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CN-121972822-A - Automatic control method and system for mobile phone card support laser cutting equipment

CN121972822ACN 121972822 ACN121972822 ACN 121972822ACN-121972822-A

Abstract

The application provides an automatic control method and system of mobile phone card support laser cutting equipment, which relate to the technical field of laser cutting and are applied to laser cutting of thin metal plates of mobile phone card supports; based on the material state characteristics, temperature deformation information of the thin metal plate is obtained, the deformation trend of the thin metal plate is calculated by combining the temperature deformation information and preset cutting path information, an adjusting instruction for adjusting cutting parameters is generated according to the deformation trend, the adjusting instruction is executed after smooth processing is carried out, and the cutting parameters comprise cutting speed, laser power, auxiliary gas pressure and focus position. The application improves the precision and quality consistency of the laser cutting of the mobile phone card holder, effectively prolongs the service life of key optical mechanical parts and improves the cutting yield.

Inventors

  • YUAN JIANXUN

Assignees

  • 东莞市鼎平精密五金科技有限公司

Dates

Publication Date
20260505
Application Date
20260205

Claims (10)

  1. 1. An automatic control method of a mobile phone card support laser cutting device is applied to laser cutting of a thin metal plate of a mobile phone card support, and is characterized by comprising the following steps: acquiring three-dimensional distribution information and mechanical property information of residual stress of a stress concentration area inside a thin metal plate, and generating material state characteristics of the thin metal plate; Acquiring temperature deformation information of the thin metal plate based on the material state characteristics, and calculating the deformation trend of the thin metal plate by combining the temperature deformation information and preset cutting path information; And generating an adjusting instruction for adjusting the cutting parameters according to the deformation trend, and executing the adjusting instruction after smoothing, wherein the cutting parameters comprise cutting speed, laser power, auxiliary gas pressure and focus position.
  2. 2. The automated mobile phone card support laser cutting equipment control method according to claim 1, wherein the step of obtaining three-dimensional distribution information and mechanical property information of residual stress of a stress concentration area inside a thin metal plate and generating material state characteristics of the thin metal plate comprises the steps of: Acquiring three-dimensional distribution information and mechanical property information of residual stress of a stress concentration area inside the thin metal plate, applying micro-pulse laser to the thin metal plate according to the three-dimensional distribution information and the mechanical property information of the residual stress, and inducing a microstructure of the stress concentration area of the thin metal plate to reconstruct so as to optimize the mechanical property of the thin metal plate; and acquiring three-dimensional distribution information and mechanical property information of residual stress of a stress concentration area inside the reconstructed thin metal plate so as to generate material state characteristics of the thin metal plate.
  3. 3. The automated control method of a mobile phone card support laser cutting device according to claim 2, wherein, in the process of applying the micro pulse laser to the thin metal plate material: and continuously monitoring strain information of the thin metal sheet under the action of the micropulse laser, and dynamically adjusting the operation parameters of the micropulse laser according to the strain information.
  4. 4. The automated control method of a mobile phone card holder laser cutting device according to claim 3, wherein, The strain information comprises transient thermal stress change information, local phase change information and local temperature information of the thin metal sheet under the action of the micropulse laser; the operating parameters include pulse sequence and energy density of the micropulse laser.
  5. 5. The automated control method of a mobile phone card support laser cutting device according to claim 4, wherein the step of dynamically adjusting the operation parameters of the micro-pulse laser according to the strain information comprises: adjusting the pulse sequence according to the transient thermal stress change information and the local phase change information; And adjusting the energy density according to the local temperature information.
  6. 6. The automated mobile phone card holder laser cutting equipment control method according to claim 2, wherein after the step of inducing the microstructure of the stress concentration region of the thin metal plate to reconstruct so as to optimize the mechanical properties of the thin metal plate, and before the step of acquiring the three-dimensional distribution information and the mechanical property information of the residual stress of the stress concentration region inside the reconstructed thin metal plate, the method further comprises the steps of: And performing spectrum analysis on the thin metal plate subjected to the micro-pulse laser treatment to evaluate the reconstruction effect of the microstructure of the thin metal plate, and applying the micro-pulse laser to the thin metal plate again if the reconstruction effect does not reach a preset state.
  7. 7. The automated mobile phone card tray laser cutting device control method according to claim 6, wherein the step of performing spectral analysis on the thin metal plate subjected to the micro-pulse laser treatment to evaluate a reconstruction effect of a microstructure of the thin metal plate, and reapplying the micro-pulse laser to the thin metal plate if the reconstruction effect does not reach a preset state comprises: Carrying out spectrum analysis on the thin metal plate subjected to the micro-pulse laser treatment to obtain a spectrum analysis result; Identifying whether a micro area which does not reach a preset state exists in the thin metal plate according to the spectrum analysis result so as to evaluate the reconstruction effect of the microstructure of the thin metal plate; If the reconstruction effect does not reach the preset state, recording the spatial coordinates and the spectral characteristics of the micro-area; According to the space coordinates and the spectral characteristics, adjusting the operation parameters of the micropulse laser; and applying the adjusted micro-pulse laser to the thin metal plate again.
  8. 8. The automatic control method of the mobile phone card holder laser cutting equipment according to claim 1, wherein the deformation trend comprises predicting a point to be cut of the thin metal plate on a cutting path, and dynamic deformation of the thin metal plate perpendicular to the surface of the thin metal plate, which occurs due to laser heating, wherein the compensation amount of the adjustment command for the focal position is opposite to the direction of the dynamic deformation and is equal to the amplitude of the dynamic deformation.
  9. 9. The automated control method of a mobile phone card support laser cutting device according to claim 1, wherein the step of generating an adjustment instruction for adjusting a cutting parameter according to the deformation trend, and performing smoothing processing on the adjustment instruction comprises: according to the deformation trend, calculating to obtain an initial adjustment quantity; establishing a coupling relation model among the cutting speed, the laser power, the auxiliary gas pressure and the focus position, wherein the coupling relation model is used for describing the influence of inter-parameter adjustment of the cutting parameters on the cutting effect; inputting the initial adjustment quantity into the coupling relation model, performing decoupling calculation, and generating an adjustment instruction capable of counteracting negative interference effects among parameters of the cutting parameters; and executing the adjustment instruction after smoothing.
  10. 10. An automated control system of a mobile phone card support laser cutting device, which is characterized by comprising: The information acquisition module is used for acquiring the three-dimensional distribution information and the mechanical property information of the residual stress of the stress concentration area in the thin metal plate and generating the material state characteristics of the thin metal plate; the state acquisition module is used for acquiring temperature deformation information of the thin metal plate based on the material state characteristics; the deformation estimating module is used for estimating the deformation trend of the thin metal plate by combining temperature deformation information and preset cutting path information; the instruction generation module is used for generating an adjustment instruction for adjusting the cutting parameters according to the deformation trend; and the instruction execution module is used for executing the adjustment instruction after the adjustment instruction is subjected to smoothing processing.

