CN-121973077-A - Polishing device and polishing method for sealing surface of high-precision ceramic dielectric window

CN121973077ACN 121973077 ACN121973077 ACN 121973077ACN-121973077-A

Abstract

The invention discloses a polishing device and a polishing method for a sealing surface of a high-precision ceramic dielectric window, and aims to provide a polishing device and a polishing method for the sealing surface of the high-precision ceramic dielectric window, which can effectively improve the polishing efficiency, polishing uniformity and polishing quality of the sealing surface of the ceramic dielectric window. The grinding and polishing assembly comprises a base, at least three supports, a grinding and polishing assembly and a sensor, wherein the base is fixed on a rotating platform of a numerical control machine tool, a centering column is arranged on the base, a screw rod which is coaxially distributed and a clamping nut matched with the screw rod are arranged on the centering column, a center through hole is formed in the center of a clamping cover plate, the screw rod penetrates through the center through hole, the supports are uniformly distributed around the circumference of the centering column, the tops of the supports are provided with adjusting bolts parallel to the centering column, the grinding and polishing assembly comprises a handle part, a grinding and polishing head and the sensor, the handle part comprises a mounting handle, a telescopic handle which is connected onto the mounting handle in a sliding mode, a spring which drives the telescopic handle to extend out, and the sensor is arranged at the end part of the telescopic handle and used for detecting the pressure born by the spring.

Inventors

LIN XIN
YAO XIANGMIN
CAI DEQI
MA YUQI
LIU YUPENG

Assignees

杭州大和江东新材料科技有限公司

Dates

Publication Date: 20260505
Application Date: 20251126

Claims (10)

1. The utility model provides a burnishing device of high-accuracy ceramic dielectric window sealed face which characterized in that, including location frock and grinding and polishing subassembly, the location frock includes: The base is fixed on a rotating platform of the numerical control machine tool, a centering column coaxial with a rotating shaft of the rotating platform is arranged on the base, and a screw rod and a clamping nut matched with the screw rod are coaxially distributed on the centering column; a clamping cover plate, a middle through hole is arranged in the center, the screw rod passes through the middle through hole; at least three supports uniformly distributed around the circumference of the centering column, wherein the supports are directly or indirectly fixed on the rotary platform, and the top of each support is provided with an adjusting bolt parallel to the centering column; the polishing assembly comprises: the handle comprises a mounting handle, a telescopic handle which is connected to the mounting handle in a sliding manner and a spring which drives the telescopic handle to extend out; the grinding and polishing head is arranged at the end part of the telescopic handle; And a sensor for detecting the pressure applied to the spring.
2. The polishing device for the sealing surface of the high-precision ceramic dielectric window according to claim 1, wherein the base is detachably fixed on the rotary platform by a bolt or a magnetic attraction mode, and the support is detachably fixed on the rotary platform by a bolt or a magnetic attraction mode.
3. The polishing device for the sealing surface of the high-precision ceramic dielectric window according to claim 1, wherein the base is detachably fixed on the rotary platform by a bolt or a magnetic attraction mode, and the support is fixed on the base by a bolt or a welding mode, so that the support is fixed on the rotary platform.
4. A polishing device for a sealing surface of a high-precision ceramic dielectric window according to claim 1, 2 or 3, wherein the centering column is detachably fixed on the base through bolts or threads, a screw hole is formed in the end face of the centering column, and a screw rod is connected in the screw hole.
5. A polishing apparatus for sealing surfaces of high precision ceramic dielectric windows according to claim 1, 2 or 3, wherein the clamping cover plate comprises a central plate and a plurality of pressing rods extending from the edges of the central plate, the pressing rods extending in the radial direction of the screw rods.
6. A polishing apparatus for a sealing surface of a high-precision ceramic dielectric window according to claim 1, 2 or 3, wherein the adjusting bolt is provided with a lock nut.
7. A polishing device for a sealing surface of a high-precision ceramic dielectric window according to claim 1, 2 or 3, wherein one end of the mounting handle is provided with a guide hole, the telescopic handle is slidably arranged in the guide hole, the spring is positioned between the bottom surface of the guide hole and the telescopic handle, and the sensor is positioned between the spring and the bottom surface of the guide hole.
8. A polishing method for a sealing surface of a high-precision ceramic dielectric window is characterized by using the polishing device for the sealing surface of the high-precision ceramic dielectric window according to any one of claims 1 to 7, and is characterized by comprising the following steps, The method comprises the following steps of S1, fixing a ceramic dielectric window through a positioning tool, wherein the ceramic dielectric window is supported on each adjusting bolt, and matching a center column with a round hole at the bottom of the ceramic dielectric window to enable the ceramic dielectric window to be coaxial with the center column; the grinding and polishing assembly is mounted on a main shaft of the numerical control machine tool through a mounting handle; S2, the main shaft drives the grinding and polishing assembly to move, so that the grinding and polishing head is propped against the sealing surface of the ceramic dielectric window; and S3, the main shaft drives the grinding and polishing head to rotate, and the rotary platform drives the ceramic dielectric window to rotate, so that the sealing surface of the ceramic dielectric window is polished.
9. The method for polishing a sealing surface of a high-precision ceramic dielectric window according to claim 8, further comprising, between steps S1 and S2: s11, detecting the plane runout of the sealing surface of the ceramic dielectric window through a dial indicator or a dial indicator, and executing the step S2 downwards if the plane runout of the sealing surface is within a set range; If the plane runout of the sealing surface exceeds the set range, loosening the clamping nut, adjusting the sealing surface by rotating the adjusting bolt, locking the clamping nut, and returning to S11 until the plane runout of the sealing surface is within the set range.
10. The method for polishing a sealing surface of a high-precision ceramic dielectric window according to claim 8, further comprising, between steps S2 and S3: S21, detecting the pressure born by the spring through a sensor, so that the pressure of the polishing head acting on the sealing surface of the ceramic dielectric window reaches a set value; and S3, detecting the pressure received by the spring in real time through the sensor, and when the pressure detected by the sensor exceeds a set range, driving the grinding and polishing head to ascend or descend by the main shaft of the numerical control machine tool so as to keep the pressure detected by the sensor within the set range.

