Search

CN-121973546-A - Badge heat transfer printing die and die assembly

CN121973546ACN 121973546 ACN121973546 ACN 121973546ACN-121973546-A

Abstract

The application belongs to the technical field of vacuum heat transfer printing equipment, in particular to a badge heat transfer printing mould and a mould assembly, wherein the badge heat transfer printing mould forms an integrated gas circuit between a mounting base and a mould table while matching the positioning bulge with a positioning hole by constructing an assembly groove at the proximal end of the mould table and constructing a positioning bulge and a gas guide groove at the lower side of the distal end, the application is used for supplying gas to flow so as to adsorb the transfer film on the surface of the badge through the integrated gas circuit when the air is exhausted, and the arrangement mode of the application not only can be used for installing and positioning the moulding platform, but also can make the positioning hole be used as a gas circuit communicated with the lower side of the substrate, and has dual purposes, good concealment and better aesthetic property of the badge heat transfer mould assembly. Compared with the existing processing mode of the badge surface layer pattern, the die and the die assembly provided by the application are applied to a vacuum thermal transfer printer, and the transfer film is attached to the badge surface by vacuumizing to realize the thermal transfer of elements, so that the existing processing mode of the badge surface layer pattern is changed.

Inventors

  • AI MIN
  • HUANG WENXIONG

Assignees

  • 湖南肆玖科技股份有限公司

Dates

Publication Date
20260505
Application Date
20260313
Priority Date
20250425

Claims (10)

  1. 1. Badge thermal transfer mold, said badge comprising a printing portion (b 1) and a fixing assembly (b 2), characterized in that the badge thermal transfer mold comprises: A die table (9 ') for mounting and supporting on a mounting base (81), the die table (9') having a proximal end (91) and a distal end (92) disposed opposite each other, the underside of the distal end (92) being configured with one or more positioning projections (9.81), the mounting base (81) being configured with positioning holes (9.80) corresponding to the positioning projections (9.81), the one or more positioning projections (9.81) being detachably engaged with the corresponding positioning holes (9.80); a support (90) configured at a proximal end (91) of the die table (9') for supporting the printing portion (b 1); a loading slot (900) configured on the support portion (90) for accommodating the fixing assembly; -an air duct (10) configured at the underside of said distal end (92) and communicating with said loading slot (900), said loading slot (900) communicating with at least said positioning hole (9.80) through said air duct (10) in response to the cooperation of said positioning protrusion (9.81) with said positioning hole (9.80).
  2. 2. Badge heat transfer die according to claim 1, characterized in that the outer edge ring of the support part (90) is provided with a downwardly sloping or downwardly curved sloping part (9 a).
  3. 3. Badge heat transfer die according to claim 1, wherein the positioning projections (9.81) and the positioning holes (9.80) are configured with two sets, the loading slot (900) being arranged between the two sets of positioning holes (9.80); and/or the mould table (9') is made of a heat conducting material.
  4. 4. The badge thermal transfer mold according to claim 1, wherein the loading groove (900) is recessed downward, a first air flow passage (901) is configured at the lower side of the distal end (92) of the mold stage (9'), and the loading groove (900) communicates with the air guide groove (10) through the first air flow passage (901).
  5. 5. Badge heat transfer die according to claim 1, wherein the loading slot (900) extends through the upper and lower surface of the die table (9') and communicates with the air guide slot (10).
  6. 6. The badge thermal transfer mold according to claim 1, wherein the loading groove (900) is recessed downward, a second air flow passage (904) is provided at a side portion of the mold table (9 '), the loading groove (900) communicates with a side surface of the mold table (9 ') through the second air flow passage (904), one end of the second air flow passage (904) communicates with the loading groove (900), and the other end extends to a side of the side surface of the mold table (9 ') near a lower surface thereof, and an extraction opening (901 ') is formed through the lower surface of the mold table (9 ').
  7. 7. Badge thermal transfer mould according to any of claims 1 to 6, characterised in that the air guide groove (10) communicates with the side of the mould table (9').
  8. 8. The badge thermal transfer mold according to claim 7, wherein two or more air guide grooves (10) are provided, and at least one end of at least part of the air guide grooves (10) communicates with the loading groove (900) and the other end extends to the side face of the mold table (9').
  9. 9. The badge thermal transfer mold according to claim 7, wherein the air guide groove (10) is provided with two or more, at least part of the periphery of the positioning protrusion (9.80) is provided with an annular channel (101), at least part of the air guide groove (10) has one end communicated with the loading groove (900) and the other end communicated with the annular channel (101) and then extends to the side face of the mold table (9').
  10. 10. Badge heat transfer printing mould assembly, its characterized in that includes: one or more badge thermal transfer molds according to any one of claims 1 to 9; The base plate (8) is provided with one or more positioning holes (9.80), the mounting base (81) is formed at the periphery of the positioning holes (9.80), the positioning holes (9.80) are communicated with the lower side of the base plate (8), the distal ends (92) of one or more badge thermal transfer printing dies are detachably supported on the mounting base (81) through the matching of the positioning protrusions (9.81) and the positioning holes (9.80), and the air guide grooves (10) are communicated with the lower side of the base plate (8) and the loading grooves (900) through gaps between the positioning protrusions (9.81) and the corresponding positioning holes (9.80).

