CN-121972791-A - Laser processing equipment with cooling platform and processing method

CN121972791ACN 121972791 ACN121972791 ACN 121972791ACN-121972791-A

Abstract

The invention discloses laser processing equipment and a laser processing method with a cooling platform, comprising a workpiece placing platform, wherein the upper part of the workpiece placing platform is provided with the cooling platform, a vibrating mirror system is arranged above the cooling platform, the cooling platform comprises a water cooling box, a first adsorption sheet and a second adsorption sheet which can move in the Y direction are arranged on the bottom disc of the water cooling box, a cooling fan is arranged in the water cooling box and is fixed with a cooling block, a refrigerating sheet is arranged at the top of the cooling block, a second temperature sensor and a sensor fixing rod are arranged on the cooling block, a first temperature sensor is fixed on the sensor fixing rod, a double-side clamping fixing block is arranged at the top of the water cooling box along the Y direction, a single-side clamping fixing block is arranged at the top of the water cooling box along the X direction, a movable first clamping plate and a movable second clamping plate are arranged on the double-side clamping fixing block, a movable third clamping plate is arranged on the single-side clamping fixing block, and a focusing auxiliary platform is also arranged on one side of the water cooling box.

Inventors

WAN YI
ZHENG KAIYI
CAI YUKUI
WANG CHUANYING
LIANG YANGYANG
ZHANG HAO

Assignees

山东大学

Dates

Publication Date: 20260505
Application Date: 20260303

Claims (10)

1. A laser processing device with a cooling platform is characterized by comprising a workpiece placing platform, wherein the upper part of the workpiece placing platform is provided with the cooling platform, a vibrating mirror system is arranged above the cooling platform, the cooling platform comprises a water cooling box, a first adsorption sheet and a second adsorption sheet which can move in the Y direction are arranged on the bottom disc of the water cooling box, a cooling fan is arranged in the water cooling box and is fixed with a cooling block, a refrigerating sheet is arranged at the top of the cooling block, a second temperature sensor, a sensor fixing rod and a first temperature sensor are arranged on the cooling block, a double-side clamping fixing block is arranged at the top of the water cooling box along the Y direction, a single-side clamping fixing block is arranged at the top of the water cooling box along the X direction, a movable first clamping plate and a movable second clamping plate are arranged on the double-side clamping fixing block, a movable third clamping plate is arranged on the single-side clamping fixing block, and a focusing auxiliary platform is further arranged on one side of the water cooling box.
2. The laser processing apparatus with cooling platform as set forth in claim 1, wherein a semiconductor cooling plate is fixed on said heat dissipating block by silicone grease with high thermal conductivity, the semiconductor cooling plate is used for fixing a workpiece, the upper side of the semiconductor cooling plate is a cooling surface, and the lower side is a heating surface.
3. The laser processing apparatus with cooling platform as set forth in claim 1, wherein two sliding grooves are provided on the bottom plate of the water cooling tank along the Y direction, the first adsorption sheet and the second adsorption sheet are each connected with the corresponding sliding groove by rollers, and scale marks are provided on the outer sides of the sliding grooves.
4. The laser processing apparatus with cooling platform as claimed in claim 1, wherein the two side clamping blocks comprise a first clamping block and a second clamping block which are arranged oppositely, the first clamping block and the second clamping block are provided with inner grooves, the first clamping plate is slidably connected with the first clamping block, and the second clamping plate is slidably connected with the second clamping block.
5. The laser processing apparatus with cooling platform as claimed in claim 1, wherein an inner groove is provided on the one-sided clamping fixture, and the third clamping block is connected to the one-sided clamping fixture.
6. A laser processing apparatus with a cooling platform as claimed in claim 1, wherein the auxiliary focusing platform comprises an auxiliary alignment chassis, a lifting platform support is vertically arranged on the auxiliary alignment chassis, the lifting platform support is connected with the lifting platform, an auxiliary plate capable of moving along the X direction Y is arranged on the lifting platform, a second auxiliary scale is arranged at the end part of the auxiliary plate, and a pressure sensor is arranged at the bottom part of the auxiliary plate.
7. The laser processing apparatus with cooling platform as claimed in claim 6, wherein an inner groove is provided in the elevating platform, a fourth roller moves in the elevating platform, and the fourth roller is fixed with the auxiliary plate; the lifting platform support is provided with an inner groove, a fifth roller can slide in the inner groove, and the fifth roller is connected with the lifting platform.
8. A processing method of a laser processing apparatus with a cooling platform as claimed in any one of claims 1 to 7, characterized by the following: Placing the water cooling box, the refrigerating sheet, the radiating block and the radiating fan above the workpiece placing platform, and fixing the water cooling box on the workpiece placing platform through the focusing auxiliary platform, the first adsorption sheet and the second adsorption sheet; Placing a workpiece to be processed on a refrigerating sheet, then moving a first clamping plate, a second clamping plate and a third clamping plate to clamp the workpiece, focusing, and starting cooling after focusing alignment is completed; The method comprises the steps of coating a workpiece to be processed with silicone grease with high heat conductivity coefficient, uniformly coating, placing the workpiece on a refrigerating sheet, electrifying the refrigerating sheet, and enabling a water cooling box to perform a water cooling function through a water cooling inlet and a water cooling outlet; and when the detected temperature of the first temperature sensor is lower than the set threshold temperature, carrying out heat preservation, and then withdrawing the first clamping plate, the second clamping plate and the third clamping plate to start laser processing.
9. The method of claim 8, wherein the cooling fan is started when the second temperature sensor exceeds a threshold value during the machining process, the cooling effect is accelerated, the cooling fan is not started when the workpiece to be machined is reduced to a specified temperature, and the cooling fan is only cooled by water when the target temperature of the workpiece to be machined is higher.
10. The method of claim 8, wherein when the workpiece is replaced after the workpiece is machined, the auxiliary focusing platform is installed first, the auxiliary focusing platform presses the auxiliary plate to the upper surface of the workpiece to be machined, the pressure value is recorded, the cooling platform where the cooling plate is located is lowered after the workpiece is replaced, a new workpiece is placed at a position close to the first temperature sensor, the cooling plate is aligned with the first cooling plate through the second clamping plate, the lifting platform is lifted until the cooling plate contacts the pressure sensor, and the pressure value reaches an initial value, so that accurate positioning is completed.

