CN-121972796-A - Laser processing control method, device, equipment and storage medium

CN121972796ACN 121972796 ACN121972796 ACN 121972796ACN-121972796-A

Abstract

The invention provides a laser processing control method, a device, equipment and a storage medium, and relates to the technical field of laser processing. The laser processing control method comprises the steps of obtaining a processing track planned on a processing sample, dividing the processing track into a first processing track and a second processing track, controlling a laser emitting assembly to output a laser beam according to preset process parameters, controlling laser processing equipment to drive a light spot to move along the processing track, driving the light spot to move along the first processing track through the laser emitting assembly when the light spot passes through the first processing track, and driving the light spot to move along the second processing track through controlling a stage to move when the light spot passes through the second processing track. The laser processing control method effectively avoids splicing errors caused by twice galvanometer processing actions on the processed sample, and improves the processing efficiency and processing precision of the equipment on the large workpiece sample.

Inventors

LING BUJUN
ZHU PENGCHENG
YUAN MINGFENG
PAN WENJIN
LENG ZHIBIN

Assignees

江苏亚威艾欧斯激光科技有限公司

Dates

Publication Date: 20260505
Application Date: 20260130

Claims (10)

1. The laser processing control method is characterized by being applied to laser processing equipment, wherein the laser processing equipment comprises a bearing table and a laser emission component, the bearing table is used for bearing a processing sample, the laser emission component is arranged above the bearing table and outputs a laser beam to the surface of the bearing table, and the laser processing control method comprises the following steps: acquiring a planned processing track on the processing sample; Dividing the processing track into a first processing track and a second processing track, wherein the spatial frequency of the first processing track is higher than that of the second processing track; Controlling the laser emission assembly to output a laser beam according to preset process parameters, wherein the laser beam forms a light spot on the processed sample; controlling the laser processing equipment to drive the light spot to move along the processing track; In the moving process of the light spot, when the light spot approaches the first processing track, driving the light spot to move along the first processing track through the laser emission component; and when the light spot passes through the second processing track, the object stage is controlled to move so as to drive the light spot to move along the second processing track.
2. The laser processing control method according to claim 1, wherein the dividing the processing trajectory into a first processing trajectory and a second processing trajectory includes: acquiring the spatial frequency of the processing track, wherein the spatial frequency is the number of track points contained in the unit distance of the processing track; And dividing the processing track into the first processing track and the second processing track according to the spatial frequency.
3. The laser processing control method according to claim 2, wherein the pitch of adjacent track points in the first processing track is less than 50 μm, and the pitch of adjacent track points in the second processing track is greater than or equal to 50 μm.
4. The laser processing control method according to claim 1, wherein the laser processing apparatus further includes a position sensor that acquires position data of the stage and the processing sample, and wherein the controlling the laser processing apparatus to drive the spot to move along the processing trajectory includes: Establishing a coordinate system on a plane where the processing sample is located, and acquiring target position data of the processing track in the coordinate system in real time; and controlling the laser processing equipment to drive the light spot to move to the starting point of the processing track based on the target position data, and driving the light spot to move along the processing track to the end point of the processing track.
5. The method of claim 4, wherein the laser emitting assembly includes a light source, a scanning galvanometer, and a condensing element sequentially disposed along an output optical path, and wherein the driving the spot along the first processing path by the laser emitting assembly includes: acquiring corresponding vibrating mirror driving data based on target position data corresponding to the first processing track; And controlling the scanning galvanometer to deflect according to the galvanometer driving data so as to guide the light spot to move along the first processing track.
6. The laser processing control method of claim 4, wherein the driving the spot to move along the second processing trajectory by controlling the stage movement comprises: Acquiring corresponding platform driving data based on target position data corresponding to the second processing track; And controlling the objective table to move according to the platform driving data so as to enable the light spot to move along the second processing track.
7. The laser processing control method of claim 6, wherein the driving the spot to move along the second processing trajectory by controlling the stage movement further comprises: acquiring platform position data of the objective table in a moving process in real time; determining actual position data of the second processing track based on the platform position data; when the position deviation exists between the actual position data and the target position data of the second processing track, the laser emission component is controlled to drive the light spot to move so as to compensate the position deviation.
8. The laser processing control device is characterized by being applied to laser processing equipment, wherein the laser processing equipment comprises a bearing table and a laser emission component, the bearing table is used for bearing a processing sample, the laser emission component is arranged above the bearing table and outputs a laser beam to the surface of the bearing table, and the laser processing control device comprises: The track acquisition module is used for acquiring a planned processing track on the processing sample; The track dividing module divides the processing track into a first processing track and a second processing track, and the spatial frequency of the first processing track is higher than that of the second processing track; The processing control module controls the laser emission assembly to output a laser beam according to preset process parameters, wherein the laser beam forms a light spot on the processing sample; The processing control module drives the light spot to move along the first processing track through the laser emission component when the light spot passes through the first processing track in the moving process of the light spot, and drives the light spot to move along the second processing track through controlling the objective table to move when the light spot passes through the second processing track.
9. A laser processing apparatus, comprising: The bearing table comprises a displacement driving mechanism and a platform, wherein the displacement driving mechanism drives the platform to move, and the platform is used for bearing a processed sample; the laser emission component is arranged above the platform, outputs a laser beam to the surface of the platform, and adjusts the position of the laser beam forming a light spot on the surface of the platform; A controller in electrical communication with the displacement drive mechanism and the laser emitting assembly, the controller for performing the steps of the method of any one of claims 1 to 7.
10. A computer readable storage medium, on which a computer program is stored, characterized in that the computer program, when being executed by a processor, implements the steps of the method according to any one of claims 1 to 7.

