CN-121973372-A - Multistage light curing mechanism and equipment

CN121973372ACN 121973372 ACN121973372 ACN 121973372ACN-121973372-A

Abstract

The invention belongs to the technical field of curing mechanisms, and particularly relates to a multistage light curing mechanism and assembling equipment, wherein the multistage light curing mechanism comprises a rack; the device comprises a rack, a first-stage light curing mechanism arranged on the rack, a second-stage light curing mechanism arranged on the rack, a light intensity of the second-stage light curing mechanism larger than that of the first-stage light curing mechanism, and a first-stage light curing mechanism arranged on the rack, wherein the first-stage light curing mechanism is arranged on the rack, the first-stage light curing mechanism is used for transmitting the buckled first module and the second module to the first-stage light curing mechanism, and the second-stage light curing mechanism is arranged on the rack, and the light intensity of the second-stage light curing mechanism is larger than that of the first-stage light curing mechanism, and the first-stage light curing mechanism and the second-stage light curing mechanism are detached. The first-stage light curing mechanism and the second-stage light curing mechanism are sequentially adopted by the light curing mechanism to carry out light curing on the first module and the second module, and the overall light curing effect is good.

Inventors

ZHOU XIN
FU XIA
LIN WENLONG
LI RUOYANG
LIN WEISHUN
LUO XUEFENG

Assignees

深圳市久巨工业设备有限公司

Dates

Publication Date: 20260505
Application Date: 20260330

Claims (10)

1. A multi-stage light curing mechanism, comprising: A frame; A transfer assembly disposed on the frame; the first-stage light curing mechanism is arranged on the rack, and the transmission assembly transmits the buckled first module and second module to the first-stage light curing mechanism; The second-stage light curing mechanism is arranged on the rack, the light intensity of the second-stage light curing mechanism is larger than that of the first-stage light curing mechanism, and the transmission assembly transmits the detached first module and second module to the second-stage light curing mechanism.
2. The multi-stage light-curing mechanism of claim 1, wherein the first-stage light-curing mechanism comprises a first frame, a first heat sink, and a first light-emitting panel, the first heat sink and the first light-emitting panel are both disposed within the first frame, the first heat sink being disposed on a side of a non-light-emitting face of the first light-emitting panel.
3. The multi-stage light-curing mechanism of claim 2, wherein the first frame is provided with first heat-dissipating holes at corresponding positions of the first heat sink.
4. The multi-stage light-curing mechanism of claim 2, wherein the light-emitting surface of the first light-emitting panel is provided with a plurality of first beads in an array.
5. The multi-stage light-curing mechanism of claim 1, wherein the second-stage light-curing mechanism comprises a second frame, a second heat sink, and a second light-emitting panel, the second heat sink and the second light-emitting panel each disposed within the second frame, the second heat sink disposed on a side of a non-light-emitting face of the second light-emitting panel.
6. The multi-stage light curing mechanism of claim 5, wherein the second frame is provided with second heat dissipating holes at corresponding positions of the second heat sink.
7. The multi-stage light curing mechanism of claim 5, wherein the light emitting surface of the second light emitting panel is provided with a plurality of second light beads in an array.
8. The multi-stage light curing mechanism of claim 1, further comprising a third stage light curing mechanism disposed on the frame and positioned between the first stage light curing mechanism and the second stage light curing mechanism, the second stage light curing mechanism having a greater light intensity than the third stage light curing mechanism, the transfer assembly transferring the buckled first and second modules to the third stage light curing mechanism.
9. The multi-stage light-curing mechanism of claim 8, wherein the third stage light-curing mechanism comprises a third frame, a third heat sink, and a third light-emitting panel, the third heat sink and the third light-emitting panel each disposed within the third frame, the third heat sink disposed on a side of a non-light-emitting face of the third light-emitting panel.
10. An assembly apparatus comprising a multi-stage light curing mechanism according to any one of claims 1-9.

Description

Multistage light curing mechanism and equipment Technical Field The invention belongs to the technical field of curing mechanisms, and particularly relates to a multistage photo-curing mechanism and assembling equipment. Background The assembly equipment is special equipment for accurately integrating scattered parts, components or assemblies according to preset standards to finally form a complete finished product or a semi-finished product. The device is widely applied to various industries such as electronic appliances, automobile manufacturing, machining, medical appliances, 3C digital codes and the like, is small in precision assembly of mobile phone chips, and is large in module splicing of automobile bodies, and the body and the shadow of the automobile bodies are not separated. At present, a curing mechanism is often required to execute a curing process, but the curing effect of the curing mechanism is generally not ideal at present. Disclosure of Invention The invention provides a multistage light curing mechanism and assembly equipment, and aims to solve the technical problem that the curing effect of the existing curing mechanism is generally not ideal. The present invention is achieved by providing a multistage light curing mechanism comprising: A frame; A transfer assembly disposed on the frame; the first-stage light curing mechanism is arranged on the rack, and the transmission assembly transmits the buckled first module and second module to the first-stage light curing mechanism; The second-stage light curing mechanism is arranged on the rack, the light intensity of the second-stage light curing mechanism is larger than that of the first-stage light curing mechanism, and the transmission assembly transmits the detached first module and second module to the second-stage light curing mechanism. In some embodiments, the first stage light curing mechanism includes a first frame, a first heat sink, and a first light emitting panel, the first heat sink and the first light emitting panel are both disposed within the first frame, the first heat sink is disposed on a side of a non-light emitting face of the first light emitting panel. In some embodiments, the first frame is provided with first heat dissipating holes at corresponding positions of the first heat sink. In some embodiments, the light emitting surface of the first light emitting plate is provided with a plurality of first light beads in an array. In some embodiments, the second stage light curing mechanism includes a second frame, a second heat sink, and a second light emitting panel, the second heat sink and the second light emitting panel both disposed within the second frame, the second heat sink disposed on a side of the non-light emitting face of the second light emitting panel. In some embodiments, the second frame is provided with second heat dissipating holes at corresponding positions of the second heat sink. In some embodiments, the light emitting surface of the second light emitting plate is provided with a plurality of second light beads in an array. In some embodiments, the multi-stage light curing mechanism further comprises a third stage light curing mechanism disposed on the frame and positioned between the first stage light curing mechanism and the second stage light curing mechanism, the second stage light curing mechanism having a greater intensity than the third stage light curing mechanism, and the transfer assembly transfers the buckled first and second modules to the third stage light curing mechanism. In some embodiments, the third stage light curing mechanism includes a third frame, a third heat sink, and a third light emitting panel, the third heat sink and the third light emitting panel each being disposed within the third frame, the third heat sink being disposed on a side of a non-light emitting face of the third light emitting panel. The embodiment of the invention also provides an assembly device comprising the multi-stage light curing mechanism according to any one of the embodiments above. The beneficial effects achieved by the invention are as follows: the transmission component transmits the buckled first module and second module to the first-stage light curing mechanism, the first-stage light curing mechanism adopts weaker light intensity to carry out light curing on the first module and the second module, and then the transmission component transmits the disassembled first module and second module to the second-stage light curing mechanism, and the second-stage light curing mechanism adopts stronger light intensity to carry out light curing on the first module and the second module. The first-stage light curing mechanism and the second-stage light curing mechanism are sequentially adopted by the light curing mechanism to carry out light curing on the first module and the second module, and the overall light curing effect is good. Drawings FIG. 1 is a schematic view of an assembly apparatus provided by a