Description

Polishing device and polishing method for sealing surface of high-precision ceramic dielectric window Technical Field The invention relates to the technical field of high-precision ceramic dielectric window processing, in particular to a polishing device and a polishing method for a sealing surface of a high-precision ceramic dielectric window. Background The semiconductor industry has a complex industry chain, and from upstream to downstream, there are industries of materials and equipment, chip design, chip manufacturing, chip product encapsulation, and the like. In the actual manufacturing process of the chip, the difference is caused by different materials and processes, so that a photoetching machine and an etching machine are needed. Among them, etching is a very important step in microelectronic IC manufacturing processes and micro-nano manufacturing processes as a semiconductor manufacturing process, and is a main process of patterning associated with photolithography. Etchers are the most critical equipment other than lithography machines, with a unit price of about $200 ten thousand, and one wafer factory requires 40-50 etchers. The plasma etching machine equipment mainly comprises a pre-vacuum chamber, an etching cavity, an air supply system and a vacuum system. The main components of the etching cavity comprise a plasma coupling coil, a ceramic dielectric window, an ICP radio frequency unit, an RF radio frequency unit, a lower electrode system, a temperature control system and the like, wherein the ceramic dielectric window is positioned between the cavity and the plasma coupling coil, so that vacuum can be sealed, and plasma can not be influenced to pass through the cavity. With the development of the semiconductor industry, the market demand of the ceramic dielectric window is gradually increased, so that the ceramic dielectric window has great demands in the market of the semiconductor industry. The ceramic dielectric window is mostly in a large-size hemispherical shape or a conical shape, a round hole is formed in the bottom of the ceramic dielectric window, a circle of annular flange is formed at the edge of the opening of the ceramic dielectric window, one side, facing the opening of the ceramic dielectric window, of the annular flange is a sealing surface, and the sealing surface has the surface requirement with the roughness Ra0.4 or lower so as to meet the sealing requirement. For example, chinese patent publication No. CN114188210a, entitled surface treatment method for an etched cavity interior deposition surface for a metal etching machine, includes processing an inner surface of a ceramic dielectric window to reduce roughness of a sealing surface between the ceramic dielectric window and a cavity cover to R0.4 or less. The traditional polishing process of the sealing surface of the ceramic dielectric window adopts manual polishing, which has the problems of low production efficiency, uneven polishing and difficult control of polishing quality, and simultaneously has the problem of damage to the ceramic dielectric window caused by collision due to human factors in the manual polishing process. Disclosure of Invention The invention aims to provide a polishing device and a polishing method for a sealing surface of a high-precision ceramic dielectric window, which can effectively improve the polishing efficiency, polishing uniformity and polishing quality of the sealing surface of the ceramic dielectric window, thereby effectively solving the problems that the polishing efficiency is low, the polishing quality is difficult to control and the polishing is easy to collide with the sealing surface of the ceramic dielectric window. The technical scheme of the invention is as follows: the utility model provides a burnishing device of high-accuracy ceramic dielectric window sealed face, includes location frock and grinds throwing subassembly, and location frock includes: The base is fixed on a rotating platform of the numerical control machine tool, a centering column coaxial with a rotating shaft of the rotating platform is arranged on the base, and a screw rod and a clamping nut matched with the screw rod are coaxially distributed on the centering column; a clamping cover plate, a middle through hole is arranged in the center, the screw rod passes through the middle through hole; at least three supports uniformly distributed around the circumference of the centering column, wherein the supports are directly or indirectly fixed on the rotary platform, and the top of each support is provided with an adjusting bolt parallel to the centering column; the polishing assembly comprises: the handle comprises a mounting handle, a telescopic handle which is connected to the mounting handle in a sliding manner and a spring which drives the telescopic handle to extend out; the grinding and polishing head is arranged at the end part of the telescopic handle; and a sensor for detecting the pressure applie