CN-121973119-A - Semiconductor furnace section of thick bamboo adds clamping apparatus

CN121973119ACN 121973119 ACN121973119 ACN 121973119ACN-121973119-A

Abstract

The invention discloses a semiconductor furnace cylinder processing clamp, which relates to the technical field of semiconductor furnace cylinder processing, and comprises a jacking component arranged at two ends of a furnace cylinder, wherein the jacking component is sleeved on a mandrel in the furnace cylinder, and a pushing block is sleeved on the outer side end of the jacking component on the mandrel; the jacking component comprises a jacking plate, a buffering jacking structure is circumferentially arranged at the edge of the jacking plate, a pressing component is arranged on the inner side surface of the jacking plate, and the pressing component is connected with a jacking bag in the furnace barrel. The invention can realize uniform propping of the inner wall of the furnace cylinder in the length direction, effectively avoid the occurrence of local deformation, obviously improve the processing quality and the finish of the inner wall of the furnace cylinder, effectively prevent the left-right offset dislocation of the propping plate in the axial direction, and ensure the coaxiality of the clamp and the furnace cylinder, thereby obviously improving the stability of the processing process.

Inventors

LIU JIAXIN
WANG YU
YU HAO
Li tianpu
XIE RUYING

Assignees

杭州大和热磁电子有限公司

Dates

Publication Date: 20260505
Application Date: 20251230

Claims (10)

1. A semiconductor furnace tube processing clamp is characterized in that, The furnace tube furnace comprises a jacking assembly arranged at two ends of a furnace tube, wherein the jacking assembly is sleeved on a mandrel in the furnace tube, and a pushing block is sleeved on the outer side end of the jacking assembly on the mandrel; the jacking component comprises a jacking plate, a buffering jacking structure is circumferentially arranged at the edge of the jacking plate, a pressing component is arranged on the inner side surface of the jacking plate, and the pressing component is connected with a jacking bag in the furnace barrel.
2. The semiconductor furnace tube processing clamp according to claim 1, wherein the jacking components are arranged at openings at two ends of the furnace tube, the buffering jacking structures are circumferentially and uniformly arranged in the edges of the jacking plates, and the buffering jacking structures are abutted against the inner wall of the furnace tube.
3. The semiconductor furnace tube processing clamp according to claim 1, wherein the buffering and propping structure comprises a propping block, a guide inclined surface is arranged on the inner side of the top end of the propping block, the guide inclined surface is arranged in a downward inclined mode, a mounting groove is formed in the upper surface of the propping block, and a buffering bag is arranged in the mounting groove.
4. The semiconductor furnace tube processing clamp according to claim 1, wherein a first buffer groove is formed in the edge of the tightening plate, the inner side wall of the first buffer groove is lower than the outer side wall of the first buffer groove, the tightening block is arranged in the first buffer groove, and buffer liquid is filled in the first buffer groove.
5. The semiconductor furnace processing fixture of claim 4, wherein the inner end of the first buffer slot is provided with a second buffer slot in communication, the inner end of the first buffer slot is provided with a reset block, and the reset block extends into the second buffer slot.
6. A semiconductor furnace processing clamp according to claim 1 or 2, wherein the inner side of the tightening plate is provided with a compression groove, the compression assembly is arranged in the compression groove, the inner side wall of the compression groove is provided with a mounting block, and the compression assembly comprises a telescopic rod.
7. A semiconductor furnace processing clamp according to claim 1 or 2, wherein the mandrel is provided with a limiting seat near the tightening plate, the mandrel is movably sleeved with a movable ring between the limiting seat and the tightening plate, and the limiting seat is arranged in the circumferential direction of the mandrel.
8. The semiconductor furnace processing jig according to claim 6, wherein one end of the telescopic rod is hinged to the mounting block, the other end is hinged to the moving ring, and the mandrel is screwed with the pushing block.
9. The semiconductor furnace tube processing clamp according to claim 6, wherein the tightening bag is sleeved on the mandrel, the tightening bag is abutted against the inner wall of the furnace tube, and the mandrel is movably sleeved with compression rings at two ends of the tightening bag.
10. The semiconductor furnace tube processing clamp according to claim 9, wherein the telescopic rod is hinged with a push rod, one end of the push rod is hinged with the telescopic rod, and the other end of the push rod is hinged with the compression ring.

