CN-121972839-A - Laser cutting track correction method, control equipment and laser cutting machine

CN121972839ACN 121972839 ACN121972839 ACN 121972839ACN-121972839-A

Abstract

The application provides a laser cutting track correction method, control equipment and a laser cutting machine, wherein the method comprises the steps of obtaining an initial cutting position of a laser cutting nozzle after laser cutting is started, obtaining a first position offset of the laser cutting nozzle after groove cutting is carried out, obtaining a real-time cutting position of the laser cutting nozzle in the groove cutting process, determining real-time height offset based on the initial cutting position, the real-time cutting position and the first position offset, calculating horizontal offset compensation of the laser cutting nozzle according to the real-time height offset, and controlling the laser cutting nozzle to cut a groove according to the horizontal offset compensation.

Inventors

SHI MENGCHENG
XIAO SENBIN
LUO ANQI

Assignees

嘉强(上海)智能科技股份公司

Dates

Publication Date: 20260505
Application Date: 20251202

Claims (16)

1. A laser cutting trajectory modification method, comprising: After the laser cutting is started, acquiring an initial cutting position of a laser cutting nozzle; after entering groove cutting, acquiring a first position offset of a laser cutting nozzle; acquiring a real-time cutting position of the laser cutting nozzle in the groove cutting process; Determining a real-time elevation offset based on the initial cutting position, the real-time cutting position, and the first position offset; Calculating a horizontal offset compensation of the laser cutting nozzle according to the real-time height offset; and controlling the laser cutting nozzle to cut the groove according to the horizontal offset compensation.
2. The method of claim 1, wherein the obtaining a first positional offset of a laser cutting nozzle comprises: acquiring an offset angle of the laser cutting nozzle; And determining a first position offset based on the offset angle and the pendulum length of the laser cutting nozzle to the rotation center of the laser cutting nozzle.
3. The method of claim 2, wherein the method is applied to a five-axis laser cutting machine, the five-axis laser cutting machine comprises a laser cutting nozzle, the five axes respectively comprise a first rotation axis, a second rotation axis, an X axis, a Y axis and a Z axis of a Cartesian space coordinate system, and the offset angles comprise a first offset angle caused by the first rotation axis and a second offset angle caused by the second rotation axis; the determining a first positional offset based on the offset angle and a pendulum length of the laser cutting nozzle to a center of rotation of the laser cutting nozzle, comprising: Calculating a first cosine value of the first offset angle and a second cosine value of the second offset angle; Multiplying the first cosine value, the second cosine value and the swing length from the laser cutting nozzle to the rotation center of the laser cutting nozzle to obtain a first position offset.
4. A method according to any one of claims 1-3, characterized in that the method further comprises: determining a second position offset based on the plate surface to be processed which needs to be processed by the laser cutting nozzle; the determining the real-time height offset based on the real-time cutting position, and the first position offset includes determining the real-time height offset based on the real-time cutting position, the first position offset, and the second position offset.
5. The method of claim 4, wherein determining the second positional offset based on the surface to be processed that the laser cutting nozzle is to process comprises: determining a first space point, a second space point and a third space point on a board to be processed which is required to be processed by the laser cutting nozzle; based on the first space point, the second space point and the third space point, constructing a rotation matrix of an actual plane of the board to be processed and X-axis and Y-axis planes of a Cartesian space coordinate system; Determining a theoretical processing point of the plate surface to be processed based on an expected processing point of the laser cutting nozzle on the plate surface to be processed, the first space point and the rotation matrix; A second positional offset is determined based on the expected machining point and the theoretical machining point.
6. The method of claim 5, wherein constructing a rotation matrix of the surface of the board to be processed and X-axis and Y-axis planes of a cartesian space rectangular coordinate system based on the first spatial point, the second spatial point, and the third spatial point comprises: Determining a first vector based on the first spatial point and the second spatial point; determining a second vector based on the first spatial point and the third spatial point; Determining a third vector based on the first vector and the second vector; and determining a rotation matrix of the surface of the plate surface to be processed and X-axis and Y-axis planes of a Cartesian space rectangular coordinate system based on the first vector and the third vector.
7. The method of claim 5, wherein determining an implementation formula for a theoretical machining point of the board to be machined based on the expected machining point of the laser cutting nozzle at the board to be machined, the first spatial point, and the rotation matrix comprises: ; Wherein, the Representing a theoretical machining point of the laser cutting nozzle on the board surface to be machined; representing a first spatial point; Representing a rotation matrix; representing the expected processing point of the laser cutting nozzle on the board surface to be processed; the implementation formula for determining the second position offset based on the expected processing point and the theoretical processing point comprises: ; Wherein, the Representing a second position offset; Representing the component of the laser cutting nozzle on the Z axis at the theoretical machining point of the plate surface to be machined; representing the component of the laser cutting nozzle in the Z axis at the expected processing point of the board to be processed.
8. The method of claim 5, wherein the projection of the first spatial point and the second spatial point on the X-axis and Y-axis planes of the cartesian space rectangular coordinate system is parallel to the X-axis, and wherein the third spatial point is non-collinear with the line connecting the first spatial point and the second spatial point.
9. The method of claim 1, wherein the determining a real-time elevation offset based on the initial cutting position, the real-time cutting position, and the first position offset comprises: And subtracting the initial cutting position and the first position offset from the real-time cutting position to determine a real-time height offset.
10. The method of claim 1, wherein said calculating a horizontal offset compensation of the laser cutting nozzle from the real-time height offset comprises: and determining the horizontal offset compensation of the laser cutting nozzle based on the real-time height offset and the real-time processing angle of the laser cutting nozzle.
11. The method of claim 10, wherein the horizontal offset compensation comprises an X-axis compensation amount and a Y-axis compensation amount; The determining the horizontal offset compensation of the laser cutting nozzle based on the real-time height offset and the real-time machining angle of the laser cutting nozzle includes: Acquiring a real-time machining direction vector of the laser cutting nozzle; Calculating a horizontal total compensation based on the real-time height offset and a real-time machining angle of the laser cutting nozzle; Determining an X-axis component proportion and a Y-axis component proportion based on the real-time processing direction vector; Calculating an X-axis compensation amount based on the X-axis component proportion and the horizontal total compensation; and calculating Y-axis compensation amount based on the Y-axis component proportion and the horizontal total compensation.
12. A control device comprising a processor, a memory storing machine-readable instructions executable by the processor, which when executed by the processor perform the steps of the method of any one of claims 1 to 11.
13. A laser cutting machine comprising a laser cutting nozzle, a control mechanism for controlling the laser cutting nozzle, and the control apparatus of claim 12; the control device is used for controlling the movement of the control mechanism based on the steps of the method of any one of claims 1 to 11, so that the control mechanism drives the laser cutting nozzle to move.
14. The laser cutting machine of claim 13, wherein the control mechanism comprises a five-axis control structure for driving the laser cutting nozzle to move in X-axis, Y-axis, and Z-axis directions of the first rotational axis, the second rotational axis, and the cartesian rectangular coordinate system.
15. A computer-readable storage medium, characterized in that it has stored thereon a computer program which, when executed by a processor, performs the steps of the method according to any of claims 1 to 11.
16. A computer program product, characterized in that the computer program product comprises a computer program which, when executed by a processor, implements the method of any one of claims 1 to 11.

