CN-121973134-A - Disassembling and assembling device and disassembling and assembling method for internal components of semiconductor vacuum equipment

Abstract

The invention discloses a dismounting device and a dismounting method for internal parts of semiconductor vacuum equipment, wherein the dismounting device adopts mirror polishing treatment and comprises a device shell, a transmission lifting mechanism in transmission connection with the device shell and a fixing mechanism in transmission connection with the transmission lifting mechanism, wherein a dismounting and replacing type mounting head is arranged on the fixing mechanism, and a movable adjusting type clamping and positioning assembly is arranged on the device shell. This inside part dismouting device of semiconductor vacuum equipment can be applicable to the environment of Class 1 clean room, can realize the steady efficient installation and taking out to vacuum equipment interference fit part, has guaranteed the stability and the position accuracy of device, and dismouting process atress is even, disassembles the convenience, can guarantee that cavity or core part can not receive the destruction, can adapt to the equipment requirement of vacuum equipment high cleanliness, high reliability, has effectively solved the problem that electronic frock environment suitability is poor, simple and easy frock goes up and down unstability.

Inventors

• LIU JINDONG
• ZHANG XIANG
• LIU LIJIAN
• JIN HONGXIN
• XIE RUYING

Assignees

• 杭州大和热磁电子有限公司

Dates

Publication Date

20260505

Application Date

20251222

Claims (10)

1. 1. The dismounting device for the internal parts of the semiconductor vacuum equipment is characterized by adopting mirror polishing treatment and comprising a device shell (1), a transmission lifting mechanism (2) in transmission connection with the device shell and a fixing mechanism (3) in transmission connection with the transmission lifting mechanism (2), wherein a dismounting and replacing type mounting head (5) is arranged on the fixing mechanism (3), and a movable adjusting type clamping and positioning assembly (4) is arranged on the device shell (1).
2. 2. The device for assembling and disassembling the internal parts of the semiconductor vacuum equipment according to claim 1, wherein a shell transmission seat (12) and an end pressing ring (13) are arranged on the shell (1) of the device.
3. 3. The apparatus for removing and installing parts inside a semiconductor vacuum apparatus according to claim 2, wherein the end pressure ring (13) is provided with a housing limit groove (14), and an annular gasket (15) made of PTFE is provided on an end surface of the end pressure ring (13).
4. 4. The apparatus for removing and installing parts inside a semiconductor vacuum apparatus according to claim 3, wherein the clamping and positioning assembly (4) is movably clamped on the housing limiting groove (14), the clamping and positioning assembly (4) comprises a plurality of C-shaped clamps (41), a U-shaped pad (42) made of PTFE material is arranged at one end of the C-shaped clamps (41), and a locking and positioning assembly (43) is arranged at the other end of the C-shaped clamps.
5. 5. The apparatus for removing and installing parts inside a semiconductor vacuum apparatus according to any one of claims 1 to 4, wherein the drive lifting mechanism (2) comprises a drive handle (21) and a screw drive assembly (22) connected to the drive handle (21).
6. 6. The assembly and disassembly device for the internal components of the semiconductor vacuum equipment according to claim 5, wherein the screw transmission assembly (22) comprises a rotary disk (221) and a transmission screw (222), the transmission screw (222) is arranged at the center of the rotary disk (221), and the transmission handles (21) are symmetrically arranged on the side edges of the rotary disk (221) along the radial direction of the rotary disk (221).
7. 7. The assembly and disassembly device for the internal components of the semiconductor vacuum equipment according to claim 5, wherein the fixing mechanism (3) is arranged at the lower end of the screw transmission assembly (22), the fixing mechanism (3) comprises a fixing seat (31) and a fixing seat connecting piece (32), and a quick connection structure (35) is arranged on the fixing seat (31).
8. 8. The assembly and disassembly device for the internal components of the semiconductor vacuum equipment according to claim 7, wherein a pressure sensor (7) is arranged between the transmission screw rod (222) and the fixed seat (31), a pressure display screen (8) is arranged on the rotating disc (221), and a universal level meter (223) is arranged at the center of the rotating disc (221).
9. 9. The apparatus for removing and installing an internal part of a semiconductor vacuum apparatus according to any one of claims 1 to 4, wherein said mounting head (5) comprises a plurality of types of crimping members and a plurality of types of withdrawing members.
10. 10. A method for assembling and disassembling the semiconductor vacuum equipment internal component assembling and disassembling device according to any one of claims 1 to 9, comprising the steps of: S1, selecting an installation head and installing the installation head on a fixed seat; s2, installing a dismounting device at the part to be dismounted, adjusting the position of the clamping positioning assembly and fixing; s3, aligning the mounting head to the component to be dismounted and leveling; and S4, driving the mounting head to lift by the transmission lifting mechanism to realize the disassembly and assembly aiming at the part to be disassembled and assembled.

