherein the temperature of the hot isostatic pressing treatment is 850-950 ℃, and the pressure of the hot isostatic pressing treatment is 100-150 MPa.
  2. 2. The method for preparing the copper-silver alloy composite material based on SLM forming according to claim 1, wherein the purity of silver powder and copper powder is more than or equal to 99.9%.
  3. 3. The preparation method of the SLM-forming-based copper-silver alloy composite material according to claim 1, wherein the particle sizes of silver powder and copper powder are 15-50 μm.
  4. 4. The preparation method of the SLM-forming-based copper-silver alloy composite material according to claim 1, wherein the powder spreading thickness is 20-50 μm.
  5. 5. The preparation method of the copper-silver alloy composite material based on the SLM forming according to claim 1, wherein the laser spot diameter of the SLM forming is 80-120 μm, and the scanning interval of the SLM forming is 50-80 μm.
  6. 6. The preparation method of the SLM-forming-based copper-silver alloy composite material, which is characterized in that oxygen content is kept at 10 ppm-50 ppm in the SLM forming process.
  7. 7. The preparation method of the copper-silver alloy composite material based on the SLM forming according to claim 1, wherein the powder switching rate in the SLM forming process is 0.1-0.5 seconds/layer, and the oxygen increment in the powder switching process is 1-10 ppm.
  8. 8. The preparation method of the copper-silver alloy composite material based on SLM forming, which is characterized in that the time of hot isostatic pressing treatment is 1-2 hours.
  9. 9. A copper-silver alloy composite material prepared by the preparation method of the SLM-based copper-silver alloy composite material according to any one of claims 1 to 8.
  10. 10. Use of the SLM-forming-based copper-silver alloy composite material according to any one of claims 1-8 in high frequency electronics or aerospace wires or electrical connection parts.

Description

SLM (selective laser deposition) -forming-based copper-silver alloy composite material and preparation method and application thereof Technical Field The invention relates to the technical field of composite materials and additive manufacturing, in particular to a copper-silver alloy composite material based on SLM forming, and a preparation method and application thereof. Background With the development of modern electronic devices to high frequency and miniaturization, and the continuous increase of the demands of aerospace equipment on lightweight and high-reliability materials, the comprehensive requirements of conductivity, strength and thermal stability of traditional metal materials under complex working conditions are difficult to meet. Copper-silver alloys are ideal candidates for high frequency electronic devices and high reliability electrical connection components due to their excellent electrical conductivity and good mechanical properties. However, how to achieve synergistic optimization of multiple properties in a single component remains a critical challenge in the field of material design. In recent years, laser selective melting (SELECTIVE LASER MELTING, SLM) is used as a typical metal additive manufacturing technology, and has great potential in manufacturing high-performance metal components due to the advantages of being capable of realizing near-net forming of complex geometric structures, high in material utilization rate, high in forming precision and the like. The SLM can theoretically realize controllable distribution of components and structures in the same part by accumulating metal powder layer by layer and controlling laser energy input, so as to construct the composite material with the function gradient characteristic. For a copper-silver alloy system, the physical properties of the copper-silver alloy system are obviously different, such as melting point, thermal conductivity, surface tension and the like, so that the problems of poor wettability, weak interface bonding, component segregation and the like easily occur in the SLM forming process. At present, a composite material which can realize controllable distribution of copper-silver alloy component gradient in the additive manufacturing process and has high conductivity, high strength and good interface bonding property and a preparation method thereof are not available. Disclosure of Invention The invention aims to solve the technical problem of improving the conductivity, mechanical property and interface bonding property of the copper-silver alloy composite material. The invention solves the technical problems by the following technical means: the invention provides a preparation method of a copper-silver alloy composite material based on SLM forming, which comprises the following steps: S1, mixing silver powder and copper powder according to different mass ratios, preparing a series of AgCu alloy powder with silver powder mass content gradient, constructing a layered model with silver powder mass content gradient by using CAD software, setting the powder paving thickness of each layer, and then introducing the layered model into SLM equipment; S2, placing silver powder, agCu alloy powder with different silver powder quality and copper powder into SLM equipment, and performing SLM forming by the SLM equipment according to the constructed layered model to obtain an SLM forming blank, wherein the laser power of the SLM forming is 200-500W, and the scanning speed of the SLM forming is 500-1500 mm/S; S3, placing the SLM forming blank in a vacuum environment for heat treatment to obtain a blank, wherein the heat treatment temperature is 400-600 ℃, the heat treatment time is 1-3 h, and the vacuum degree of the vacuum environment is 5 multiplied by 10 -4Pa~1×10- Pa; And S4, carrying out hot isostatic pressing treatment on the blank to obtain the copper-silver alloy composite material, wherein the temperature of the hot isostatic pressing treatment is 850-950 ℃, and the pressure of the hot isostatic pressing treatment is 100-150 MPa. The method has the beneficial effects that the layered model taking the mass content of silver powder as the gradient can be accurately realized by the cooperation of CAD modeling and SLM equipment, and the problems of poor wettability, element segregation, weak interface combination and the like of the copper-silver alloy in the high-temperature forming process are effectively solved by controlling the laser power and the scanning speed in the SLM forming process. And then, combining vacuum heat treatment and hot isostatic pressing treatment, eliminating residual stress, improving density and enhancing interface combination, so that the copper-silver alloy composite material has excellent conductivity, high mechanical strength and low thermal expansion coefficient. Preferably, the purities of the silver powder and the copper powder are more than or equal to 99.9 percent. Preferably, the particl