CN-121972795-A - Technological method for improving roughness of water-guided laser processing section

Abstract

The invention discloses a process method for improving roughness of a water guide laser processing section, which relates to the technical field of laser processing and comprises the steps of preprocessing a material to be processed, designing a processing track to be a circular circulating processing track, setting processing parameters of the water guide laser, wherein the processing parameters comprise pulse width and single pulse energy of pulse laser, the single pulse energy is larger than an ablation threshold value of the material, processing the material by using the water guide laser according to the processing track and the processing parameters, taking the material off a clamp after processing is finished, and detecting the processing section by using an optical microscope. The invention has the advantages that the integrated processing of coarse removal and fine smoothing is realized by adopting a combined pulse processing strategy combining long pulse and short pulse, complex auxiliary equipment is not required to be added, the integrated processing can be realized on the existing water-guided laser system through parameter optimization, and the integrated processing method has the remarkable advantages of simplicity in operation, low cost and easiness in popularization and application.

Inventors

• XING FEI
• LI DAIXU
• LU XIN
• WU FAN

Assignees

• 苏州中科煜宸激光智能科技有限公司

Dates

Publication Date

20260505

Application Date

20260127

Claims (5)

1. 1. A process method for improving roughness of a water-guided laser processing section is characterized by comprising the following steps: s1, preprocessing a material to be processed, and placing the material into an ultrasonic cleaner to clean the material for 5min by using purified water; S2, designing a processing track, wherein the processing track is a circular circulation processing track; S3, setting processing parameters of the water guide laser, including pulse width and single pulse energy of the pulse laser, wherein the pulse width of the pulse laser comprises 400ns and 100ns, the single pulse energy is set to be 1-2mJ, and the single pulse energy is larger than an ablation threshold value of a material; s4, processing the material by using a water-guided laser according to the processing track and the processing parameters, wherein a pulse with a pulse width of 400ns is used as a first pulse for material removal, and a pulse with a pulse width of 100ns is used as a second pulse for reheating remelting and resolidifying and leveling the residual micro-melting area on the surface layer of the material; And S5, after the machining is finished, the material is taken off from the clamp, the machining section is detected by using an optical microscope, and the ablation condition of the material surface is counted.
2. 2. The process for improving roughness of water-guided laser processing section according to claim 1, wherein in step S3, pulse widths of the pulse laser are set to 400ns and 100ns, corresponding to long pulse and short pulse, respectively.
3. 3. The method according to claim 1, wherein in step S3, the single pulse energy is set to 1-2mJ to ensure effective ablation of the material.
4. 4. The process for improving roughness of a water-guided laser processing section according to claim 1, wherein in the step S2, the circular cyclic processing track is used for realizing uniform processing and avoiding local defects.
5. 5. The process for improving roughness of a water-guided laser processing section according to claim 1, wherein in the step S4, the first pulse and the second pulse are sequentially applied, the first pulse is subjected to rough removal, and the second pulse is subjected to fine smoothing.

Description

Technological method for improving roughness of water-guided laser processing section Technical Field The invention relates to the technical field of laser processing, in particular to a process method for improving the roughness of a water guide laser processing section. Background The water-guiding laser is an advanced processing technology for coupling high-energy laser into micron-sized water jet, and has the advantages of high energy density of laser, high directionality of water jet, cooling effect and the like. Compared with the traditional dry laser processing, the technology can obviously inhibit the heat affected zone of the material, reduce ablation splashing, realize high depth-to-diameter ratio and conicity-free precision processing, and therefore, the technology has unique advantages in micro-pore and micro-groove processing of high-hardness brittle materials such as ceramics, sapphires and ceramic matrix composite materials and is widely applied. Currently, the quality of the actual processing profile of the water-guided laser processing technology is a key bottleneck which restricts further development of the water-guided laser processing technology. Because the material removal mechanism is complex, and the processing process is highly dependent on the stability of water jet, the processing surface is easy to generate water wave, micro pits, irregular bulges and other defects, so that the section roughness is difficult to stably control in an ideal range, and the theoretical high precision and high surface finish potential of the material cannot be fully exerted. Disclosure of Invention In order to solve the technical problems, a process method for improving the roughness of the water-guided laser processing section is provided, and the technical scheme solves at least one technical problem in the background art. In order to achieve the above purpose, the invention adopts the following technical scheme: A process method for improving roughness of a water-guided laser processing section comprises the following steps: s1, preprocessing a material to be processed, and placing the material into an ultrasonic cleaner to clean the material for 5min by using purified water; S2, designing a processing track, wherein the processing track is a circular circulation processing track; S3, setting processing parameters of the water guide laser, including pulse width and single pulse energy of the pulse laser, wherein the pulse width of the pulse laser comprises 400ns and 100ns, the single pulse energy is set to be 1-2mJ, and the single pulse energy is larger than an ablation threshold value of a material; s4, processing the material by using a water-guided laser according to the processing track and the processing parameters, wherein a pulse with a pulse width of 400ns is used as a first pulse for material removal, and a pulse with a pulse width of 100ns is used as a second pulse for reheating remelting and resolidifying and leveling the residual micro-melting area on the surface layer of the material; And S5, after the machining is finished, the material is taken off from the clamp, the machining section is detected by using an optical microscope, and the ablation condition of the material surface is counted. Preferably, in the step S3, pulse widths of the pulse laser are set to 400ns and 100ns, which correspond to the long pulse and the short pulse, respectively. Preferably, in step S3, the single pulse energy is set to 1-2mJ to ensure efficient ablation of material. Preferably, in the step S2, the circular circulation processing track is used to implement uniform processing, so as to avoid local defects. Preferably, in step S4, the first pulse and the second pulse are sequentially applied, the first pulse completes coarse removal, and the second pulse achieves fine smoothing. Compared with the prior art, the invention has the beneficial effects that: The invention realizes the integrated processing of 'coarse removal' and 'fine smoothing' by adopting a combined pulse processing strategy combining long pulse and short pulse. The process method can effectively re-heat, re-melt and re-solidify the surface layer residual micro-melt area generated after the first processing, thereby obviously eliminating the defects of common micro-pits, bulges and the like of the processed profile, stably controlling the roughness of the profile and greatly improving the smoothness and consistency of the processed surface. Meanwhile, the method can be realized on the existing water-guided laser system through parameter optimization without adding complex auxiliary equipment, and has the remarkable advantages of simplicity in operation, low cost and easiness in popularization and application. Drawings Fig. 1 is a flow chart of a process method for improving the roughness of a water guide laser processing section. Detailed Description The following description is presented to enable one of ordinary skill in the art to make