Description

Laser processing equipment with cooling platform and processing method Technical Field The invention belongs to the field of laser processing, and particularly relates to laser processing equipment with a cooling platform and a processing method. Background The laser processing technology, especially high-power or precise laser processing, can generate remarkable heat accumulation in local areas of the workpiece in the processes of cutting, welding, cladding and the like, so that the HAZ of a heat affected zone is enlarged, and the problems of workpiece deformation, metallographic structure change, residual stress increase, material performance degradation and the like can be caused. In order to inhibit the heat influence and improve the processing quality and precision, the effective cooling of the processing area has become a key process link. At present, common cooling modes are mainly divided into passive cooling and active cooling. Passive cooling depends on environmental heat dissipation or simple air cooling, has low cooling efficiency and inaccurate temperature control, and is difficult to meet the requirements on temperature sensitive materials or precision machining. In active cooling, air cooling and water cooling are applied more, but the limitations of 1) the cooling pertinence and uniformity are insufficient, namely, the traditional air cooling or external circulation water cooling is mainly used for cooling the whole processing area or the equipment matrix, so that the cooling capacity is difficult to be accurately and uniformly applied to a specific micro processing area of a workpiece, and the cooling effect is poor or the whole temperature gradient of the workpiece is overlarge. 2) The temperature control is lag and inaccurate, most systems depend on monitoring the ambient temperature or the inlet and outlet temperatures of cooling media to indirectly judge the temperature of a workpiece, have slow response, can not realize real-time and accurate closed-loop control of the temperature of a workpiece processing point, and are particularly difficult to cope with rapid thermal shock caused by laser processing. 3) The integration level with the processing flow is low, and the cooling module is often independent of the positioning, clamping and focusing system of the workpiece. When the workpiece is replaced or the process is adjusted, the cooling device is required to be independently operated and calibrated, the flow is complicated, the efficiency is affected, and the repetition accuracy of the relative positions among the workpiece, the cooling surface and the laser focus is difficult to ensure. In addition, in batch or experimental processing where frequent workpiece replacement is required, how to quickly and accurately position a new workpiece to the same processing position as before is another difficulty in ensuring processing consistency. The existing method relies on mechanical limit or visual identification, the former is limited by workpiece size tolerance and clamping repeatability, the precision is limited, and the latter has complex system, high cost and reduced reliability under certain working conditions. Disclosure of Invention In order to solve the problems in the prior art, the invention provides laser processing equipment with a cooling platform and a processing method. In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: The invention provides laser processing equipment with a cooling platform, which comprises a workpiece placing platform, wherein the upper part of the workpiece placing platform is provided with the cooling platform, a vibrating mirror system is arranged above the cooling platform, the cooling platform comprises a water cooling box, a first adsorption sheet and a second adsorption sheet which can move in the Y direction are arranged on the bottom disc of the water cooling box, a cooling fan is arranged in the water cooling box, the cooling fan is fixed with a cooling block, a second temperature sensor and a sensor fixing rod are arranged on the cooling block, a first temperature sensor is fixed on the sensor fixing rod, a double-side clamping fixing block is arranged at the top of the water cooling box along the Y direction, a single-side clamping fixing block is arranged at the top of the water cooling box along the X direction, a movable first clamping plate and a movable second clamping plate are arranged at the double-side clamping fixing block, a movable third clamping plate is arranged at the single-side clamping fixing block, and a focusing auxiliary platform is further arranged at one side of the water cooling box. As a further technical scheme, a semiconductor refrigerating sheet is fixed on the radiating block through high-heat-conductivity silicone grease, the semiconductor refrigerating sheet is used for fixing a workpiece, the upper side of the semiconductor refrigerating sheet is a refrigerating