Description

Semiconductor furnace section of thick bamboo adds clamping apparatus Technical Field The invention relates to the technical field of semiconductor furnace processing, in particular to a semiconductor furnace processing clamp. Background With the rapid development of the semiconductor industry, the requirements on the smoothness and cleanliness of the inner wall of the cavity of the semiconductor furnace cylinder are increasingly stringent. In the furnace cylinder processing process, the inner wall is required to be tightly propped for preventing the deformation. However, the prior art clamps suffer from a number of disadvantages. On the one hand, the furnace cylinder inner wall can not be comprehensively propped up, only partial areas can be propped up, so that the propping up effect is not ideal, and the high-precision processing requirement is difficult to meet. On the other hand, in the jacking operation, the condition of left-right offset dislocation is extremely easy to appear in the clamp, and the coaxiality with the furnace cylinder cannot be ensured. The method not only affects the processing quality, but also can cause damage to the furnace barrel, increase the production cost and restrict the further development of the semiconductor industry. The patent publication No. CN115870374A, publication No. 2023, no. 03 and No. 31, discloses a rounding tool, which comprises a supporting disc, a rotating shaft, a transmission disc, a supporting disc and a driving device, wherein the rotating shaft is arranged on the supporting disc, the transmission disc is in rotating fit with the rotating shaft, a plurality of driving sliding grooves distributed outside the rotating shaft are formed in the transmission disc, the distance between the first end of each driving sliding groove and the rotating shaft is gradually increased in the direction from the first end to the second end of each driving sliding groove, the first end of each supporting rod is in sliding fit with the corresponding driving sliding groove, the second end of each supporting rod is used for propping against a cylinder to be braced, the supporting rods are in one-to-one correspondence with the driving sliding grooves, and the driving device is arranged on the supporting disc and used for driving the transmission disc to rotate. The rounding tool is complex in structure and cannot realize full rounding in the length direction of the furnace cylinder. Disclosure of Invention The invention provides a semiconductor furnace tube processing clamp, which is used for uniformly propping the inner wall of a furnace tube in the length direction by arranging a propping assembly and a propping bag so as to prevent local deformation. It is a further object of the present invention to provide a pressing assembly that prevents misalignment of the pressing plate in the axial direction, thereby improving the machining stability. The technical scheme is that the semiconductor furnace tube processing clamp comprises propping assemblies arranged at two ends of a furnace tube, wherein the propping assemblies are sleeved on a mandrel in the furnace tube, a pushing block is sleeved on the outer side end of each propping assembly on the mandrel, each propping assembly comprises a propping plate, a buffering propping structure is circumferentially arranged at the edge of each propping plate, a pressing assembly is arranged on the inner side face of each propping plate, and each pressing assembly is connected with a propping bag in the furnace tube. Preferably, the jacking components are arranged at openings at two ends of the furnace cylinder, the buffer jacking structures are circumferentially and uniformly arranged in the edges of the jacking plates, and the buffer jacking structures are abutted against the inner wall of the furnace cylinder. The tight subassembly in top is tight to stove section of thick bamboo both ends opening inner wall, pushes gradually the tight board in pushing away the stove section of thick bamboo by the ejector pad, carries out the tight to stove section of thick bamboo inner wall, and the axis of dabber and the axis coincidence setting of stove section of thick bamboo, buffering tight structure is provided with a plurality of, evenly sets up in the border of tight board in top. The jacking force is uniformly distributed, the processing quality and the smoothness of the inner wall of the furnace cylinder are further improved, and the local deformation is effectively prevented. Preferably, the buffering and jacking structure comprises a jacking block, wherein a guide inclined plane is arranged on the inner side of the top end of the jacking block, the guide inclined plane is arranged in a downward inclined mode, the upper surface of the jacking block is provided with a mounting groove, and a buffering bag is arranged in the mounting groove. The upper surface of the jacking block is an arc-shaped jacking surface, and the buffer bag is an air b