CN-121973052-A - Chamfering method for planar coating

CN121973052ACN 121973052 ACN121973052 ACN 121973052ACN-121973052-A

Abstract

The application provides a chamfering method of a planar coating, which relates to the technical field of coating surface processing and comprises the steps of determining preset parameters of the planar coating of a workpiece, wherein the preset parameters at least comprise chamfering width L and chamfering thickness H of the planar coating, positioning the substrate and the surface of the planar coating on the substrate along a first direction, positioning the edge of the planar coating along a second direction, and cutting and chamfering the edge of the planar coating according to the preset parameters. The chamfering method has the advantages that the high-precision and low-damage chamfering of the edges of the planar coating is realized by utilizing the dual positioning mode of the diameter difference of the substrate bearing and the coating bearing and the guide piece and through the processes of parameter setting, positioning constraint, automatic cutting and quality checking, the chamfering precision of the planar coating is improved, the zero damage risk can be realized, the cutting depth is controlled through the diameter difference of the bearing, the substrate damage is completely avoided, the chamfering efficiency is greatly improved, the quality consistency is high, and the chamfering effect of different workpieces is ensured by standardized parameters and the process.

Inventors

NAN JIAN
LI MENG
ZOU YALING
WANG KAIJIA
WU JIEYI
XIE HAIYAN

Assignees

国营芜湖机械厂
成都佳驰电子科技股份有限公司

Dates

Publication Date: 20260505
Application Date: 20260331

Claims (10)

1. A method of chamfering a planar coating, comprising: Determining preset parameters of a planar coating of a workpiece, wherein the preset parameters at least comprise a chamfer width L and a chamfer thickness H of the planar coating, and the workpiece comprises a substrate and the planar coating arranged on the substrate; Positioning the surface of the substrate and the planar coating on the substrate along a first direction; positioning the edge of the planar coating along a second direction, wherein the second direction is perpendicular to the first direction; And cutting and chamfering the edge of the planar coating according to the preset parameters.
2. The chamfering method of a planar coating according to claim 1, characterized in that the chamfer width is 2.25mm to 4.55mm, and the chamfer thickness h=h 0 -0.05mm, H 0 is the thickness of the planar coating actually measured.
3. The method for chamfering planar coating according to claim 2, wherein chamfering the planar coating by chamfering means, the positioning of the substrate and the planar coating on the substrate along the surface of the first direction, comprises: attaching a base side bearing of the chamfering device to the base along the first-side surface, the axis of the base side bearing being parallel to the surface of the base; The coating side bearing of the chamfering device is attached to a surface of the planar coating in the first direction, and an axis of the coating side bearing is parallel to the surface of the planar coating.
4. A method of chamfering a planar coating as recited in claim 3, wherein said repositioning an edge of said planar coating in a second direction comprises: And attaching the guide piece of the chamfering device to the edge of the planar coating along the second direction, wherein the extending direction of the guide piece is parallel to the edge of the planar coating.
5. The chamfering method of a planar coating according to claim 4, characterized in that said cutting chamfering of edges of said planar coating according to said preset parameters comprises: starting the chamfering device, and setting the motor rotating speed of the chamfering device to be 150 RPM-300 RPM; And (3) uniformly propelling the chamfering device along the extending direction of the guide plate, chamfering the plane coating by a cutter head of the chamfering device, wherein the propelling speed is 5-12 mm/s.
6. The method of chamfering a planar coating according to claim 5, characterized in that the bevel angle θ of the tool bit satisfies θ=arcsin (H/L), L is a chamfer width, and H is a chamfer thickness.
7. The chamfering method of a planar coating according to claim 5, characterized in that a safety gap h between the cutter head and the base body is 0.04 mm to 0.05mm.
8. The chamfering method of a planar coating according to any one of claims 1 to 7, characterized in that, after cutting chamfering of an edge of the planar coating according to the preset parameters, the method further comprises: And detecting the chamfer angle, chamfer width, surface damage of the substrate and surface damage of the planar coating.
9. The method of chamfering a planar coating according to claim 8, characterized in that the deviation of the chamfer angle is not more than + -0.5 degrees, the deviation of the chamfer width is not more than + -0.1 mm.
10. The method of chamfering a planar coating according to claim 8, characterized in that said detecting surface damage of said substrate and surface damage of said planar coating comprises: and detecting the surface quality of the substrate and the planar coating by adopting a magnifying glass with the magnification of more than or equal to 10 times.

