CN-121972836-A - Method for processing blind hole by laser combination

Abstract

The invention relates to a method for processing blind holes by laser combination, which comprises the steps of providing a substrate, wherein the substrate comprises a copper foil layer, a resin layer and a bottom copper layer which are stacked from top to bottom, performing primary processing on the substrate by adopting a first laser processing device to remove at least part of the copper foil layer and the resin layer of the substrate and form first blind holes, wherein the first laser processing device is green laser equipment, performing secondary processing on the substrate by adopting a second laser processing device, taking the first blind holes as the center, removing the residual copper foil layer and the residual resin layer of the substrate, and forming second blind holes, and the second laser processing device is carbon dioxide laser equipment. The blind holes can be processed in a combined way based on the green laser equipment and the carbon dioxide laser equipment, so that the damage of the bottom copper layer is controllable.

Inventors

• CHEN HONGZHOU
• Shi Kouqin
• Lou Yuanyang

Assignees

• 苏州群策科技有限公司

Dates

Publication Date

20260505

Application Date

20260204

Claims (10)

1. 1. A method for processing a blind hole by combining lasers, which is characterized in that the method for processing the blind hole by combining lasers comprises the following steps: Providing a substrate, wherein the substrate comprises a copper foil layer, a resin layer and a bottom copper layer which are stacked from top to bottom; performing primary processing on the substrate by adopting a first laser processing device to remove at least part of the copper foil layer and the resin layer of the substrate and form a first blind hole, wherein the first laser processing device is green laser equipment; And carrying out secondary processing on the substrate by adopting a second laser processing device, taking the first blind hole as a center, removing the residual copper foil layer and the resin layer of the substrate, and forming a second blind hole, wherein the second laser processing device is carbon dioxide laser equipment.
2. 2. The method for processing blind holes by laser combination according to claim 1, wherein in the step of removing at least part of copper foil layer and resin layer of the substrate by using a first laser processing device and forming a first blind hole, the first laser processing device is green laser equipment, a preset first hole shape mask value is set for the first laser processing device, a plurality of different laser power values, cutting speed values and cutting times are set according to the preset first hole shape mask value, wherein the absolute value of the difference value of each laser power value is within a first preset range, the absolute value of the difference value of each cutting speed value is within a second preset range, the absolute value of the difference value of each cutting times is within a third preset range, the first blind holes are formed by combining the plurality of different laser power values, cutting speed values and cutting times, the first blind holes are processed at different positions based on the parameters of the plurality of the first test groups, and all the first blind holes are inspected.
3. 3. The method of claim 2, wherein in the step of performing appearance inspection on all the first blind holes, it is determined whether an aperture ratio deviation, a glass fiber protrusion, a bottom copper layer damage, a roundness deviation, and a resin residue are present at each of the first blind hole positions, and finally a group of first test groups having no aperture ratio deviation, glass fiber protrusion, a bottom copper layer damage, a roundness deviation, and a resin residue is selected as a first screening group, and the corresponding laser power value, cutting speed value, and cutting order value are set for use in the batch of mass-production laser processing.
4. 4. A method for machining blind holes by laser combination according to claim 3, wherein in the step of performing secondary machining on the substrate by using a second laser machining device, taking the first blind holes as a center, removing the residual copper foil layer and resin layer of the substrate and forming second blind holes, the second laser machining device is carbon dioxide laser equipment, a plurality of identical first blind holes are machined on the substrate based on parameters of the first screening group, a preset second hole shape mask value is set for the second laser machining device, a plurality of different energy values, pulse width values and emission order values are set according to the preset second hole shape mask value, wherein the absolute value of the difference value of each energy value is in a fourth preset range, the absolute value of the difference value of each emission order value is in a sixth preset range, a plurality of different energy values, pulse width values and emission order values are combined to form a plurality of different second test groups, and the second blind holes are subjected to full-scale inspection based on the second parameter of the second test group.
5. 5. The method of claim 4, wherein in the step of performing appearance inspection on all the second blind holes, it is determined whether an aperture ratio deviation, a glass fiber protrusion, a bottom copper layer damage, a roundness deviation, and a resin residue occur at each of the second blind hole positions, and finally a group of the first test groups having no aperture ratio deviation, glass fiber protrusion, bottom copper layer damage, roundness deviation, and resin residue is selected as the first screening group, and the corresponding laser power value, cutting speed value, and cutting order value are set for use in the batch production laser processing.
6. 6. The method for processing blind holes by combining lasers according to claim 1 wherein said first laser processing means has a wavelength of 515nm and a beam pattern of flat top light.
7. 7. The method for processing blind holes by combining lasers according to claim 1 wherein the second laser processing device has a wavelength of 9300nm and a beam mode of Gaussian light.
8. 8. The method of claim 1, wherein in the step of performing preliminary processing on the substrate by using a first laser processing device to remove at least part of the copper foil layer and the resin layer of the substrate and form a first blind hole, the first laser processing device is a green laser device, and processing is performed by using a concentric path, specifically, the concentric path is an outer circle, an inner circle, or an inner circle, and an outer circle.
9. 9. The method of claim 1, wherein the second laser processing device is used to perform secondary processing on the substrate, the first blind hole is used as a center, the residual copper foil layer and resin layer of the substrate are removed, and a second blind hole is formed, and after the second laser processing device is a carbon dioxide laser device, the substrate is fixed, and the position of the second blind hole on the substrate is subjected to plasma cleaning.
10. 10. The method of claim 9, wherein the carbon tetrafluoride value is set to 0 in the step of fixing the substrate and performing plasma cleaning on the position of the second blind hole on the substrate.