Description

Laser cutting track correction method, control equipment and laser cutting machine Technical Field The application relates to the technical field of laser cutting, in particular to a laser cutting track correction method, control equipment and a laser cutting machine. Background When the groove is machined, the laser cutting nozzle cannot always keep in a vertical state, when the angle of the laser cutting nozzle changes, the laser cutting nozzle and the induction surface of the plate surface to be cut also change, and at the moment, the distance measurement is inaccurate, so that the laser cutting has some cutting deviation at the groove. Disclosure of Invention The application aims to provide a laser cutting track correction method, control equipment and a laser cutting machine, which can improve the accuracy of groove cutting. The application provides a laser cutting track correction method, which comprises the steps of obtaining an initial cutting position of a laser cutting nozzle after laser cutting is started, obtaining a first position offset of the laser cutting nozzle after groove cutting is carried out, obtaining a real-time cutting position of the laser cutting nozzle in a groove cutting process, determining a real-time height offset based on the initial cutting position, the real-time cutting position and the first position offset, calculating horizontal offset compensation of the laser cutting nozzle according to the real-time height offset, and controlling the laser cutting nozzle to cut a groove according to the horizontal offset compensation. In the above implementation manner, when the angle of the laser cutting nozzle is changed, the height of the Z axis of the laser cutting nozzle has some deviation, and the problem that the machined part is one circle larger or one circle smaller finally results in more serious track distortion when the bevel is machined. In an alternative embodiment, the acquiring the first position offset of the laser cutting nozzle includes acquiring an offset angle of the laser cutting nozzle, and determining the first position offset based on the offset angle and a pendulum length of the laser cutting nozzle to a center of rotation of the laser cutting nozzle. In the implementation manner, the determination of the height offset can be realized by combining the actual situation of the laser cutting machine and the offset angle of the pendulum length and the laser cutting nozzle, so that the determined first position offset can more accurately represent the offset caused by the actual laser cutting machine. In an alternative embodiment, the five-axis laser cutting machine comprises a laser cutting nozzle, wherein the five-axis laser cutting machine comprises a first rotating shaft, a second rotating shaft, an X axis, a Y axis and a Z axis of a Cartesian space coordinate system, the offset angles comprise a first offset angle caused by the first rotating shaft and a second offset angle caused by the second rotating shaft, the first position offset is determined based on the offset angles and the swing length of the laser cutting nozzle to the rotation center of the laser cutting nozzle, the first position offset is obtained by calculating a first cosine value of the first offset angle and a second cosine value of the second offset angle, and the first cosine value, the second cosine value and the swing length of the laser cutting nozzle to the rotation center of the laser cutting nozzle are multiplied to obtain the first position offset. In the implementation manner, the specific five-axis laser cutting machine is combined to determine the height offset caused by the groove, so that the five-axis laser cutting machine can be more accurate in groove cutting when the five-axis laser cutting machine performs groove cutting. In an alternative embodiment, the method further comprises determining a second position offset based on the board to be processed by the laser cutting nozzle, wherein the determining of the real-time height offset based on the real-time cutting position, the real-time cutting position and the first position offset comprises determining the real-time height offset based on the real-time cutting position, the first position offset and the second position offset. In the implementation manner, the second position offset caused by the board surface to be processed can be fused, so that the determined height offset can be more comprehensive, and the real-time height offset can be accurate. In an alternative embodiment, the determining the second position offset based on the board to be processed of the laser cutting nozzle includes determining a first spatial point, a second spatial point and a third spatial point on the board to be processed of the laser cutting nozzle, constructing a rotation matrix of an actual plane of the board to be processed and an X-axis and a Y-axis of a Cartesian space based on the first spatial point, the second spatial point an