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CN-121973465-A - Processing technology of semiconductor composite film

CN121973465ACN 121973465 ACN121973465 ACN 121973465ACN-121973465-A

Abstract

The invention relates to the technical field of layered product processing and discloses a semiconductor composite film processing technology which comprises the following specific steps of S1, resin compounding ‌, mixing thermoplastic resin and thermosetting resin in an organic solvent to form glue solution with preset solid content, S2, base film processing ‌, base film compression and longitudinal extension are achieved through a pressing roller set and a stretching roller set in sequence, surface energy is improved to a preset range through online corona treatment in the stretching process, S3, multilayer coating ‌, solution is coated on the surface of an activated base film to form a wet film with preset thickness, S4, gradient heat curing ‌, solvent removal and curing of the coated composite film are achieved through a multi-stage temperature-zone oven in sequence, S5, finished product forming ‌ is achieved through cooling and winding after curing, and a finished product is manufactured. According to the scheme, when the photoelectric sensor fails, the material beyond the edge of the stretching roller is directly contacted with the trigger wheel, so that the base film is kept centered in the composite lamination process, and the processing quality of the composite film is improved.

Inventors

  • HU GAOSHANG
  • HU LING
  • ZHAO BOHUI

Assignees

  • 昆山金瑞安电子科技有限公司

Dates

Publication Date
20260505
Application Date
20260330

Claims (10)