Description

Method for processing blind hole by laser combination Technical Field The invention relates to a blind hole processing method, in particular to a method for processing blind holes by combining lasers. Background The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. At present, a blind hole is required to be machined on a copper foil substrate by laser, and currently, blind hole machining is generally finished by adopting a single laser device in the industry, so that the damage of a bottom copper layer in the substrate is difficult to be controlled at a lower level while the hole shape quality is ensured. It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present invention and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the invention section. Disclosure of Invention The invention aims to provide a method for processing blind holes by combining laser, which can be used for processing blind holes by combining green laser equipment and carbon dioxide laser equipment, so that the damage of a bottom copper layer is controllable. In order to achieve the above object, the present invention discloses a method for processing blind holes by laser combination, which comprises the following steps: Providing a substrate, wherein the substrate comprises a copper foil layer, a resin layer and a bottom copper layer which are stacked from top to bottom; performing primary processing on the substrate by adopting a first laser processing device to remove at least part of the copper foil layer and the resin layer of the substrate and form a first blind hole, wherein the first laser processing device is green laser equipment; And carrying out secondary processing on the substrate by adopting a second laser processing device, taking the first blind hole as a center, removing the residual copper foil layer and the resin layer of the substrate, and forming a second blind hole, wherein the second laser processing device is carbon dioxide laser equipment. As a further description of the technical scheme, in the step of performing preliminary processing on the substrate by using a first laser processing device to remove at least part of the copper foil layer and the resin layer of the substrate and form a first blind hole, the first laser processing device is green laser equipment, a preset first hole-shaped mask value is set for the first laser processing device, a plurality of different laser power values, cutting speed values and cutting times are set according to the preset first hole-shaped mask value, wherein the absolute value of the difference value of each laser power value is in a first preset range, the absolute value of the difference value of each cutting speed value is in a second preset range, the absolute value of the difference value of each cutting times is in a third preset range, the first blind holes are formed by combining the plurality of different laser power values, cutting speed values and cutting times values, the preliminary processing of the substrate at different positions is performed on the substrate based on the parameters of the plurality of the first test groups, and a plurality of first blind holes are formed, and all the first blind holes are inspected. As a further description of the above technical solution, in the step of "performing appearance inspection on all the first blind holes", it is determined whether an aperture ratio deviation, a glass fiber protrusion, a bottom copper layer damage, a true roundness deviation, and a resin residue occur at each position of the first blind holes, and finally, a group of first test groups without an aperture ratio deviation, a glass fiber protrusion, a bottom copper layer damage, a true roundness deviation, and a resin residue is selected as a first screening group, and the corresponding laser power value, cutting speed value, and cutting order value are set for use in the batch production laser processing. In the step of performing secondary processing on the substrate by using a second laser processing device, removing the residual copper foil layer and the resin layer of the substrate with the first blind hole as a center, and forming a second blind hole, the second laser processing device is a carbon dioxide laser device, a plurality of identical first blind holes are processed on the substrate based on the parameters of the first screening group, a preset second hole shape mask value is set for the second laser processing device, a plurality of different energy values, pulse width values and emission order values are set according to the preset second hole shape ma