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CN-121973996-A - Vacuum packaging equipment and packaging method for semiconductor chip

CN121973996ACN 121973996 ACN121973996 ACN 121973996ACN-121973996-A

Abstract

The invention relates to the technical field of vacuum packaging, in particular to vacuum packaging equipment for a semiconductor chip, which is characterized by comprising a vacuum packaging assembly and a frame, wherein the vacuum packaging assembly is arranged above the frame and comprises a lifting mechanism, a vacuum bin and a heating sealing piece, the heating sealing piece is arranged below the vacuum bin, the bottom surface of the vacuum bin is arranged in an openable state, the vacuum bin is arranged at the bottom of the lifting mechanism, and the lifting mechanism drives the vacuum bin to move.

Inventors

  • LIU HONGMEI
  • FENG LIXIA

Assignees

  • 深圳德芯微电股份有限公司

Dates

Publication Date
20260505
Application Date
20260407

Claims (10)

  1. 1. A vacuum packaging apparatus for semiconductor chips is characterized by comprising The vacuum packaging assembly (2) and the frame (1), wherein the vacuum packaging assembly (2) is arranged above the frame (1) and comprises a lifting mechanism (12), a vacuum bin (13) and a heating sealing piece (56), the heating sealing piece (56) is arranged below the vacuum bin (13), the bottom surface of the vacuum bin (13) is arranged in an openable state, the vacuum bin (13) is connected with a vacuum pump (6), the vacuum bin (13) is arranged at the bottom of the lifting mechanism (12), the lifting mechanism (12) drives the vacuum bin (13) to move, and a control system (5) arranged on the frame (1) controls the equipment to work; two sets of circulation driving assemblies (4) are respectively arranged at two long edges of the frame (1), each set of circulation driving assembly (4) comprises a chain (29) and chain wheels (30) meshed with the inner side of the chain (29), the chain wheels (30) are stably arranged on the frame (1) through 匚 frames (31), and the central shaft of the chain wheel (30) positioned at the end part of the chain (29) is connected with a driving motor (7); the device comprises a plurality of sets of parallel supporting components (3), wherein the supporting components (3) are detachably supported on two sets of circulating driving components (4), each set of supporting components (3) comprises a placing frame (38), two limiting plates (40), two connecting pieces (41) and a plurality of sets of adjusting plate groups (39), the placing frame (38) is connected with the two limiting plates (40) through the adjusting plate groups (39), the end parts of the two limiting plates (40) are connected to the same connecting piece (41), and the connecting piece (41) is connected with the circulating driving components (4).
  2. 2. The vacuum packaging device of a semiconductor chip according to claim 1, wherein the frame (1) comprises two transverse pipes (11), two vertical pipes (10) and a plurality of supporting legs (8), the supporting legs (8) are equally arranged below the two transverse pipes (11), the two vertical pipes (10) are respectively arranged on one sides, away from each other, of the two transverse pipes (11), the end parts of the vacuum packaging assembly (2) are connected with the two vertical pipes (10), and the two circulating driving assemblies (4) are respectively arranged on the two transverse pipes (11).
  3. 3. The vacuum packaging device of a semiconductor chip according to claim 2, wherein the lifting mechanism (12) comprises a first telescopic cylinder (14), support plates (15) and lifting plates (16) which are distributed up and down, end pipes (17) are fixedly arranged at the ends of the support plates (15) and the lifting plates (16), the end pipes (17) of the support plates (15) are fixedly connected with the top of the vertical pipe (10), the end pipes (17) of the lifting plates (16) are slidably sleeved on the vertical pipe (10), the first telescopic cylinder (14) is inversely installed on the support plates (15), and telescopic ends of the first telescopic cylinder are connected with the lifting plates (16).
  4. 4. The vacuum packaging device of a semiconductor chip according to claim 1, wherein the vacuum bin (13) comprises a bin body (18), a movable plate (19) and a second telescopic cylinder (21), the bottom of the bin body (18) is provided with an opening, the top of the bin body is detachably connected with a lifting plate (16), a vacuum gauge (20) and an air pipe are further arranged on the bin body (18), the movable plate (19) is mounted at the opening of the bin body (18) in a sealing sliding manner, the second telescopic cylinder (21) is mounted at the end of the bin body (18), the second telescopic cylinder (21) controls the movable plate (19) to move, a pushing plate (55) is arranged below the movable plate (19), a third telescopic cylinder (53) is arranged on the side edge of the pushing plate (55), the third telescopic cylinder (53) is connected with the movable plate (19), a column (54) below the movable plate (19) is located in a buckling groove of the pushing plate (55), and the buckling angle is larger than the circle center arc of the buckling groove is 180 degrees and is mounted on the pushing plate (55).
  5. 5. The vacuum packaging device of a semiconductor chip according to claim 4, wherein a clamping groove (22) is formed in the edge of an opening of the bin body (18), a clamping plate (23) is fixedly arranged above the movable plate (19), the clamping plate (23) penetrates through the clamping groove (22), inclined connecting plates (27) are rotatably arranged at the end parts of the movable plate (19), driving plates (26) are connected to the bottoms of the two inclined connecting plates (27), the driving plates (26) are connected with the telescopic ends of the second telescopic cylinders (21), side plates (24) are arranged at the end parts, close to each other, of the two movable plates (19), and sealing rubber strips (25) are arranged at one sides, close to each other, of the two side plates (24).