  1. 1. The processing technology of the semiconductor composite film is characterized by comprising the following specific steps of: S1, resin compounding ‌, namely mixing thermoplastic resin and thermosetting resin in an organic solvent to form glue solution with preset solid content; s2, treating ‌ the base film, namely sequentially passing through a pressing roller set and a stretching roller set to realize thickness compression and longitudinal extension, and carrying out online corona treatment in the stretching process to improve the surface energy to a preset range; s3, coating ‌ a solution on the surface of the activated base film to form a wet film with a preset thickness; S4, gradient heat curing ‌, namely finishing solvent removal and curing of the coating base film through a multi-section temperature zone oven in sequence; S5, forming ‌ of a finished product, cooling and rolling after solidification, and obtaining the finished product.
  2. 2. The semiconductor composite film processing technology according to claim 1, wherein in the processing of S2-S5, a base film material is subjected to centering adjustment through a composite film centering roller set for a plurality of times, the composite film centering roller set comprises a frame (10) and a stretching shaft (101) rotatably arranged between the frames (10), the stretching shaft (101) is rotatably provided with a stretching roller (102), a guiding roller I (103) and a guiding roller II (104) are rotatably arranged between the frames (10), one side of the guiding roller I (103) and one side of the guiding roller II (104) are movably provided with a regulating roller (105), the inner side of the regulating roller (105) is rotatably provided with a threaded shaft (106), the stretching shaft (101) is rotatably provided with two triggering wheels (107), the two triggering wheels (107) are respectively arranged on two sides of the stretching roller (102), and when the two triggering wheels (107) are rotatably connected with the threaded shaft (106), the threaded shaft (106) is rotatably displaced in a transverse direction.
  3. 3. The semiconductor composite film processing technology according to claim 2, wherein the two trigger wheels (107) are in clearance fit with the pulling roller (102), the two trigger wheels (107) are connected with the rotating drums (108), a first composite film adjusting mechanism and a second composite film adjusting mechanism are respectively arranged on the two rotating drums (108), the first composite film adjusting mechanism and the second composite film adjusting mechanism respectively comprise a first transmission shaft (109) and a second transmission shaft (110) which are rotatably arranged on the inner side of the frame (10), belt pulleys (111) are fixedly arranged at two ends of the threaded shaft (106) and at the end parts of the first transmission shaft (109) and the second transmission shaft (110), and a transmission belt (112) is sleeved between the first transmission shaft (109), the second transmission shaft (110) and the belt pulleys (111) at the corresponding end parts of the threaded shaft (106).
  4. 4. A semiconductor composite film processing technology according to claim 3, wherein a first gear (113) is fixedly arranged on a rotary drum (108) of the first composite film adjusting mechanism, a second gear (114) is fixedly arranged on a first transmission shaft (109), the first gear (113) is meshed with the second gear (114), driving wheels (115) are arranged on the rotary drum (108) and the second transmission shaft (110) of the second composite film adjusting mechanism, and a driving belt (116) is sleeved between the two driving wheels (115) together.
  5. 5. The process for manufacturing the semiconductor composite film according to claim 2, wherein the adjusting roller (105) is a hollow roller, threaded cylinders (117) are rotatably mounted at two ends of the inner side of the adjusting roller (105), supporting rings (118) are fixedly mounted at the ends, far away from each other, of the threaded cylinders (117), sliding rails (119) are fixedly mounted at the inner side of the frame (10), clamping bases (120) are fixedly mounted at the bottoms of the supporting rings (118), and the clamping bases (120) are in sliding clamping with the sliding rails (119).
  6. 6. A semiconductor composite film processing technology according to claim 3 is characterized in that a vertical plate (201) is fixedly arranged on the inner side of a frame (10), a bearing seat (202) is rotatably arranged at the end part of a belt pulley (111) at two ends of a threaded shaft (106), an arc-shaped through groove (203) is formed in the vertical plate (201), one end of the bearing seat (202) penetrates through the arc-shaped through groove (203) and is in sliding clamping, a steel cable (204) is fixedly connected to the bottom of the bearing seat (202), an initial column (205) is fixedly arranged on the inner wall of the frame (10), the other end of the steel cable (204) is fixedly arranged on the initial column (205), and a half-arc pressing bar (206) is fixedly arranged on the side surface of a rotary drum (108).
  7. 7. A process for manufacturing a semiconductor composite film according to claim 6, wherein a supporting rod (207) is fixedly installed on the inner side of the frame (10), a guide wheel (208) is rotatably installed on the supporting rod (207), the middle portion of the steel cable (204) passes through the guide wheel (208), and the portion of the steel cable (204) located between the initial column (205) and the guide wheel (208) is in intermittent contact with the half-arc pressing strip (206).
  8. 8. The semiconductor composite film processing technology according to claim 6, wherein a guide rod (209) is fixedly arranged on the side portion of the vertical plate (201), the steel cable (204) is in sliding fit with the guide rod (209), a magnetic suction plate (210) is fixedly arranged on the side wall of the vertical plate (201), a magnet is arranged in the bearing seat (202), the magnetic suction plate (210) is magnetically attracted with the magnet, a top plate (211) is fixedly arranged on the top of the vertical plate (201), a tension spring (212) is connected between the top plate (211) and the bearing seat (202), when the rotary drum (108) rotates, the half-arc pressing bar (206) presses down the steel cable (204), and the bearing seat (202) moves downwards and is separated from the magnetic suction plate (210).
  9. 9. The semiconductor composite film processing technology according to claim 8, wherein a fixed arm (301) is fixedly installed on the inner side of the frame (10), the fixed arm (301) is an L-shaped supporting arm, a movable arm (302) is inserted into the bottom end of the fixed arm (301), a return spring is connected between the fixed arm (301) and the movable arm (302), a pressing contact plate (303) is fixedly installed at the bottom end of the movable arm (302), the pressing contact plate (303) is an arc plate with a plurality of round rollers installed on the bottom wall in a rotating mode, a fixed column (304) is fixedly installed on the inner wall of the frame (10), a fixed rotating wheel (305) is installed on the fixed column (304) in a rotating mode, a spiral cam (306) is fixedly installed at one end of the fixed rotating wheel (305), and the origin of the spiral cam (306) is overlapped with the axis of the fixed rotating wheel (305).
  10. 10. The process for manufacturing the semiconductor composite film according to claim 9, wherein an elongated cable (307) is fixedly connected to the top of the bearing seat (202), a through hole (2111) is formed in the top plate (211), the elongated cable (307) penetrates through the through hole (2111), the other end of the elongated cable (307) is wound on the surface of the fixed rotating wheel (305), and a spiral spring (308) is installed between the fixed rotating wheel (305) and the fixed column (304) in a clamping mode.

