CN-121973028-A - Method and device for processing outer surface of hemispherical harmonic oscillator

CN121973028ACN 121973028 ACN121973028 ACN 121973028ACN-121973028-A

Abstract

The invention discloses a method and a device for processing the outer surface of a hemispherical resonator, wherein the method comprises the steps of calculating according to the actual size of a grinding wheel and the design size of the hemispherical resonator to obtain the rotation angle theta and a processing path of the hemispherical resonator around the center of the hemispherical resonator during processing, rotating a hemispherical resonator test article around the center of the hemispherical resonator test article theta and processing the outer surface of the hemispherical resonator test article according to the processing path, calculating the deviation of an outer sphere hemisphere based on the actual measurement value of the outer sphere radius of the processed hemispherical resonator test article and the design size of the outer sphere radius, obtaining the compensation amount of the processing path based on the deviation of the outer sphere radius to obtain the compensated processing path, and processing the outer surface of the hemispherical resonator based on the grinding wheel, the rotation angle theta of the hemispherical resonator around the center of the hemispherical resonator and the compensated processing path. The invention can realize the in-place processing of the outer sphere size of the hemispherical harmonic oscillator, and avoid the phenomenon that the sizes of the outer support column and the transitional R angle are damaged.

Inventors

WANG FEI
LU GUANGFENG
WANG FAN
LIU KAI

Assignees

湖南二零八先进科技有限公司

Dates

Publication Date: 20260505
Application Date: 20260408

Claims (8)

1. The processing method of the outer surface of the hemispherical harmonic oscillator is characterized by comprising the following steps of: s1, calculating according to the actual size of a grinding wheel and the design size of a hemispherical resonator to obtain an angle theta and a processing path of the hemispherical resonator rotating around the center of the hemispherical resonator during processing; s2, rotating the hemispherical resonator test article by theta around the sphere center of the hemispherical resonator test article, and then processing the outer surface of the hemispherical resonator test article according to the processing path; calculating the deviation of an outer sphere hemisphere based on the measured value of the outer sphere radius of the processed hemispherical harmonic oscillator test product and the design size of the outer sphere radius, and obtaining the compensation quantity of a processing path based on the deviation of the outer sphere radius to obtain a compensated processing path; And S3, processing the outer surface of the hemispherical resonator based on the grinding wheel, the rotation angle theta of the hemispherical resonator around the center of the hemispherical resonator and the compensated processing path.
2. The method for processing the outer surface of a hemispherical resonator according to claim 1, wherein the angle θ by which the hemispherical resonator rotates around its center is calculated as follows: , Wherein, the The size is designed for the radius of the outer sphere of the hemispherical harmonic oscillator, The radius of the transition R angle of the hemispherical harmonic oscillator is designed to be sized, The radius of the outer support column of the hemispherical resonator is designed to be the size, For the size of the inner diameter of the grinding wheel to be actually machined, For the radius dimension of the R corner of the actual processed grinding wheel, Is the design dimension of the inner diameter of the grinding wheel.
3. The method of claim 2, wherein the hemispherical resonator test piece is rotated counterclockwise by an angle θ around its center when the actual processed inner diameter dimension of the grinding wheel is greater than the designed dimension of the inner diameter of the grinding wheel, and the hemispherical resonator test piece is rotated clockwise by an angle θ around its center when the actual processed inner diameter dimension of the grinding wheel is less than the designed dimension of the inner diameter of the grinding wheel.
4. A method of processing the outer surface of a hemispherical resonator according to any one of claims 1 to 3, characterized in that the processing path is determined by: The geometric center coordinate of the transition R angle of the rotated hemispherical harmonic oscillator is used as the starting point of the processing route, Calculating the depth of the Z axis of the processing route based on the design radius of the hemispherical harmonic oscillator outer sphere, determining the coordinate of the end point Z axis of the processing route according to the Z axis depth of the processing route, wherein the coordinate of the end point X axis of the processing route is the same as the coordinate of the start point X axis of the processing route, A connection line between a start point of a processing path and an end point of the processing path is determined as the processing path.
5. A method of processing an outer surface of a hemispherical resonator according to any one of claims 1 to 3, wherein determining a compensation amount of a processing path based on a deviation of the radius of the outer sphere comprises: And determining the deviation value of the radius of the outer sphere as the compensation quantity of the Z-axis direction of the machining path.
6. The method for processing the outer surface of the hemispherical resonator according to any one of claims 1 to 3, further comprising, before the step S1, determining the design size of the grinding wheel according to the design size of the hemispherical resonator and manufacturing the grinding wheel, and measuring the manufactured grinding wheel to obtain the actual size of the grinding wheel.
7. The method of claim 6, wherein determining the design size of the grinding wheel based on the design size of the hemispherical resonator, specifically comprises: Design inner diameter of grinding wheel , Wherein, the The size is designed for the radius of the outer sphere of the hemispherical harmonic oscillator, The radius of the transition R angle of the hemispherical harmonic oscillator is designed to be sized, Designing the size for the radius of the outer support column of the hemispherical resonator; the design radius of the R corner of the grinding wheel is equal to the design radius of the transition R corner of the hemispherical resonator, and the depth h of the grinding wheel is larger than the design size of the outer sphere radius of the hemispherical resonator mm。
8. An apparatus for carrying out the method of processing the outer surface of a hemispherical resonator as claimed in any one of claims 1 to 7, comprising: the first calculation unit is used for calculating according to the actual size of the grinding wheel and the design size of the hemispherical resonator to obtain the angle theta and the processing path of the hemispherical resonator rotating around the center of the hemispherical resonator during processing; The processing unit is used for driving the hemispherical harmonic oscillator test article to rotate by theta around the sphere center of the hemispherical harmonic oscillator test article and then processing the outer surface of the hemispherical harmonic oscillator test article according to the processing path; The second calculation unit is used for calculating the deviation of the outer sphere hemisphere based on the measured value of the outer sphere radius of the processed hemispherical harmonic oscillator test article and the design size of the outer sphere radius, and calculating the compensation amount of the processing path based on the deviation of the outer sphere radius to obtain a compensated processing path; The processing unit is also used for processing the outer surface of the hemispherical resonator based on the manufactured grinding wheel, the angle theta of the hemispherical resonator rotating around the center of the hemispherical resonator and the compensated processing path.