Description

Automatic control method and system for mobile phone card support laser cutting equipment Technical Field The application relates to the technical field of laser cutting, in particular to an automatic control method and system for mobile phone card support laser cutting equipment. Background The laser cutting process of the mobile phone card holder has extremely high precision requirement, and complex contour machining is required to be realized on the thin metal plate. However, existing automated control systems, in the face of dynamic deformations due to microscopic inhomogeneities of the thin metal sheet, and nonlinear parameter adjustments by the operator to compensate for the deformations, expose their deficiencies in cutting path planning and real-time adaptation capabilities, which not only affect process quality consistency, but also accelerate the loss of critical optomechanical components. In particular, path planning for existing systems is based on the idealized assumption that the physical properties of the material (such as internal stress distribution, thermal conductivity characteristics, and coefficient of thermal expansion) are uniform and stable. However, the actual thin metal plate has differences of grain structure, alloy element distribution and the like at a microscopic level, so that the local stress and the thermophysical property of the thin metal plate fluctuate. When such materials are laser cut, particularly at fine contours, non-uniform input of laser heat can induce localized stress relief, resulting in warping or shrinking of the sheet material on the order of tens of microns. The microscopic deformation causes the relative position of the laser focus and the surface of the plate to deviate, and the energy coupling efficiency is high, so that the laser beam cannot effectively cut at the optimal position, and residues which are not completely melted can be left in a cutting gap, or irregular slag, burrs and the like can be generated at the cutting edge. To compensate for the defects, the operator needs to manually adjust parameters such as laser power, cutting speed, etc. by experience. However, such real-time, non-linear manual intervention instructions exceed the response capability of the control system to control algorithms (e.g., PID) optimized for smooth, predictable conditions, resulting in motion judder to the servo system, and overshoot or undershoot of laser power. The control instability can disturb the auxiliary gas flow field at the nozzle of the cutting head, affect the melt blowing effect, lead the focusing lens to bear unexpected thermal stress impact, accelerate the ablation of the nozzle and the degradation of the lens coating film, and form a vicious circle with continuously reduced cutting quality. The automatic control system of the mobile phone card support laser cutting equipment has the advantages that when the existing automatic control system of the mobile phone card support laser cutting equipment faces dynamic deformation caused by micro-non-uniformity of a thin metal plate, frequent nonlinear parameter adjustment of operators for compensating the deformation and the stability problem of system control caused by the deformation, the defects of cutting path planning and real-time self-adaption capability are caused, so that the consistency of processing quality is poor, the loss of key optical mechanical parts is accelerated, and the cutting yield is reduced. Disclosure of Invention The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides an automatic control method and an automatic control system for mobile phone card support laser cutting equipment, which aim to solve the technical problems that the existing automatic control system for mobile phone card support laser cutting equipment has poor consistency of processing quality, accelerated loss of key optical mechanical parts and reduced cutting yield caused by the defects of cutting path planning and real-time self-adaption capability when facing dynamic deformation caused by micro-non-uniformity of thin metal plates, frequent nonlinear parameter adjustment of operators for compensating the deformation and the stability of system control caused by the dynamic deformation. In a first aspect, the present application provides an automated control method for a mobile phone card holder laser cutting device, applied to laser cutting of a thin metal plate of a mobile phone card holder, the method comprising the following steps: acquiring three-dimensional distribution information and mechanical property information of residual stress of a stress concentration area inside a thin metal plate, and generating material state characteristics of the thin metal plate; Acquiring temperature deformation information of the thin metal plate based on the material state characteristics, and calculating the deformation trend of the thin