CN-121972715-A - Side-mounted follow-up type laser-assisted milling device and working method

CN121972715ACN 121972715 ACN121972715 ACN 121972715ACN-121972715-A

Abstract

The invention relates to a side-mounted follow-up type laser auxiliary milling device and a working method, the side-mounted follow-up type laser auxiliary milling device comprises a lathe bed, the lathe bed is provided with a milling mechanism, a workpiece moving platform is arranged below the milling mechanism, a follow-up mechanism is arranged on the periphery of the workpiece moving platform, the follow-up mechanism comprises an arc-shaped follow-up guide rail fixed on the lathe bed, the follow-up guide rail is arranged on the periphery of the workpiece moving platform, a movable positioning sliding block capable of moving along the follow-up guide rail is arranged on the follow-up guide rail, the movable positioning sliding block is connected with a positioning mechanical arm, the tail end of the positioning mechanical arm is provided with a clamping mechanism, the clamping mechanism is connected with a collimating laser processing head, and the collimating laser processing head is connected with a modulatable laser generator through a laser transmission optical fiber.

Inventors

CAI YUKUI
DAI DI
SUN SHIHAI
LIANG XIAOLIANG
ZHANG QING
LI XING
TANG YUNQING
LIU ZHANQIANG

Assignees

山东大学

Dates

Publication Date: 20260505
Application Date: 20260319

Claims (10)

1. The side-mounted follow-up type laser auxiliary milling device is characterized by comprising a lathe bed, wherein a milling mechanism is arranged on the lathe bed, a workpiece moving platform is arranged below the milling mechanism, a follow-up mechanism is arranged on the periphery of the workpiece moving platform and comprises an arc-shaped follow-up guide rail fixed on the lathe bed, the follow-up guide rail is arranged on the periphery of the workpiece moving platform and is provided with a movable positioning slide block capable of moving along the follow-up guide rail, the movable positioning slide block is connected with a positioning mechanical arm, the tail end of the positioning mechanical arm is provided with a clamping mechanism, the clamping mechanism is connected with a collimating laser processing head, and the collimating laser processing head is connected with a modulated laser generator through a laser transmission optical fiber.
2. The side-mounted follow-up laser assisted milling device of claim 1, wherein the milling mechanism comprises a vertical movement driving mechanism fixed on the lathe bed, the vertical movement driving mechanism is connected with a spindle rotation driving member, the spindle rotation driving member is connected with a spindle, and the spindle is connected with a processing tool.
3. The side-mounted follow-up type laser-assisted milling device according to claim 2, wherein the vertical movement driving mechanism comprises a frame body fixed on the lathe bed, the top of the frame body is connected with a rotation driving piece, the rotation driving piece is connected with the top end of a screw rod vertically arranged on the axis, the screw rod is connected with a main shaft movement sliding block, the main shaft movement sliding block is in sliding connection with the frame body, the main shaft movement sliding block is connected with a connecting bracket, and a main shaft rotation driving piece is fixed on the connecting bracket.
4. The side-mounted follow-up type laser-assisted milling device according to claim 1, wherein the workpiece moving platform comprises a platform base, the platform base is fixedly connected with the lathe bed, the platform base is connected with a horizontal two-axis linkage mechanism, the horizontal two-axis linkage mechanism is connected with a connecting frame, a swinging frame is rotatably connected to the connecting frame, the swinging frame is connected with a swinging driving piece arranged on the connecting frame, and a rotating clamp matched with the workpiece is arranged on the connecting frame.
5. The side-mounted follow-up laser assisted milling device of claim 4, wherein the horizontal two-axis linkage comprises a first horizontal motion driving mechanism mounted on the platform base, a moving part of the first horizontal motion driving mechanism being connected to a second horizontal motion driving mechanism for driving the second horizontal motion driving mechanism to move in a first horizontal direction, the second horizontal motion driving mechanism being connected to the connecting frame for driving the connecting frame to move in a second horizontal direction, the first horizontal direction and the second horizontal direction being perpendicular to each other.
6. The side-mounted follow-up laser-assisted milling device of claim 1, wherein the two ends of the follow-up guide rail are provided with a follow-up guide rail positioning table fixed on the lathe bed.
7. The side-mounted follow-up type laser-assisted milling device according to claim 1, wherein the movable positioning slide block is slidably connected with the follow-up guide rail, the movable positioning slide block is provided with a movable driving member, the movable driving member is connected with a gear, the movable driving member can drive the gear to rotate, and the gear is meshed with a rack arranged on the follow-up guide rail.
8. The side-mounted follow-up type laser-assisted milling device according to claim 1, wherein the positioning mechanical arm comprises a first slewing mechanism fixed on the movable positioning slide block, the first slewing mechanism is connected with the base, the base is connected with the bottom end of the first arm through a first pitching driving member, the top end of the first arm is connected with the bottom end of the second arm through a second pitching driving member, the top end of the second arm is connected with the second slewing mechanism, and the second slewing mechanism is connected with the clamping mechanism.
9. The side-mounted follow-up laser-assisted milling device of claim 1, wherein the side of the collimated laser processing head is detachably connected with a micro laser power meter and a micro light spot analyzer, and the micro laser power meter and the micro light spot analyzer are connected with a control system to feed back the laser energy distribution and the light spot size of the curved workpiece to the control system in real time.
10. A method of operating a side-mounted, follow-up, collimated laser assisted milling apparatus according to any one of claims 1 to 9, comprising the steps of: step 1, installing a workpiece to be processed on a workpiece moving platform; step 2, connecting a modulated laser generator and a collimated laser processing head by adopting a laser transmission optical fiber, and fixedly connecting the collimated laser processing head with a clamping mechanism at the tail end of a positioning mechanical arm; and 3, starting a workpiece moving platform, a milling mechanism and a follow-up mechanism, during processing, firstly carrying out laser preheating on a part to be milled through the follow-up mechanism, then carrying out milling on the preheated part to be milled by utilizing the milling mechanism until all parts to be milled are subjected to milling, and adjusting the pose of the collimating laser processing head through the movement of a positionable moving sliding block along a follow-up guide rail and the movement of a positioning mechanical arm when carrying out laser preheating on different parts to be milled, so that the included angle between laser beams emitted by the collimating laser processing head and the normal line of the part to be milled is kept consistent when a plurality of parts to be milled are subjected to laser preheating.

