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CN-121972823-A - Automatic feeding and discharging mechanism for laser cutting of glass wafer

CN121972823ACN 121972823 ACN121972823 ACN 121972823ACN-121972823-A

Abstract

The invention relates to the technical field of loading and unloading in wafer processing, and discloses an automatic loading and unloading mechanism for glass wafer laser cutting, which comprises a four-axis mechanical arm arranged in a laser cutting machine, wherein the end part of the four-axis mechanical arm is provided with two material taking and discharging assemblies for taking out or placing a carrying disc of a wafer body through a rotating assembly, one material taking and discharging assembly is used for transferring an unprocessed wafer body from a carrying frame to a processing table and is called a loading fork frame, the other material taking and discharging assembly is used for transferring the processed wafer body from the processing table back to the carrying frame and is called a unloading fork frame, and the material rotating and positioning assembly is arranged on the loading fork frame. The invention adjusts the direction of the wafer body, can identify the notch angle by matching with the positioning detection assembly, and carries out high-precision rotation correction by the gear motor, thereby fundamentally solving the problem of inaccurate manual or simple mechanical positioning, ensuring that each wafer body enters a laser cutting station in an absolute unified and accurate direction, and ensuring the consistency of cutting patterns and crystal directions.

Inventors

  • DU TAO
  • JIANG WEIHUA
  • XU JINXIAN
  • XU SHUXIANG

Assignees

  • 南通欧雷德智能科技有限公司

Dates

Publication Date
20260505
Application Date
20260310

Claims (9)