Description

Badge heat transfer printing die and die assembly Cross Reference to Related Applications The present application claims priority to chinese application number CN 2025109509890, filed on 7.9 of 2025, entitled "badge heat transfer die assembly, die, heat transfer machine and method", and to chinese application number CN2025105397311, entitled "vacuum heat transfer machine, die and its suit, wiring mechanism, mask and method", filed on 25 of 2025, the disclosure of which is regarded as part of the present disclosure and is incorporated herein by reference in its entirety. Technical Field The application belongs to the technical field of vacuum thermal transfer printing equipment, and particularly relates to a badge thermal transfer printing die and a die assembly. Background This section provides background information related to the present application and is not necessarily prior art. The surface pattern of the prior art badge is generally formed by placing the badge main body on the lower die of a film pressing machine, covering the front surface of the badge main body with the surface layer printed with the pattern, and then folding and clamping the edge of the surface layer towards the back surface of the badge main body by the pressure applied by the upper die, so that the surface layer is fixed on the front surface of the badge main body to present different patterns. Disclosure of Invention An object of the present application is to provide a thermal transfer mold for a badge which can support the badge so that it can be used for vacuum thermal transfer printing, wherein a transfer film is attached to the front surface of the badge by vacuum suction, and the elements of the transfer film are transferred to the surface of the badge by heating, so that the elements on the surface of the badge are tightly bonded to the badge, and the badge is not easily bound. In order to solve the technical problems, the application adopts the following technical scheme: the badge thermal transfer printing die comprises a printing part and a fixing assembly, the badge thermal transfer printing die comprises a die table, a supporting part, a loading groove and an air guide groove, the die table is used for being installed and supported on a mounting base part, the die table is provided with a proximal end and a distal end which are oppositely arranged, one or more positioning protrusions are formed on the lower side of the distal end, the mounting base part is provided with positioning holes corresponding to the positioning protrusions, the one or more positioning protrusions are detachably matched with the corresponding positioning holes, the loading groove is formed on the supporting part and used for accommodating the fixing assembly, the air guide groove is formed on the lower side of the distal end and is communicated with the loading groove, and the loading groove is at least communicated with the positioning holes through the air guide groove in response to the matching of the positioning protrusions and the positioning holes. The badge thermal transfer printing die provided by the application has the advantages that the assembly groove is formed at the proximal end of the die table, the positioning bulge and the air guide groove are formed at the lower side of the distal end, the integrated air passage is formed between the mounting base part and the die table for air to flow when the positioning bulge is matched with the positioning hole, so that the transfer printing film is adsorbed on the surface of the badge through the integrated air passage when air is pumped. Compared with the existing processing mode of the badge surface layer pattern, the die provided by the application is applied to a vacuum thermal transfer printer, the transfer film is attached to the front surface of the badge through vacuumizing, and elements of the thermal transfer film are transferred to the surface of the badge through heating, so that the connection strength between the badge surface layer elements and the badge surface is enhanced, the processing mode of the existing badge surface layer pattern is changed, the defect that edges of the badge surface layer pattern are raised is avoided, the service life of the badge is prolonged, and the badge surface layer pattern and the badge are connected more tightly and more attractive and reliable. Furthermore, the outer edge ring of the supporting part is provided with a downward-inclined or downward-bent inclined part, and the inclined part can keep away the outer edge of the bottom surface of the badge, so that the film material can enter the inclined part to cover the outer edge surface of the bottom surface of the badge under the negative pressure state. Further, the positioning protrusion and the positioning hole are provided with two groups, the loading groove is arranged between the two groups of positioning holes, and the orientation of the die relative to the mounting base can b