Description

Chamfering method for planar coating Technical Field The application relates to the technical field of coating surface processing, in particular to a chamfering method of a planar coating. Background Planar coatings have a wide range of applications where chamfering of the planar coating is required. The chamfering processing of the current planar coating mainly adopts the following modes: firstly, a manual polishing method comprises the steps that an operator polishes the edges of the coating by using tools such as sand paper, files and the like, and the chamfering angle and the chamfering width are required to be controlled by experience; And secondly, the common mechanical polishing method is to cut the edge of the coating by using equipment such as an angle grinder, a small grinding wheel machine and the like through manual operation. The method has no standardized parameter control flow, and the chamfering effects of workpieces processed by different operators/equipment are obviously different, so that the consistency of chamfering quality is poor. Disclosure of Invention The embodiment of the application aims to provide a chamfering method for a planar coating, which can realize high-precision and low-damage chamfering of the edge of the planar coating. In one aspect of the embodiment of the application, a chamfering method for a planar coating is provided, which comprises the following steps: Determining preset parameters of a planar coating of a workpiece, wherein the preset parameters at least comprise a chamfer width L and a chamfer thickness H of the planar coating, and the workpiece comprises a substrate and the planar coating arranged on the substrate; Positioning the surface of the substrate and the planar coating on the substrate along a first direction; positioning the edge of the planar coating along a second direction, wherein the second direction is perpendicular to the first direction; And cutting and chamfering the edge of the planar coating according to the preset parameters. Optionally, the chamfer width is 2.25 mm-4.55 mm, and the chamfer thickness h=h 0-0.05mm, H0 is the thickness of the planar coating actually measured. Optionally, chamfering the planar coating by a chamfering device, wherein the positioning of the substrate and the planar coating on the substrate along the surface of the first direction comprises: attaching a base side bearing of the chamfering device to the base along the first-side surface, the axis of the base side bearing being parallel to the surface of the base; The coating side bearing of the chamfering device is attached to a surface of the planar coating in the first direction, and an axis of the coating side bearing is parallel to the surface of the planar coating. Optionally, the positioning the edge of the planar coating along the second direction further includes: And attaching the guide piece of the chamfering device to the edge of the planar coating along the second direction, wherein the extending direction of the guide piece is parallel to the edge of the planar coating. Optionally, the cutting chamfering is performed on the edge of the planar coating according to the preset parameters, including: starting the chamfering device, and setting the motor rotating speed of the chamfering device to be 150 RPM-300 RPM; And (3) uniformly propelling the chamfering device along the extending direction of the guide plate, chamfering the plane coating by a cutter head of the chamfering device, wherein the propelling speed is 5-12 mm/s. Optionally, the bevel angle θ of the tool bit satisfies θ=arcsin (H/L), L is the chamfer width, and H is the chamfer thickness. Optionally, a safety gap h between the cutter head and the substrate is 0.04 mm-0.05 mm. Optionally, after the edge of the planar coating is cut and chamfered according to the preset parameters, the method further includes: And detecting the chamfer angle, chamfer width, surface damage of the substrate and surface damage of the planar coating. Optionally, the deviation of the chamfer angle is less than or equal to +/-0.5 degrees, and the deviation of the chamfer width is less than or equal to +/-0.1 mm. Optionally, the detecting the surface damage of the substrate and the surface damage of the planar coating includes: and detecting the surface quality of the substrate and the planar coating by adopting a magnifying glass with the magnification of more than or equal to 10 times. According to the chamfering method for the planar coating, provided by the embodiment of the application, the high-precision and low-damage chamfering of the edge of the planar coating is realized by utilizing the diameter difference of the substrate bearing and the coating bearing and the dual positioning mode of the guide piece through parameter setting, positioning constraint, automatic cutting and quality checking processes. By adopting the chamfering method, the chamfering precision of the planar coating can be obviously im