  1. 1. The automatic feeding and discharging mechanism for the laser cutting of the glass wafer comprises a four-axis mechanical arm (1) arranged in a laser cutting machine, and is characterized in that two feeding and discharging assemblies (5) for taking out or placing a bearing disc (1001) of a wafer body (1101) are arranged at the end part of the four-axis mechanical arm (1) through a rotating assembly, and the feeding and discharging assemblies (5) comprise a feeding fork (501) and a discharging fork (502); A loading fork (501) for transferring an unprocessed wafer body (1101) from the carrier (1003) to the processing station; A blanking fork (502) for transferring the processed wafer body (1101) from the processing station back to the carrier plate (1003); The material rotary positioning assembly (6) is arranged on the feeding fork frame (501) and is used for rotationally adjusting the orientation of the wafer body (1101); The feeding fork frame (501) is also provided with a material taking positioning assembly (8) which compresses the bearing disc (1001) when the position of the wafer body (1101) is rotationally adjusted; And the positioning detection assembly (7) is arranged on the material rotation positioning assembly (6) and is used for detecting the orientation of the rotated wafer body (1101).
  2. 2. The automatic feeding and discharging mechanism for glass wafer laser cutting is characterized in that the rotating assembly comprises a connecting frame (2) fixedly connected to the end part of a four-axis mechanical arm (1), a rotating table (3) is rotatably connected to the outer wall of the top of the connecting frame (2) through a bearing seat, and a driving motor (4) for enabling the rotating table (3) to axially rotate is fixedly connected to the inner wall of the top of the connecting frame (2).
  3. 3. The automatic feeding and discharging mechanism for glass wafer laser cutting according to claim 1, wherein the feeding fork frame (501) and the discharging fork frame (502) comprise mounting frames (503) fixedly connected with two sides of the rotary table (3), and a pair of electric telescopic fork frames (504) are fixedly connected with opposite sides of the two mounting frames (503).
  4. 4. The automatic feeding and discharging mechanism for glass wafer laser cutting according to claim 3, wherein the material rotary positioning assembly (6) comprises a support frame (601) fixedly connected to the middle position of the upper surface of the mounting frame (503) in the feeding fork frame (501), a long sliding table (602) is slidably connected in the support frame (601) through a sliding sleeve, the long sliding table (602) extends towards the direction of the electric telescopic fork frame (504), and an air cylinder (603) for enabling the long sliding table (602) to slide up and down along the support frame (601) is fixedly connected to the top of the support frame (601); The novel wafer lifting device is characterized in that a gear motor (604) is fixedly connected to the bottom of the free end of the long sliding table (602), a cross-shaped frame (605) is fixedly arranged on an output shaft of the gear motor (604) through a shaft seat, four end portions of the cross-shaped frame (605) are fixedly connected with a fixing ring (606), four supporting rods (607) which are in an annular array are fixedly connected to the outer wall of the circumference of the fixing ring (606), the positions of the four supporting rods (607) correspond to the positions of the four end portions of the cross-shaped frame (605), and suckers (608) which extend downwards are fixedly connected to the free ends of the supporting rods (607) and are used for sucking up a wafer body (1101) and separating from a bearing disc (1001).
  5. 5. The automatic feeding and discharging mechanism for glass wafer laser cutting according to claim 4, wherein an annular groove (609) is formed in the upper surface of the fixed ring (606), a plurality of L-shaped connecting rods (610) are fixedly connected to the bottom of the long sliding table (602), and the L-shaped connecting rods (610) are annularly distributed around the gear motor (604); the bottom ends of the L-shaped connecting rods (610) are welded with a sphere (611), and the spheres (611) are embedded into the annular groove (609) and matched with the annular groove (609).
  6. 6. The automatic feeding and discharging mechanism for glass wafer laser cutting according to claim 4, wherein the positioning detection assembly (7) comprises a first frame (701) fixedly connected to the middle section of the long sliding table (602) and extending downwards; The bottom outer wall of the first frame (701) is fixedly connected with two ranging sensors (703) for detecting the positions of the notch (1102) at the edge position of the wafer body (1101), and the positions detected by the two ranging sensors (703) are respectively positioned at detection end points (1104) at the inner sides of two end points of the notch (1102).
  7. 7. The automatic feeding and discharging mechanism for glass wafer laser cutting of claim 4, wherein the positioning detection assembly (7) further comprises a second frame (702) fixedly connected to the middle section of the long sliding table (602) and extending downwards; The bottom of frame two (702) fixedly connected with a horizontally miniature pen-type electric putter (704), miniature pen-type electric putter (704) flexible end passes frame two (702) and fixedly connected with miniature pressure sensor (705), miniature pressure sensor (705) free end has probe (706) through thread bush threaded connection, and the height of probe (706) is greater than the thickness of wafer body (1101), is used for the secondary to confirm wafer body (1101) orientation.
  8. 8. The automatic feeding and discharging mechanism for glass wafer laser cutting according to claim 1, wherein the material taking and positioning assembly (8) comprises; the U-shaped baffles (801) are fixedly connected to one side of the mounting frame (503) in the feeding fork frame (501), the two U-shaped baffles (801) are symmetrical, and a contact sensor (804) is embedded in one side of each U-shaped baffle (801); The upper surface of the mounting frame (503) is rotatably connected with a rotating shaft (802) through a bearing seat, and the circumferential outer wall of the rotating shaft (802) is fixedly connected with two pressing plates (803) for pressing the bearing plate (1001) in the process of rotating and positioning the wafer body (1101); the upper surface of the mounting frame (503) is provided with a driving component (9) for rotating the rotating shaft (802).
  9. 9. The automatic feeding and discharging mechanism for glass wafer laser cutting according to claim 8, wherein the driving assembly (9) comprises a pair of U-shaped guide rails (901) fixedly connected with the upper surface of the mounting frame (503) in the feeding fork frame (501), sliding plates (902) are slidably connected in the two U-shaped guide rails (901), and toothed plates (903) are fixedly connected with the upper surface of the sliding plates (902); the upper surface of the mounting frame (503) is fixedly connected with an electric push rod (905) which enables the sliding plate (902) to transversely move along the U-shaped guide rail (901); the circumference outer wall key of pivot (802) is connected with tooth ring (904) that use with pinion rack (903) cooperation.