Description

Processing technology of semiconductor composite film Technical Field The invention relates to the technical field of layered product processing, in particular to a processing technology of a semiconductor composite film. Background In the related art, a compounding process is needed when the semiconductor composite film is processed, and the polyimide adhesive tape and the like composite film are required to be subjected to dry compounding, wherein the key steps of the method involve the steps of removing a solvent in an adhesive through heating and drying, and then compounding. The basic principle is that a layer of solvent type or aqueous polyurethane adhesive is coated on the printing surface of a substrate (such as a film), and then immediately passes through a drying channel, and the solvent in the adhesive is thoroughly evaporated by hot air, so that only a dry adhesive layer with viscosity is left. And then bonding the composite sheet and another substrate together under the pressure of a heated composite roller, and curing the composite sheet through a curing chamber to finally form a firm multilayer composite lamellar product. In the dry type composite process of the polyimide adhesive tape, the composite film layer-by-layer centering of the film material is a core pre-process for guaranteeing the processing precision of the subsequent coating and pressing processes. The transverse stress balance in the width direction of the film material is broken, and the reference precision of the conveying path is invalid, so that the actual running center line of the film material is deviated from the design reference center line of the production line, which is a core factor affecting the coating and pressing precision. The existing composite film centering scheme in the industry is mainly dependent on a photoelectric sensor and an electric control servo system, has obvious limitation on processing of polyimide adhesive tapes, and has the defects that the detection accuracy of the photoelectric sensor is insufficient for transparent or semitransparent polyimide adhesive tapes, if the detection errors can not timely perform composite film centering or trigger the wrong composite film centering action, the adhesive tapes are offset to be aggravated, so that the processing technology of the semiconductor composite film is provided. Disclosure of Invention The invention provides a semiconductor composite film processing technology which can solve the problems that in the prior art, the detection precision of a pure photoelectric sensor is insufficient, if a detection error happens, the composite film centering or the false triggering of the composite film centering action cannot be performed in time, and the offset of an adhesive tape is aggravated. In order to achieve the above purpose, the present solution provides a semiconductor composite film processing technology, which comprises the following specific steps: S1, resin compounding ‌, namely mixing thermoplastic resin and thermosetting resin in an organic solvent to form glue solution with preset solid content; s2, treating ‌ the base film, namely sequentially passing through a pressing roller set and a stretching roller set to realize thickness compression and longitudinal extension, and carrying out online corona treatment in the stretching process to improve the surface energy to a preset range; s3, coating ‌ a solution on the surface of the activated base film to form a wet film with a preset thickness; s4, gradient heat curing ‌, namely finishing solvent removal and curing of the coated composite film through a multi-section temperature zone oven in sequence; S5, forming ‌ of a finished product, cooling and rolling after solidification, and obtaining the finished product. Optionally, in the processing of S2-S5, the base film material is many times through compound membrane centering roller group centering adjustment, compound membrane centering roller group includes the frame and rotates and install stretching the axle between the frame, stretch and pull the epaxial rotation and install and stretch the roller, still rotate and install guide roller one and guide roller two between the frame, guide roller one and guide roller two are set up in groups, stretch one side activity that the roller kept away from guide roller one and be provided with the regulating roll, the regulating roll inboard rotates and is provided with the screw thread axle, stretch and pull epaxial rotation and install two trigger wheels, two trigger wheels are located respectively stretch the both sides of roller to two trigger wheels with screw thread axle transmission is connected, arbitrary when the trigger wheel rotates, screw thread axle takes place to rotate, realizes the lateral displacement of regulating roll. Optionally, two trigger wheel all with stretch the pull roll clearance fit, two trigger wheel all are connected with the rotary drum, two be provided with first comple