Description

Laser processing control method, device, equipment and storage medium Technical Field The disclosure relates to the technical field of laser processing, and in particular relates to a laser processing control method, a device, equipment and a storage medium. Background Laser processing technology (such as laser cutting and laser welding technology) has been widely applied to a plurality of fields of mechanical manufacturing, electronic information, automobile industry and the like by virtue of the advantages of high precision, high efficiency and low damage, and becomes an indispensable key processing means in modern industrial production. Currently, existing laser processing apparatuses generally perform separate control on a laser emission component and a stage carrying a processed sample based on different operation precision, for example, an upper computer is used to directly control a scanning galvanometer in the laser emission component, and the stage is independently controlled by a Programmable Logic Controller (PLC). However, this split architecture presents significant cooperative control challenges, and laser processing equipment lacks efficient, precise, synchronous control of the motion of the laser emitting assembly and stage. The scanning vibrating mirror of the laser emission component in the equipment is limited in scanning visual field range, and is difficult to independently finish laser welding or cutting in a large range, so that the equipment needs to operate the laser emission component and the objective table to process the workpiece in a segmented mode when processing a large workpiece. If the scanning galvanometer is controlled to finish laser processing in the corresponding area of the workpiece in a limited visual field, then laser output is suspended, the objective table is driven to move the unprocessed area of the workpiece to a track joint position, and after the laser is positioned, the laser emitting assembly is driven to output laser at the joint position for continuous processing. As shown in figure 1, the method is limited by the displacement positioning precision of the scanning galvanometer and the objective table and the error of control time sequence, and the machining control method is extremely easy to cause obvious machining marks or dimension errors at the joint position of the two galvanometer machining actions, so that the appearance quality and dimension precision of a product can be reduced, and workpieces can be scrapped when the product is serious, thereby restricting the further application of the laser machining technology in the field of high-end manufacturing. Accordingly, there is a need to provide a laser processing control method, apparatus, device, and storage medium to solve the above-mentioned problems. Disclosure of Invention The disclosure aims to provide a laser processing control method, a device, equipment and a storage medium, which are used for solving the technical problem that a segmented laser processing technology is easy to cause obvious processing trace or dimension error at a joint position of two vibrating mirror processing actions on a processing sample. To achieve the above and other related objects, in a first aspect, the present disclosure provides a laser processing control method applied to a laser processing apparatus including a stage for carrying a processed sample and a laser emitting assembly disposed above the stage and outputting a laser beam to a surface of the stage, the laser processing control method comprising the steps of: acquiring a planned processing track on the processing sample; Dividing the processing track into a first processing track and a second processing track, wherein the spatial frequency of the first processing track is higher than that of the second processing track; Controlling the laser emission assembly to output a laser beam according to preset process parameters, wherein the laser beam forms a light spot on the processed sample; controlling the laser processing equipment to drive the light spot to move along the processing track; In the moving process of the light spot, when the light spot approaches the first processing track, driving the light spot to move along the first processing track through the laser emission component; and when the light spot passes through the second processing track, the object stage is controlled to move so as to drive the light spot to move along the second processing track. In a second aspect, the present disclosure provides a laser processing control apparatus applied to the laser processing device, the laser processing device including a carrying table for carrying a processing sample and a laser emitting assembly disposed above the carrying table and outputting a laser beam to a surface of the carrying table, the laser processing control apparatus comprising: The track acquisition module is used for acquiring a planned processing track on the processing sampl