Description

Disassembling and assembling device and disassembling and assembling method for internal components of semiconductor vacuum equipment Technical Field The invention relates to the technical field of semiconductor vacuum equipment, in particular to a device and a method for disassembling and assembling internal parts of semiconductor vacuum equipment. Background With the rapid development of the semiconductor industry, semiconductor vacuum equipment (such as etchers, PECVD, vacuum coating machines and ion implanters) is core equipment for chip manufacturing, and the connection precision and cleanliness of internal components (vacuum cavity flange and shaft sleeve, locating pins and cavities, electrodes and base, vacuum bearings and transmission shafts, sealing rings and cavities) directly determine the chip process precision and the equipment operation stability. The interference fit is used as a connection mode capable of meeting the requirements of high rigidity, high coaxiality and high tightness in the equipment, and the interference fit is a preferred assembly mode of a core component by virtue of the advantages of no clearance, vibration resistance and large driving torque, but the interference fit is extremely special in a semiconductor vacuum scene, so that the traditional assembly and disassembly technology and the traditional assembly and disassembly tool cannot be adapted at all, and the technical upgrading requirement is urgent. The existing tool has the defects of insufficient cleanliness and pollution control and serious particle pollution, the traditional tool adopts common carbon steel and plastic parts, the surface is easy to rust, abrade and fall off metal chips/plastic particles, and the mechanical knocking is easy to produce broken particles and damage the parts. Auxiliary media (such as heating oil and liquid nitrogen residues) used in the hot-filling/cold-filling process can be attached to the surface of the part, so that thorough cleaning is difficult, and the tightness of the part is affected. The portability is not enough, mostly fixed structure, and no modularized design can't split the adaptation. The Chinese patent document CN 100436038C discloses a device and a method for disassembling and assembling semiconductor vacuum pumping equipment, wherein the device comprises a supporting plate and ball support feet below the supporting plate, a plurality of air cylinders are arranged on the upper surface of the supporting plate, and the air cylinders are connected with the ball support feet through piston rods. The device realizes the disassembly and assembly of the disassembly and assembly vacuum equipment through vacuumizing, but the equipment cannot be used for the disassembly and assembly requirements of the vacuum cavity flange, the shaft sleeve, the positioning pin, the cavity, the electrode, the base, the vacuum bearing, the transmission shaft, the sealing ring, the cavity and other internal parts. Disclosure of Invention The invention aims to solve the problems that the semiconductor vacuum equipment is uneven in stress, difficult to disassemble, and easy to damage a cavity or a core component, and cannot adapt to the assembly requirements of high cleanliness and high reliability of the vacuum equipment, and the like, and provides the disassembly and assembly device for the internal components of the semiconductor vacuum equipment, which can realize stable and efficient installation and removal of interference fit components of the semiconductor vacuum equipment, is even in stress in the installation process, convenient to disassemble, can ensure that the cavity or the core component cannot be damaged, can adapt to the assembly requirements of high cleanliness and high reliability of the vacuum equipment, and effectively solves the problems of poor environmental adaptation of an electric tool and unstable lifting of a simple tool. The invention discloses a dismounting device for internal parts of semiconductor vacuum equipment, which adopts mirror polishing treatment and comprises a device shell, a transmission lifting mechanism in transmission connection with the device shell and a fixing mechanism in transmission connection with the transmission lifting mechanism, wherein a dismounting and replacement mounting head is arranged on the fixing mechanism, and a movable adjusting type clamping and positioning assembly is arranged on the device shell. This inside part dismouting device of semiconductor vacuum equipment, the metal part of dismouting device is 400# mirror finish except that the screw thread part guarantees the cleanliness factor, the device is whole to be applicable to the environment of Class 1 level clean room, drive the installation head on the fixed establishment through a drive elevating system and go up and down, thereby can realize steady efficient installation and the taking out to vacuum equipment interference fit part, joint locating component's setting has g