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CN-121973118-A - Semiconductor Batwing three-dimensional detection fixing device

CN121973118ACN 121973118 ACN121973118 ACN 121973118ACN-121973118-A

Abstract

The invention discloses a semiconductor Batwing three-dimensional detection fixing device which comprises a device bottom plate, wherein an X-axis sliding module is arranged on the device bottom plate along the length direction of the device bottom plate, two synchronous-movement compression units are arranged on the X-axis sliding module in a sliding and adjusting mode, an adjusting compression section is respectively arranged in the two compression units, and the compression units comprise a Y-axis moving compression assembly arranged along the X-axis sliding module in a sliding mode and a Z-axis adjusting assembly arranged on the Y-axis moving compression assembly in an adjusting mode. The three-dimensional detection fixing device for the semiconductor Batwing can realize rapid clamping operation of the semiconductor Batwing, and the compression units synchronously realize balanced compression of two sides of the semiconductor Batwing, so that product distortion caused by inconsistent clamping forces of two sides is effectively avoided. The clamping space adjusting type design meets the clamping requirements of different products, can meet the clamping and fixing requirements of the semiconductor Batwing products of the same type and different specifications, has good universality and improves the production efficiency.

Inventors

  • Diao Yiqing
  • YUE QIMING
  • XIE RUYING
  • WANG LING
  • Yue Zhongcong

Assignees

  • 杭州大和热磁电子有限公司

Dates

Publication Date
20260505
Application Date
20251226

Claims (10)

  1. 1. The semiconductor Batwing three-dimensional detection fixing device comprises a device bottom plate (1) and is characterized in that an X-axis sliding module (2) is arranged on the device bottom plate (1) along the length direction of the device bottom plate, two synchronous movement compressing units (6) are arranged on the X-axis sliding module (2) in a sliding adjusting mode, adjusting compressing sections are respectively arranged inside the two compressing units (6), and the compressing units (6) comprise a Y-axis moving compressing assembly (3) arranged along the X-axis sliding module (2) in a sliding mode and a Z-axis adjusting assembly (4) arranged on the Y-axis moving compressing assembly (3) in an adjusting mode.
  2. 2. The three-dimensional detection and fixing device for the semiconductor Batwing according to claim 1, wherein the X-axis sliding module (2) comprises an X-axis sliding rail (21) and two X-axis sliding blocks (22) which are arranged on the X-axis sliding rail (21) in a sliding mode, or the X-axis sliding module (2) comprises the X-axis sliding rail (21), the X-axis sliding blocks (22) which are arranged on the X-axis sliding rail (21) in a sliding mode and a positive and negative rotation screw transmission assembly (24).
  3. 3. The three-dimensional semiconductor Batwing detection fixing device according to claim 1 or 2, wherein the Y-axis moving and pressing assembly (3) comprises a Y-axis moving and supporting positioning piece (31) and a pressing device (5), and the Y-axis moving and supporting positioning piece (31) is symmetrically arranged in parallel with two groups.
  4. 4. The three-dimensional detection and fixation device for the semiconductor Batwing according to claim 3 is characterized in that a device bottom plate T-shaped groove (11) is formed in the device bottom plate (1), the device bottom plate T-shaped groove (11) is parallel to the X-axis sliding module (2), and a locking and fixation hole (36) for fixedly connecting the Y-axis movement support positioning piece (31) with the device bottom plate T-shaped groove (11) is formed in the Y-axis movement support positioning piece (31).
  5. 5. The three-dimensional detection and fixation device for the semiconductor Batwing according to claim 3 is characterized in that the Y-axis movable supporting and positioning piece (31) comprises a Y-direction sliding plate (32) horizontally arranged along the Y direction and a Z-direction adjusting plate (33) vertically connected with the Y-direction sliding plate (32), a dovetail groove (34) is formed in the Y-direction sliding plate (32), and the Z-direction adjusting plate (33) is connected with the X-axis sliding module (2) through a connecting seat (7).
  6. 6. The three-dimensional semiconductor Batwing detection fixing device according to claim 5 is characterized in that the pressing device (5) comprises a pressing device fixing seat (51), a pressing screw (52) arranged on the pressing device fixing seat (51), a pressing device adjusting plate (53) crossing two pressing units and two clamping pressing plates (54) connected with the pressing device adjusting plate in a moving adjusting mode, the clamping pressing plates (54) are in sliding limiting connection with the Y-direction sliding plate (32), a supporting pressing section is formed between the clamping pressing plates (54) and the Z-direction adjusting plate (33), and the Z-axis adjusting assembly (4) is arranged on the Z-direction adjusting plate in a height adjusting mode.
  7. 7. The three-dimensional detection fixing device for the semiconductor Batwing according to claim 6 is characterized in that the pressing device fixing seat (51) is arranged on a device base plate (1) between two Y-axis movement supporting locating pieces (31), a fixing seat sliding groove (57) is formed in the bottom of the pressing device fixing seat (51) along the Y direction, the pressing device adjusting plate (53) is slidably arranged in the fixing seat sliding groove (57), the pressing screw (52) is in threaded transmission connection with the pressing fixing seat (51), the end portion of the pressing screw (52) is abutted to the center position of the pressing device adjusting plate (53), a pair of waist-shaped adjusting grooves (56) are symmetrically formed in the pressing device adjusting plate (53) along the length direction, and the two clamping pressing plates (54) are adjustably fixed in the waist-shaped adjusting grooves (56) and are driven to synchronously move through the pressing device adjusting plate (53).
  8. 8. The three-dimensional detection fixing device for the semiconductor Batwing is characterized in that the Y-axis movable supporting and positioning piece (31) is connected with the X-axis sliding block (22) through a supporting seat (37), the Y-axis movable supporting and positioning piece (31) comprises a U-shaped support, an opening of the U-shaped support is upwards arranged on the supporting seat (37) in a Y-direction adjusting mode, the Z-axis adjusting component (4) is arranged on the supporting seat (37) in an adjusting mode, the Z-axis adjusting component (4) comprises a Z-direction adjusting cushion block (41) and a lateral limiting block (43), an inclined limiting surface (412) is arranged on the Z-direction adjusting cushion block (41), and the inclined limiting surfaces (412) on the two groups of Z-direction adjusting cushion blocks (41) are oppositely arranged to form a supporting compression section.
  9. 9. The three-dimensional detection and fixation device for the semiconductor Batwing according to claim 3 is characterized in that the pressing device (5) comprises a synchronous pressing shaft (5-1), two synchronous pressing rods (5-2) connected with the synchronous pressing shaft (5-1), and a cam pressing block (5-3) connected with the synchronous pressing rods (5-2) and rotatably arranged on a U-shaped bracket, and the synchronous pressing rods (5-2) are connected and positioned with the U-shaped bracket through a support fixing clamp (5-5) with a quick adjusting piece (5-4).
  10. 10. The three-dimensional semiconductor Batwing detection fixing device according to claim 1or2 is characterized in that a rotary disk (10) is embedded in the center of the lower plate surface of the device bottom plate (1).