Description

Automatic feeding and discharging mechanism for laser cutting of glass wafer Technical Field The invention relates to the technical field of loading and unloading in wafer processing, in particular to an automatic loading and unloading mechanism for laser cutting of a glass wafer. Background In modern high-end manufacturing industry, brittle and high-value flat plate materials represented by semiconductor wafers, photovoltaic silicon wafers and flat display glass substrates (hereinafter referred to as "glass wafers") have the precision processing quality directly determining the performance and yield of end products. The laser cutting technology has become a key technology for micro-processing such as scribing, cutting, punching and the like of the materials because of the advantages of non-contact, high precision, small heat affected zone and the like. However, the efficient potential of laser processing equipment is often limited by the level of automation and accuracy of the front and back material handling links. Therefore, the research of the high-precision and full-automatic feeding and discharging technology matched with the automatic feeding and discharging device has important significance for improving the efficiency of the whole production line, guaranteeing the processing consistency and realizing the intelligent production. The laser cut pattern is typically aligned precisely with the crystal orientation or pre-set mark of the wafer, which requires that the wafer be positioned at a very precise circumferential angle on the processing table during loading. Usually, a wafer is placed on a carrying disc by a manual or simple mechanical arm, and after the operation of placing the wafer on the carrying disc is completed, the placing angle of the wafer is easy to deviate, so that the precision of subsequent laser cutting processing is affected. Disclosure of Invention In order to overcome the defects in the prior art, the invention provides an automatic feeding and discharging mechanism for glass wafer laser cutting, which solves the problem that in the prior art, a manual or simple mechanical arm is adopted to place a wafer on a bearing disc, and after the operation of placing the wafer on the bearing disc is completed, the placement angle of the wafer is easy to deviate, so that the precision of subsequent laser cutting processing is affected. The invention provides a technical scheme that the automatic feeding and discharging mechanism for glass wafer laser cutting comprises a four-axis mechanical arm arranged in a laser cutting machine, wherein the end part of the four-axis mechanical arm is provided with two feeding and discharging assemblies for taking out or placing a carrying disc of a wafer body through a rotating assembly, one feeding and discharging assembly is used for transferring an unprocessed wafer body from a carrying frame to a processing table and is called a feeding fork, and the other feeding and discharging assembly is used for transferring the processed wafer body from the processing table back to the carrying frame and is called a discharging fork; the material rotary positioning assembly is arranged on the feeding fork frame and is used for rotationally adjusting the position of the wafer body; The feeding fork frame is also provided with a material taking positioning assembly which compresses the bearing disc when the position of the wafer body is rotationally adjusted; the positioning detection assembly is arranged on the material rotary positioning assembly and used for detecting the orientation of the rotated wafer body. As a further scheme of the invention, the rotating assembly comprises a connecting frame fixedly connected to the end part of the four-axis mechanical arm, the outer wall of the top of the connecting frame is rotationally connected with a rotating table through a bearing seat, and the inner wall of the top of the connecting frame is fixedly connected with a driving motor for enabling the rotating table to axially rotate. As a further scheme of the invention, the feeding fork frame and the discharging fork frame comprise mounting frames fixedly connected with two sides of the rotary table, and a pair of electric telescopic fork frames are fixedly connected with the opposite sides of the mounting frames. As a further scheme of the invention, the material rotary positioning assembly comprises a support frame fixedly connected to the middle position of the upper surface of the mounting frame in the feeding fork frame, a long sliding table is connected in the support frame in a sliding manner through a sliding sleeve, the long sliding table extends towards the direction of the electric telescopic fork frame, and the top of the support frame is fixedly connected with a cylinder for enabling the long sliding table to slide up and down along the support frame; The long slip table free end bottom fixedly connected with gear motor, gear motor output shaft has the c