  6. 6. The vacuum packaging device of a semiconductor chip according to claim 2, wherein a fixing arc plate (32) is arranged at the top of the 匚 frame (31), a clamping arc plate (33) is detachably arranged above the fixing arc plate (32), a central shaft of the chain wheel (30) penetrates through a space formed by the fixing arc plate (32) and the clamping arc plate (33) through bearing connection, a square rod (34) is fixedly arranged at the bottom of the 匚 frame (31), a stud (35) is fixedly arranged below the square rod (34), a square hole (9) is formed in the transverse tube (11), and the square rod (34) penetrates through the square hole (9).
  7. 7. A vacuum packaging apparatus for semiconductor chips as defined in claim 1, wherein a plurality of holders (28) are provided on the chain (29), an ear plate (36) is fixedly provided at an end corner below the holders (28), the ear plate (36) is detachably connected to the chain (29), a holding groove (37) is provided on the holders (28), an end of the connecting member (41) is fixedly provided with an end post (46), and the end post (46) extends into the holding groove (37).
  8. 8. The vacuum packaging device of a semiconductor chip according to claim 1, wherein two sliding grooves (48) are symmetrically formed in end faces, close to each other, of the two connecting pieces (41), two bidirectional threaded rods (47) are arranged at the positions of the two sliding grooves (48) in a crossing mode, end plates (45) are fixedly arranged at the ends of the limiting plates (40), the end plates (45) extend into the sliding grooves (48), the bidirectional threaded rods (47) penetrate through the end plates (45) in a threaded mode, sliding clamping grooves (43) are formed in side walls, close to each other, of the two limiting plates (40), an inlet groove (42) and an outlet groove (42) are formed in a communicating mode above the sliding clamping grooves (43), and dumbbell rods (44) are arranged at the sliding clamping grooves (43) in a sliding mode.
  9. 9. The vacuum packaging device of a semiconductor chip according to claim 1, wherein the adjusting plate group (39) comprises a Chinese character 'ri' shaped frame (49) and four sliding plates (51) which are two groups, inserting grooves (50) are formed in two edges of the Chinese character 'ri' shaped frame (49), bolts are arranged at two ends of the inserting grooves (50) in a penetrating mode, one ends, close to each other, of the two sliding plates (51) in the same group extend into the same inserting groove (50), and the bolts penetrate through a certain connecting hole (52) of the sliding plates (51).
  10. 10. A vacuum packaging method of a semiconductor chip, applied to the vacuum packaging apparatus of a semiconductor chip as claimed in claim 1, characterized in that: step 1, loading operation, namely placing a plurality of sealing bags filled with semiconductor chips into a placing frame (38) of a supporting component (3) with openings upwards, placing dumbbell rods (44) into a sliding clamping groove (43) from an inlet and outlet groove (42) of a limiting plate (40) and sliding the dumbbell rods to the side edges of the sealing bags, and pressing and fixing the sealing bags to prevent displacement; Step2, material conveying, namely driving a chain (29) of the circulating driving assembly (4) to move by a driving motor (7), conveying a supporting assembly (3) carrying a sealing bag to the position right below the vacuum packaging assembly (2), and controlling the chain (29) to pause moving by a control system (5); Step 3, vacuum sealing, namely extending a first telescopic cylinder (14) of a lifting mechanism (12), driving a vacuum bin (13) to descend to the top of a movable plate (19) attached supporting component (3), enabling a sealing bag to extend into the vacuum bin (13), enabling a second telescopic cylinder (21) to drive two movable plates (19) of the vacuum bin (13) to be closed through a driving plate (26) and a diagonal connecting plate (27), enabling sealing rubber strips (25) between the movable plates (19) to attach to form a sealing cavity, starting a vacuum pump (6) to pump air in the sealing cavity and the sealing bag, and monitoring in real time through a vacuum gauge (20) on the vacuum bin (13), and keeping the pressure maintaining time for 3-5 s after the preset vacuum degree is reached; Step 4, heating and sealing, namely controlling the heating sealing piece (56) to rise to a set temperature, enabling the third telescopic cylinder (53) to extend to drive the push plate (55) to drive the heating sealing piece (56) to be attached to the opening of the sealing bag, keeping the set sealing time to finish the hot melting sealing of the sealing bag, and cooling the heating sealing piece (56) after the sealing is finished, and enabling the third telescopic cylinder (53) to shrink and reset; And 5, blanking operation, namely stopping working of the vacuum pump (6), controlling the two movable plates (19) to be opened for pressure relief, enabling the first telescopic cylinder (14) to shrink and drive the vacuum bin (13) to ascend and reset, restarting the driving motor (7) to drive the chain (29) to continue moving, conveying the packaged chips to a blanking station, and taking down the supporting component (3).