Description

Side-mounted follow-up type laser-assisted milling device and working method Technical Field The invention relates to the technical field of machine manufacturing, in particular to a side-mounted follow-up laser-assisted milling device and a working method. Background The statements herein merely provide background information related to the present disclosure and may not necessarily constitute prior art. The laser auxiliary processing technology is a novel composite manufacturing technology developed in recent years, has become a key technical support in the high-end manufacturing fields of aerospace and the like, and aims to break through various bottlenecks of traditional processing and solve the problems of cracks, surface damage, serious cutter abrasion and the like in the processing process of materials difficult to process. The core principle is that in the traditional machining process (turning, milling, grinding and drilling), high-energy laser beams are synchronously or pre-applied, so that the processed material is locally softened, melted or modified, and the machining efficiency, precision and quality are cooperatively improved. The precise heat input of the laser in the technology can optimize the material removing mechanism, improve the surface integrity, reduce the residual stress and cracks, realize the precise and ultra-precise machining with the 'flexible rigidity', and has important application value especially in the fields of micro machining, machining of complex curved surfaces, difficult-to-machine materials such as high-entropy alloy, ceramic, fiber composite materials and the like. When the current laser-assisted milling device is used for curved surface processing, in-situ laser-assisted processing (for example, the milling device disclosed in patent application CN118204834A is used for processing), a laser beam and a cutter move synchronously, but when the mode is adopted, the cutting tool has small selectivity (generally a diamond cutter or a sapphire cutter), high cost and severe working condition (the cutter is subjected to heavy heat load and is easy to wear or degrade in performance), low processing efficiency (due to limited cutter materials and cannot use high-power laser), insufficient auxiliary preparation time, narrow process window, difficult process control and difficult system integration, the defects can be overcome by pre-applying a high-energy laser beam and then milling, but when the angle of incidence of the laser beam deviates from the normal angle of a curved surface by exceeding the angle of the normal of the curved surface, a light spot can change from a round shape to an oval shape, energy distribution becomes uneven, the width and depth of an ablation groove are directly caused, the shape precision and the function effect of a micro-texture or functional structure are seriously influenced, the shape change of the light spot can influence the distribution problem of energy, especially in a curved surface part, the shape is damaged, the shape is always influenced, and the shape is always changed, and the shape is always influenced in the consistent, and the shape is influenced in the processing process, and the shape change of the curved surface is always influenced. The above problems all lead to a reduction in the quality of the process and even to a destruction. Disclosure of Invention Aiming at the defects of the prior art, the invention aims to provide a side-mounted follow-up laser-assisted milling device and a side-mounted follow-up laser-assisted milling method, so that the laser-assisted processing of a curved surface can adopt a method of preheating by laser and then processing by a cutter, and the problem of uneven energy distribution is avoided. In order to achieve the above object, the present invention is realized by the following technical scheme: In a first aspect, an embodiment of the present invention provides a side-mounted follow-up laser-assisted milling device, including a lathe bed, the lathe bed is provided with a milling mechanism, a workpiece moving platform is provided below the milling mechanism, a follow-up mechanism is provided at the periphery of the workpiece moving platform, the follow-up mechanism includes an arc-shaped follow-up guide rail fixed at the lathe bed, the follow-up guide rail is provided at the periphery of the workpiece moving platform, a moving positioning slider capable of moving along the follow-up guide rail is provided on the follow-up guide rail, the moving positioning slider is connected with a positioning mechanical arm, a clamping mechanism is provided at the end of the positioning mechanical arm, the clamping mechanism is connected with a collimated laser processing head, and the collimated laser processing head is connected with a modulated laser generator through a laser transmission optical fiber. The pose of the collimation laser processing head can be adjusted by moving the positioning sliding bl