Description

Semiconductor Batwing three-dimensional detection fixing device Technical Field The invention relates to the technical field of semiconductor detection, in particular to a semiconductor Batwing three-dimensional detection fixing device. Background The semiconductor Batwing (batwing U-shaped piece) product is mainly used for a semiconductor rotating mechanical arm supporting area, and is made of 6061-T6 series aluminum alloy. The semiconductor Batwing needs to have high flatness, verticality, and the like during use. At present, the flatness, verticality and the like of a semiconductor Batwing are detected by mainly clamping a semiconductor Batwing product on a tool, horizontally placing the semiconductor Batwing product on a three-dimensional marble platform surface, clamping two sides of a semiconductor Batwing, and detecting the semiconductor by a detection tool. The existing detection fixing device is complex in action, inconvenient to operate, unsynchronized in pressing force on two sides, distorted in products, unadjustable in space between clamping devices, large in limitation and not universal. In the prior art, for example, CN 214066743U discloses a U-shaped hanging ring strength detection device, and CN 212111075U discloses a device for rapidly detecting burrs on the inner wall of a U-shaped pipe. However, the above solutions cannot realize the fixation of three-dimensional detection of the semiconductor Batwing (batwing U-shaped member) product. Disclosure of Invention The invention aims to solve the problems that the existing detection fixing device is complex in action, inconvenient to operate, asynchronous in pressing force on two sides, and capable of realizing the design of the universality of U-shaped parts with Batwing batwing of the same type, and the like, and the space between the pressing units is not adjustable, so that the three-dimensional detection fixing device for the semiconductor Batwing can realize quick clamping, is convenient to operate, and can realize synchronous clamping of the pressing units on two sides, effectively avoid the generation of the twisting force of the product, and can realize the design of the universality of U-shaped parts with Batwing batwing of the same type. The technical scheme includes that the three-dimensional detection and fixing device for the semiconductor Batwing comprises a device bottom plate, an X-axis sliding module is arranged on the device bottom plate along the length direction of the device bottom plate, two synchronous-motion compression units are arranged on the X-axis sliding module in a sliding and adjusting mode, an adjusting compression section is respectively arranged inside the two compression units, and the compression units comprise a Y-axis moving compression assembly arranged along the X-axis sliding module in a sliding mode and a Z-axis adjusting assembly arranged on the Y-axis moving compression assembly in an adjusting mode. This semiconductor Batwing cubic unit detects fixing device to through setting up X axle slip module on a horizontal bottom plate to can slide the setting two synchronous motion's that adjust the unit that compresses tightly on X axle slip module, and set up the interval that compresses tightly on compressing tightly the unit, and compress tightly the interval and can adjust according to the size specification of semiconductor Batwing product, realized the commonality design of device, can realize through the Y axle removal and compress tightly the subassembly and press from both sides fast along Y to pressing from both sides to semiconductor Batwing product, both sides compress tightly the unit and realize the balanced packing of semiconductor Batwing both sides in step, effectively avoided the emergence of the product distortion phenomenon that the inconsistent clamping force leads to of both sides. The space size of the compression section in the Z direction can be realized through the Z direction adjusting component, so that the adjustment of the clamping height position of the semiconductor Batwing can be realized, the clamping requirements of different products are met, the device is convenient to operate, the compression fixing precision is high, the accurate detection of the semiconductor Batwing can be realized by matching with a three-dimensional detection platform, and the production efficiency is greatly improved. Preferably, the X-axis sliding module comprises an X-axis sliding rail and two X-axis sliding blocks arranged on the X-axis sliding rail in a sliding manner, or the X-axis sliding module comprises an X-axis sliding rail, an X-axis sliding block arranged on the X-axis sliding rail in a sliding manner and a forward and reverse rotation screw rod transmission assembly. The X-axis sliding module adopts a linear sliding module, can adopt manual sliding operation, can also adopt automatic sliding operation, for example can adopt a bilateral symmetry sliding module, and specifically can