Description

Vacuum packaging equipment and packaging method for semiconductor chip Technical Field The invention relates to the technical field of vacuum packaging, in particular to vacuum packaging equipment and a vacuum packaging method for a semiconductor chip. Background In the end process of semiconductor chip production, it is often necessary to place the chip in a sealed bag, and then vacuum-seal the sealed bag. The process is a key link for guaranteeing the delivery quality of the semiconductor chip, prolonging the storage life and the use reliability of the chip, and has the core purposes of thoroughly isolating air, water vapor and various impurity molecules in a sealing bag through vacuumizing sealing, avoiding oxidization and corrosion of core components such as a silicon substrate, a metal lead and the like of the chip, simultaneously preventing damage to a precise structure of the chip caused by external vibration and impact, ensuring that the chip always maintains stable electrical performance and structural integrity in the storage, transportation and subsequent assembly processes, meeting the severe requirements of the semiconductor chip on the storage environment, and being particularly suitable for application scenes with extremely high requirements on the chip reliability, such as aerospace, automotive electronics, high-end consumer electronics and the like. In the prior art, the vacuum sealing packaging process of chips still mainly depends on manual operation to finish, and the specific operation flow is that a worker firstly puts the chips which are finished in production and detected into special dampproof sealing bags one by one, manually tidies the openings of the sealing bags, then puts the openings of the sealing bags into a sealing station of vacuum packaging equipment, starts the equipment to finish vacuumizing and sealing operation, manually takes out the packaged chips after the packaging of single-bag chips is finished, and repeatedly processes the next bag of chips. Specifically, the manual one-by-one processing mode is limited by the operation speed, the operation proficiency and the labor intensity of workers, and each time the vacuum sealing of a bag of chips is completed, the complete flow of chip placing, bag sealing, station placing, equipment starting and finished product taking out is required to be carried out, the single operation period is longer, the assembly line rhythm of large-scale chip production is difficult to adapt, and especially in the scene of the rapid increase of the chip yield, the efficiency bottleneck of manual operation is more obvious, the delivery efficiency of the whole chip production link is directly restricted, and the production period and the manufacturing cost are increased. The existing method of manually completing vacuum sealing one by one cannot meet the strict requirements of industry on control of packaging efficiency, packaging quality and production cost, so that equipment capable of replacing manual operation and realizing automatic completion of vacuum sealing packaging of chips is developed, and the technical problems of efficiency bottleneck and quality defect in the prior art are solved, which are to be urgently solved in the current semiconductor chip production field. Disclosure of Invention The invention aims to provide vacuum packaging equipment and a packaging method for semiconductor chips, which are used for solving the problem that the vacuum sealing treatment of the semiconductor chips is finished one by relying on manpower in the background technology. In order to achieve the above object, the present invention provides a vacuum packaging apparatus for semiconductor chips, The vacuum packaging assembly is arranged above the frame and comprises a lifting mechanism, a vacuum bin and a heating sealing piece, wherein the heating sealing piece is arranged below the vacuum bin, and the bottom surface of the vacuum bin is arranged in an openable state; Two sets of circulating driving assemblies are respectively arranged at two long edges of the frame, each set of circulating driving assembly comprises a chain and a chain wheel meshed with the chain, the chain wheel is stably arranged on the frame through 匚 frames, and a chain wheel central shaft positioned at the end part of the chain is connected with a driving motor; The device comprises a plurality of sets of parallel supporting components, wherein the supporting components are detachably supported on two sets of circulating driving components, each set of supporting components comprises a placing frame, two limiting plates, two connecting pieces and a plurality of sets of adjusting plate groups, the placing frame is connected with the two limiting plates through the adjusting plate groups, the end parts of the two limiting plates are connected to the same connecting piece, and the connecting pieces are connected with the circulating driving components. Further, the frame compris