Description

Method and device for processing outer surface of hemispherical harmonic oscillator Technical Field The invention relates to the technical field of inertial navigation preparation, in particular to a processing method and device for the outer surface of a hemispherical harmonic oscillator. Background The generating method has remarkable advantages in the field of complex curved surface forming due to unique process principles and the capability of adapting to high-precision requirements, generates a curved surface through continuous synchronous movement of a cutter and a workpiece, combines a mathematical model control path, can reach nanoscale surface roughness, meets the severe requirements of the complex curved surface on geometric symmetry, and can realize high-efficiency processing on hard and brittle materials. The hemispherical resonator gyroscope has the characteristics of simple structure, high precision, high reliability and long service life, has important application scenes in the fields of aerospace, astronomy, ocean and the like, and has the core component of a thin shell type hemispherical resonator, which comprises a hemispherical shell, and an inner support column and an outer support column which are integrally formed with the hemispherical shell. Because the shape is complex, the requirements on appearance and surface quality are high, the processing difficulty is high, particularly the processing of the outer surface is performed after the inner sphere is molded, the surface quality and the precision of the outer sphere are ensured and the shell of the sphere is prevented from being broken during processing, and the design of a processing cutter and a processing path is particularly important. In addition, in actual machining, there may be a deviation in the dimensional accuracy of the outer sphere machining tool itself actually machined according to the design dimensions, and in addition, the machine tool accuracy, the temperature change between machining and the like may have an influence on the machining dimensions and geometric forms of the outer sphere of the hemispherical resonator, so that during machining, correction of a mathematical model path is required, and it is also a problem to be solved how to perform machining compensation on the outer surface of the hemispherical resonator while ensuring that the machined dimensions and geometric forms of the hemispherical resonator are within the design tolerance range. Disclosure of Invention Aiming at the problems in the background art, the invention provides a processing method and a processing device for the outer surface of a hemispherical resonator, which are used for compensating the processing gesture and the processing path of the outer surface of the hemispherical resonator, ensuring that the size and the geometric form of the hemispherical resonator after processing are within the design tolerance range and not damaging the sizes of an outer support column and a transition R angle. The invention adopts the following technical scheme: a processing method of the outer surface of a hemispherical harmonic oscillator comprises the following steps: s1, calculating according to the actual size of a grinding wheel and the design size of a hemispherical resonator to obtain an angle theta and a processing path of the hemispherical resonator rotating around the center of the hemispherical resonator during processing; s2, rotating the hemispherical resonator test article by theta around the sphere center of the hemispherical resonator test article, and then processing the outer surface of the hemispherical resonator test article according to the processing path; calculating the deviation of an outer sphere hemisphere based on the measured value of the outer sphere radius of the processed hemispherical harmonic oscillator test product and the design size of the outer sphere radius, and obtaining the compensation quantity of a processing path based on the deviation of the outer sphere radius to obtain a compensated processing path; And S3, processing the outer surface of the hemispherical resonator based on the grinding wheel, the rotation angle theta of the hemispherical resonator around the center of the hemispherical resonator and the compensated processing path. Optionally, the calculation formula of the angle θ of rotation of the hemispherical resonator around its center is as follows: , Wherein, the The size is designed for the radius of the outer sphere of the hemispherical harmonic oscillator,The radius of the transition R angle of the hemispherical harmonic oscillator is designed to be sized,The radius of the outer support column of the hemispherical resonator is designed to be the size,For the size of the inner diameter of the grinding wheel to be actually machined,For the radius dimension of the R corner of the actual processed grinding wheel,Is the design dimension of the inner diameter of the grinding wheel. Optionally, whe